JPS57155386A - Preventing method for oxidation of copper powder - Google Patents

Preventing method for oxidation of copper powder

Info

Publication number
JPS57155386A
JPS57155386A JP56040074A JP4007481A JPS57155386A JP S57155386 A JPS57155386 A JP S57155386A JP 56040074 A JP56040074 A JP 56040074A JP 4007481 A JP4007481 A JP 4007481A JP S57155386 A JPS57155386 A JP S57155386A
Authority
JP
Japan
Prior art keywords
copper powder
oxidation
coupling agent
silane coupling
preventing method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56040074A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6119712B2 (enExample
Inventor
Toru Kasatsugu
Toshiaki Ikeda
Koji Tani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP56040074A priority Critical patent/JPS57155386A/ja
Publication of JPS57155386A publication Critical patent/JPS57155386A/ja
Publication of JPS6119712B2 publication Critical patent/JPS6119712B2/ja
Granted legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2222/00Aspects relating to chemical surface treatment of metallic material by reaction of the surface with a reactive medium
    • C23C2222/20Use of solutions containing silanes

Landscapes

  • Powder Metallurgy (AREA)
  • Chemical Treatment Of Metals (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
JP56040074A 1981-03-18 1981-03-18 Preventing method for oxidation of copper powder Granted JPS57155386A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56040074A JPS57155386A (en) 1981-03-18 1981-03-18 Preventing method for oxidation of copper powder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56040074A JPS57155386A (en) 1981-03-18 1981-03-18 Preventing method for oxidation of copper powder

Publications (2)

Publication Number Publication Date
JPS57155386A true JPS57155386A (en) 1982-09-25
JPS6119712B2 JPS6119712B2 (enExample) 1986-05-19

Family

ID=12570770

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56040074A Granted JPS57155386A (en) 1981-03-18 1981-03-18 Preventing method for oxidation of copper powder

Country Status (1)

Country Link
JP (1) JPS57155386A (enExample)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0264444A (ja) * 1988-08-31 1990-03-05 Shimadzu Corp 熱伝導度検出器
JPH0554714A (ja) * 1991-08-22 1993-03-05 Dai Ichi Kogyo Seiyaku Co Ltd 導電ペースト組成物
JP2012107300A (ja) * 2010-11-18 2012-06-07 Motorashi Seisakusho Co Ltd 金属表面保護剤、金属表面保護剤の製造方法および金属表面処理方法
JP2016033850A (ja) * 2014-07-30 2016-03-10 Jx日鉱日石金属株式会社 導電性ペースト及びその製造方法
JP2016172922A (ja) * 2015-03-16 2016-09-29 住友金属鉱山株式会社 銅粉末及びその製造方法
WO2020138273A1 (ja) * 2018-12-27 2020-07-02 Jx金属株式会社 Siの被膜を有する純銅粉及びその製造方法並びに該純銅粉を用いた積層造形物
WO2023002884A1 (ja) * 2021-07-19 2023-01-26 大陽日酸株式会社 複合銅ナノ粒子及び複合銅ナノ粒子の製造方法
US11872647B2 (en) 2018-12-27 2024-01-16 Jx Metals Corporation Production method of additive manufactured object using pure copper powder having Si coating

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4736280B2 (ja) * 2001-08-30 2011-07-27 日立化成工業株式会社 回路接続用接着剤及びそれを用いた回路接続構造体

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0264444A (ja) * 1988-08-31 1990-03-05 Shimadzu Corp 熱伝導度検出器
JPH0554714A (ja) * 1991-08-22 1993-03-05 Dai Ichi Kogyo Seiyaku Co Ltd 導電ペースト組成物
JP2012107300A (ja) * 2010-11-18 2012-06-07 Motorashi Seisakusho Co Ltd 金属表面保護剤、金属表面保護剤の製造方法および金属表面処理方法
JP2016033850A (ja) * 2014-07-30 2016-03-10 Jx日鉱日石金属株式会社 導電性ペースト及びその製造方法
JP2016172922A (ja) * 2015-03-16 2016-09-29 住友金属鉱山株式会社 銅粉末及びその製造方法
WO2020138273A1 (ja) * 2018-12-27 2020-07-02 Jx金属株式会社 Siの被膜を有する純銅粉及びその製造方法並びに該純銅粉を用いた積層造形物
JP6722838B1 (ja) * 2018-12-27 2020-07-15 Jx金属株式会社 Siの被膜を有する純銅粉及びその製造方法並びに該純銅粉を用いた積層造形物
KR20200111811A (ko) * 2018-12-27 2020-09-29 제이엑스금속주식회사 Si의 피막을 갖는 순동분 및 그의 제조 방법, 그리고 해당 순동분을 사용한 적층 조형물
US11498122B2 (en) 2018-12-27 2022-11-15 Jx Nippon Mining & Metals Corporation Pure copper powder having Si coating and production method thereof, and additive manufactured object using said pure copper powder
US11872647B2 (en) 2018-12-27 2024-01-16 Jx Metals Corporation Production method of additive manufactured object using pure copper powder having Si coating
WO2023002884A1 (ja) * 2021-07-19 2023-01-26 大陽日酸株式会社 複合銅ナノ粒子及び複合銅ナノ粒子の製造方法
JP2023014621A (ja) * 2021-07-19 2023-01-31 大陽日酸株式会社 複合銅ナノ粒子及び複合銅ナノ粒子の製造方法

Also Published As

Publication number Publication date
JPS6119712B2 (enExample) 1986-05-19

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