JPS6119712B2 - - Google Patents

Info

Publication number
JPS6119712B2
JPS6119712B2 JP56040074A JP4007481A JPS6119712B2 JP S6119712 B2 JPS6119712 B2 JP S6119712B2 JP 56040074 A JP56040074 A JP 56040074A JP 4007481 A JP4007481 A JP 4007481A JP S6119712 B2 JPS6119712 B2 JP S6119712B2
Authority
JP
Japan
Prior art keywords
copper powder
silane coupling
coupling agent
temperature
oxidation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56040074A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57155386A (en
Inventor
Tooru Kasatsugu
Toshiaki Ikeda
Koji Tani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP56040074A priority Critical patent/JPS57155386A/ja
Publication of JPS57155386A publication Critical patent/JPS57155386A/ja
Publication of JPS6119712B2 publication Critical patent/JPS6119712B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2222/00—Aspects relating to chemical surface treatment of metallic material by reaction of the surface with a reactive medium
    • C23C2222/20—Use of solutions containing silanes

Landscapes

  • Powder Metallurgy (AREA)
  • Chemical Treatment Of Metals (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
JP56040074A 1981-03-18 1981-03-18 Preventing method for oxidation of copper powder Granted JPS57155386A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56040074A JPS57155386A (en) 1981-03-18 1981-03-18 Preventing method for oxidation of copper powder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56040074A JPS57155386A (en) 1981-03-18 1981-03-18 Preventing method for oxidation of copper powder

Publications (2)

Publication Number Publication Date
JPS57155386A JPS57155386A (en) 1982-09-25
JPS6119712B2 true JPS6119712B2 (enExample) 1986-05-19

Family

ID=12570770

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56040074A Granted JPS57155386A (en) 1981-03-18 1981-03-18 Preventing method for oxidation of copper powder

Country Status (1)

Country Link
JP (1) JPS57155386A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003064344A (ja) * 2001-08-30 2003-03-05 Hitachi Chem Co Ltd 回路接続用接着剤及びそれを用いた回路接続構造体

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2676810B2 (ja) * 1988-08-31 1997-11-17 株式会社島津製作所 熱伝導度検出器
JP2578273B2 (ja) * 1991-08-22 1997-02-05 第一工業製薬株式会社 多層電極基板の製造方法
JP5358776B2 (ja) * 2010-11-18 2013-12-04 株式会社本螺子製作所 金属表面保護剤、金属表面保護剤の製造方法および金属表面処理方法
JP6324253B2 (ja) * 2014-07-30 2018-05-16 Ｊｘ金属株式会社 導電性ペースト及びその製造方法
JP6515829B2 (ja) * 2015-03-16 2019-05-22 住友金属鉱山株式会社 銅粉末及びその製造方法
CA3092015C (en) * 2018-12-27 2024-02-13 Jx Nippon Mining & Metals Corporation Pure copper powder having si coating and production method thereof, and additive manufactured object using said pure copper powder
WO2020138274A1 (ja) 2018-12-27 2020-07-02 Ｊｘ金属株式会社 Ｓｉの被膜を有する純銅粉を用いた積層造形物の製造方法
JP7121173B1 (ja) * 2021-07-19 2022-08-17 大陽日酸株式会社 複合銅ナノ粒子及び複合銅ナノ粒子の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003064344A (ja) * 2001-08-30 2003-03-05 Hitachi Chem Co Ltd 回路接続用接着剤及びそれを用いた回路接続構造体

Also Published As

Publication number Publication date
JPS57155386A (en) 1982-09-25

Similar Documents

Publication Publication Date Title
US3146125A (en) Method of making printed circuits
US4487811A (en) Electrical conductor
KR900008274B1 (ko) 저항회로 형성방법
JPH0530620B2 (enExample)
JPS63260197A (ja) 多層回路構造体の製造法
JPS6119712B2 (enExample)
JP4395359B2 (ja) 高温適用のための、低温硬化セラミックコーティングを形成するためのシステム及び方法
JPH01128488A (ja) 厚膜銅導体インキ
KR890001897A (ko) 창유리표면의 착색코오팅의 적용방법
US4409261A (en) Process for air firing oxidizable conductors
JPH0213898B2 (enExample)
US4689270A (en) Composite substrate for printed circuits and printed circuit-substrate combination
US4567111A (en) Conductive pigment-coated surfaces
JPS6341208B2 (enExample)
JPH0247545B2 (enExample)
US3903344A (en) Adherent solderable cermet conductor
GB979779A (en) Method of making printed circuits
JPH08167768A (ja) 回路パターンの形成方法及びそのペースト
JPH0227832B2 (ja) Seramitsukusukiban
JP2531002B2 (ja) 電子部品の製造方法
JPS62130595A (ja) 電気回路装置の製造方法
JP2560729B2 (ja) 回路素子の製造方法
JPH02104494A (ja) プリント配線板の半田フラックス前駆体
JPH026836B2 (enExample)
JP2914654B2 (ja) エナメル被覆電線用導電性接着剤