JPS57187963A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS57187963A
JPS57187963A JP56072502A JP7250281A JPS57187963A JP S57187963 A JPS57187963 A JP S57187963A JP 56072502 A JP56072502 A JP 56072502A JP 7250281 A JP7250281 A JP 7250281A JP S57187963 A JPS57187963 A JP S57187963A
Authority
JP
Japan
Prior art keywords
film
contact part
metal
contact
polycrystal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56072502A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6335109B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
Masahiko Nakamae
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP56072502A priority Critical patent/JPS57187963A/ja
Publication of JPS57187963A publication Critical patent/JPS57187963A/ja
Publication of JPS6335109B2 publication Critical patent/JPS6335109B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/60Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D10/00 or H10D18/00, e.g. integration of BJTs
    • H10D84/611Combinations of BJTs and one or more of diodes, resistors or capacitors
    • H10D84/613Combinations of vertical BJTs and one or more of diodes, resistors or capacitors
    • H10D84/617Combinations of vertical BJTs and only diodes

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Bipolar Transistors (AREA)
  • Bipolar Integrated Circuits (AREA)
JP56072502A 1981-05-14 1981-05-14 Manufacture of semiconductor device Granted JPS57187963A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56072502A JPS57187963A (en) 1981-05-14 1981-05-14 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56072502A JPS57187963A (en) 1981-05-14 1981-05-14 Manufacture of semiconductor device

Publications (2)

Publication Number Publication Date
JPS57187963A true JPS57187963A (en) 1982-11-18
JPS6335109B2 JPS6335109B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1988-07-13

Family

ID=13491171

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56072502A Granted JPS57187963A (en) 1981-05-14 1981-05-14 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS57187963A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59111375A (ja) * 1982-12-08 1984-06-27 エヌ・ベ−・フイリップス・フル−イランペンファブリケン 半導体デバイスおよびその製造方法
JPS59121872A (ja) * 1982-12-15 1984-07-14 Fujitsu Ltd 半導体装置
JPS59161060A (ja) * 1982-12-20 1984-09-11 レイセオン カンパニ− 半導体デバイスの製造方法
JPS63257269A (ja) * 1987-04-14 1988-10-25 Fujitsu Ltd 半導体装置のコンタクト形成方法
JPH02125463A (ja) * 1988-11-04 1990-05-14 Hitachi Ltd 半導体装置の製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5177076A (en) * 1974-12-27 1976-07-03 Fujitsu Ltd Handotaisochinoseizohoho

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5177076A (en) * 1974-12-27 1976-07-03 Fujitsu Ltd Handotaisochinoseizohoho

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59111375A (ja) * 1982-12-08 1984-06-27 エヌ・ベ−・フイリップス・フル−イランペンファブリケン 半導体デバイスおよびその製造方法
JPS59121872A (ja) * 1982-12-15 1984-07-14 Fujitsu Ltd 半導体装置
JPS59161060A (ja) * 1982-12-20 1984-09-11 レイセオン カンパニ− 半導体デバイスの製造方法
JPS63257269A (ja) * 1987-04-14 1988-10-25 Fujitsu Ltd 半導体装置のコンタクト形成方法
JPH02125463A (ja) * 1988-11-04 1990-05-14 Hitachi Ltd 半導体装置の製造方法

Also Published As

Publication number Publication date
JPS6335109B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1988-07-13

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