JPS57167651A - Inspecting device for surface of semiconductor wafer - Google Patents

Inspecting device for surface of semiconductor wafer

Info

Publication number
JPS57167651A
JPS57167651A JP5346981A JP5346981A JPS57167651A JP S57167651 A JPS57167651 A JP S57167651A JP 5346981 A JP5346981 A JP 5346981A JP 5346981 A JP5346981 A JP 5346981A JP S57167651 A JPS57167651 A JP S57167651A
Authority
JP
Japan
Prior art keywords
magnification lens
inspecting
semiconductor wafer
inspecting position
visual field
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5346981A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0324064B2 (enrdf_load_stackoverflow
Inventor
Hitoshi Tanaka
Yoji Hirata
Shuji Mizuno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP5346981A priority Critical patent/JPS57167651A/ja
Publication of JPS57167651A publication Critical patent/JPS57167651A/ja
Publication of JPH0324064B2 publication Critical patent/JPH0324064B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP5346981A 1981-04-07 1981-04-07 Inspecting device for surface of semiconductor wafer Granted JPS57167651A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5346981A JPS57167651A (en) 1981-04-07 1981-04-07 Inspecting device for surface of semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5346981A JPS57167651A (en) 1981-04-07 1981-04-07 Inspecting device for surface of semiconductor wafer

Publications (2)

Publication Number Publication Date
JPS57167651A true JPS57167651A (en) 1982-10-15
JPH0324064B2 JPH0324064B2 (enrdf_load_stackoverflow) 1991-04-02

Family

ID=12943709

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5346981A Granted JPS57167651A (en) 1981-04-07 1981-04-07 Inspecting device for surface of semiconductor wafer

Country Status (1)

Country Link
JP (1) JPS57167651A (enrdf_load_stackoverflow)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5919344A (ja) * 1982-07-23 1984-01-31 Hitachi Ltd ２視野光学装置
JPS59144918A (ja) * 1982-12-08 1984-08-20 テキサス・インスツルメンツ・インコ−ポレイテツド 所定パタ−ンの位置決め方法及び装置
JPS61241605A (ja) * 1985-04-19 1986-10-27 Yoshiaki Ihara 画像処理装置
JPS6261340A (ja) * 1985-09-11 1987-03-18 Fuji Electric Co Ltd ウエハの要位置合せ角検出装置
JPS6276732A (ja) * 1985-09-30 1987-04-08 Hitachi Electronics Eng Co Ltd 異物検査装置
JPS62166505U (enrdf_load_stackoverflow) * 1986-04-09 1987-10-22
JPH03108735A (ja) * 1989-09-22 1991-05-08 Hitachi Ltd 比較検査方法および装置
JPH0373451U (enrdf_load_stackoverflow) * 1984-02-22 1991-07-24
JPH05226460A (ja) * 1992-02-18 1993-09-03 Nec Yamagata Ltd 画像処理による半導体チップ位置検出方法
EP0647828A3 (en) * 1993-10-12 1996-11-13 Hughes Aircraft Co Confocal optical system for thickness measurements on semiconductor wafers with a pattern.
JP2007258359A (ja) * 2006-03-22 2007-10-04 Sharp Corp 半導体デバイスの製造方法および半導体デバイスの成膜装置
CN102628670A (zh) * 2011-02-01 2012-08-08 株式会社其恩斯 尺寸测量设备、尺寸测量方法和用于尺寸测量设备的程序
WO2020008838A1 (ja) * 2018-07-06 2020-01-09 東レエンジニアリング株式会社 ダイシングチップ検査装置
JP2021034403A (ja) * 2019-08-15 2021-03-01 株式会社ディスコ 加工装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55125640A (en) * 1979-03-22 1980-09-27 Nec Corp Automatic chip selection apparatus

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55125640A (en) * 1979-03-22 1980-09-27 Nec Corp Automatic chip selection apparatus

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5919344A (ja) * 1982-07-23 1984-01-31 Hitachi Ltd ２視野光学装置
JPS59144918A (ja) * 1982-12-08 1984-08-20 テキサス・インスツルメンツ・インコ−ポレイテツド 所定パタ−ンの位置決め方法及び装置
JPH0373451U (enrdf_load_stackoverflow) * 1984-02-22 1991-07-24
JPS61241605A (ja) * 1985-04-19 1986-10-27 Yoshiaki Ihara 画像処理装置
JPS6261340A (ja) * 1985-09-11 1987-03-18 Fuji Electric Co Ltd ウエハの要位置合せ角検出装置
JPS6276732A (ja) * 1985-09-30 1987-04-08 Hitachi Electronics Eng Co Ltd 異物検査装置
JPS62166505U (enrdf_load_stackoverflow) * 1986-04-09 1987-10-22
JPH03108735A (ja) * 1989-09-22 1991-05-08 Hitachi Ltd 比較検査方法および装置
JPH05226460A (ja) * 1992-02-18 1993-09-03 Nec Yamagata Ltd 画像処理による半導体チップ位置検出方法
EP0647828A3 (en) * 1993-10-12 1996-11-13 Hughes Aircraft Co Confocal optical system for thickness measurements on semiconductor wafers with a pattern.
JP2007258359A (ja) * 2006-03-22 2007-10-04 Sharp Corp 半導体デバイスの製造方法および半導体デバイスの成膜装置
CN102628670A (zh) * 2011-02-01 2012-08-08 株式会社其恩斯 尺寸测量设备、尺寸测量方法和用于尺寸测量设备的程序
JP2012159409A (ja) * 2011-02-01 2012-08-23 Keyence Corp 寸法測定装置、寸法測定方法及び寸法測定装置用のプログラム
CN102628670B (zh) * 2011-02-01 2017-08-04 株式会社其恩斯 尺寸测量设备和尺寸测量方法
WO2020008838A1 (ja) * 2018-07-06 2020-01-09 東レエンジニアリング株式会社 ダイシングチップ検査装置
JP2020008383A (ja) * 2018-07-06 2020-01-16 東レエンジニアリング株式会社 ダイシングチップ検査装置
JP2021034403A (ja) * 2019-08-15 2021-03-01 株式会社ディスコ 加工装置

Also Published As

Publication number Publication date
JPH0324064B2 (enrdf_load_stackoverflow) 1991-04-02

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