JPS6457638A - Pre-aligner device - Google Patents

Pre-aligner device

Info

Publication number
JPS6457638A
JPS6457638A JP62212710A JP21271087A JPS6457638A JP S6457638 A JPS6457638 A JP S6457638A JP 62212710 A JP62212710 A JP 62212710A JP 21271087 A JP21271087 A JP 21271087A JP S6457638 A JPS6457638 A JP S6457638A
Authority
JP
Japan
Prior art keywords
wafer
orientation flat
optical microscope
alignment mark
detect
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62212710A
Other languages
Japanese (ja)
Other versions
JP2675307B2 (en
Inventor
Kozo Kurimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP62212710A priority Critical patent/JP2675307B2/en
Publication of JPS6457638A publication Critical patent/JPS6457638A/en
Application granted granted Critical
Publication of JP2675307B2 publication Critical patent/JP2675307B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Machine Tool Units (AREA)

Abstract

PURPOSE:To obtain a device of simple structure capable of coping with various kinds of wafer size by constituting a stage in a manner in which it can travel the distance corresponding with various kinds of wafer size, and providing an optical microscope with a CCD sensor in order to detect an orientation flat and a pre-alignment mark by using the same optical microscope. CONSTITUTION:In order to detect the orientation flat and the pre-alignment mark of wafer 1, a stage 21 is installed, which moves the orientation flat 7 and the pre-alignment mark of wafer 1 into the visual field of an optical microscope. The stage is constituted in such a manner as to be able to travel the distance corresponding with various kinds of wafer 1 size. The optical microscope is provided with a CCD sensor 35, in order to detect the orientation flat and the pre-alignment mark by using the same optical microscope. After the wafer 1 is rotated and the position of the orient flat is detected by the CCD sensor 35, it is detected by a two-dimensional sensor like a television camera, and magnified on a television monitor 18. Thus the position of the orientation flat is accurately obtained, and whether the orientation flat 7 is aligned at a specified position or not is confirmed with the television monitor 18.
JP62212710A 1987-08-28 1987-08-28 Preliner equipment Expired - Fee Related JP2675307B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62212710A JP2675307B2 (en) 1987-08-28 1987-08-28 Preliner equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62212710A JP2675307B2 (en) 1987-08-28 1987-08-28 Preliner equipment

Publications (2)

Publication Number Publication Date
JPS6457638A true JPS6457638A (en) 1989-03-03
JP2675307B2 JP2675307B2 (en) 1997-11-12

Family

ID=16627148

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62212710A Expired - Fee Related JP2675307B2 (en) 1987-08-28 1987-08-28 Preliner equipment

Country Status (1)

Country Link
JP (1) JP2675307B2 (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03102847A (en) * 1989-09-16 1991-04-30 Hitachi Ltd Method and device for detecting orientation flat and reduced projection exposure device
JPH03142853A (en) * 1989-10-28 1991-06-18 Hitachi Ltd Apparatus and method for aligning wafer
KR100280417B1 (en) * 1997-12-29 2001-03-02 김영환 System for detecting wafer mark
KR100439609B1 (en) * 1995-06-07 2004-10-14 배리언 어소시에이츠 인코포레이티드 Wafer alignment alignment and system
WO2007004413A1 (en) * 2005-06-30 2007-01-11 Kabushiki Kaisha Yaskawa Denki Translating/turning 2-degree-of-freedom stage device and 3-degree-of-freedom stage device using the same
JP2013110200A (en) * 2011-11-18 2013-06-06 Tokyo Electron Ltd Substrate transfer system
CN105655278A (en) * 2014-11-11 2016-06-08 沈阳新松机器人自动化股份有限公司 Wafer dimension online adjustable prealignment apparatus
JP2018513563A (en) * 2015-04-24 2018-05-24 シャンハイ マイクロ エレクトロニクス イクイプメント（グループ）カンパニー リミティド Wafer pre-alignment apparatus and method
CN113066746A (en) * 2020-01-02 2021-07-02 长鑫存储技术有限公司 Pre-alignment device and pre-alignment method applied to same

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60195932A (en) * 1984-03-19 1985-10-04 Canon Inc Position detector
JPS60244803A (en) * 1984-05-21 1985-12-04 Disco Abrasive Sys Ltd Automatic precise positioning system
JPS6265436A (en) * 1985-09-18 1987-03-24 Tokyo Sokuhan Kk Method for controlling wafer position in die bonder
JPS6292319A (en) * 1985-10-17 1987-04-27 Nec Corp Positioning device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60195932A (en) * 1984-03-19 1985-10-04 Canon Inc Position detector
JPS60244803A (en) * 1984-05-21 1985-12-04 Disco Abrasive Sys Ltd Automatic precise positioning system
JPS6265436A (en) * 1985-09-18 1987-03-24 Tokyo Sokuhan Kk Method for controlling wafer position in die bonder
JPS6292319A (en) * 1985-10-17 1987-04-27 Nec Corp Positioning device

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03102847A (en) * 1989-09-16 1991-04-30 Hitachi Ltd Method and device for detecting orientation flat and reduced projection exposure device
JPH03142853A (en) * 1989-10-28 1991-06-18 Hitachi Ltd Apparatus and method for aligning wafer
KR100439609B1 (en) * 1995-06-07 2004-10-14 배리언 어소시에이츠 인코포레이티드 Wafer alignment alignment and system
KR100280417B1 (en) * 1997-12-29 2001-03-02 김영환 System for detecting wafer mark
WO2007004413A1 (en) * 2005-06-30 2007-01-11 Kabushiki Kaisha Yaskawa Denki Translating/turning 2-degree-of-freedom stage device and 3-degree-of-freedom stage device using the same
JP2013110200A (en) * 2011-11-18 2013-06-06 Tokyo Electron Ltd Substrate transfer system
CN105655278A (en) * 2014-11-11 2016-06-08 沈阳新松机器人自动化股份有限公司 Wafer dimension online adjustable prealignment apparatus
JP2018513563A (en) * 2015-04-24 2018-05-24 シャンハイ マイクロ エレクトロニクス イクイプメント（グループ）カンパニー リミティド Wafer pre-alignment apparatus and method
CN113066746A (en) * 2020-01-02 2021-07-02 长鑫存储技术有限公司 Pre-alignment device and pre-alignment method applied to same
CN113066746B (en) * 2020-01-02 2022-03-22 长鑫存储技术有限公司 Pre-alignment device and pre-alignment method applied to same

Also Published As

Publication number Publication date
JP2675307B2 (en) 1997-11-12

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees