JPS57141965A - Insulated gate type field effect transistor - Google Patents
Insulated gate type field effect transistorInfo
- Publication number
- JPS57141965A JPS57141965A JP56027294A JP2729481A JPS57141965A JP S57141965 A JPS57141965 A JP S57141965A JP 56027294 A JP56027294 A JP 56027294A JP 2729481 A JP2729481 A JP 2729481A JP S57141965 A JPS57141965 A JP S57141965A
- Authority
- JP
- Japan
- Prior art keywords
- region
- layer
- type
- drain
- field effect
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000005669 field effect Effects 0.000 title 1
- 239000010410 layer Substances 0.000 abstract 5
- 239000002344 surface layer Substances 0.000 abstract 2
- 230000003247 decreasing effect Effects 0.000 abstract 1
- 239000012535 impurity Substances 0.000 abstract 1
- 238000010030 laminating Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/08—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/0843—Source or drain regions of field-effect devices
- H01L29/0847—Source or drain regions of field-effect devices of field-effect transistors with insulated gate
- H01L29/0852—Source or drain regions of field-effect devices of field-effect transistors with insulated gate of DMOS transistors
- H01L29/0873—Drain regions
- H01L29/0878—Impurity concentration or distribution
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/402—Field plates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/417—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched
- H01L29/41725—Source or drain electrodes for field effect devices
- H01L29/41741—Source or drain electrodes for field effect devices for vertical or pseudo-vertical devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42372—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the conducting layer, e.g. the length, the sectional shape or the lay-out
- H01L29/42376—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the conducting layer, e.g. the length, the sectional shape or the lay-out characterised by the length or the sectional shape
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
Abstract
PURPOSE:To reduce ON resistance by providing a one conductive type source region in a one conductive type drain region through two reverse conductive type regions to obtain the IGFET, and providing the surface layer part having high impurity concentration in a drain region located between the two reverse conductive region. CONSTITUTION:A substrate 3 which is to become the drain region is prepared by laminating an N<+> type layer 2 and an N<-> type layer 1. A drain electrode M4 is deposited on the entire back surface of the layer 2. Then two P type regions Z1 are diffused and formed in the layer 1. Z3 which is to become a source region is provided in each region. A source electrode M1 is attached on the area from the central part of each region Z3 and to the outer edge part of each region 1. A gate electrode M2 which faces the M1 is provided on the area from each region Z3 to the edge of each region Z1 through a gate insulating film 5. Thus the FET is obtained. In this constitution, only the surface layer part of the layer 1 between the region Z1's is transformed into an N<+> type region 25, the ON resistance is decreased, and the IGFET with low power consumption is obtained.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56027294A JPS57141965A (en) | 1981-02-26 | 1981-02-26 | Insulated gate type field effect transistor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56027294A JPS57141965A (en) | 1981-02-26 | 1981-02-26 | Insulated gate type field effect transistor |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57141965A true JPS57141965A (en) | 1982-09-02 |
Family
ID=12217062
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP56027294A Pending JPS57141965A (en) | 1981-02-26 | 1981-02-26 | Insulated gate type field effect transistor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57141965A (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59141270A (en) * | 1983-01-31 | 1984-08-13 | Matsushita Electric Ind Co Ltd | Mos type semiconductor device |
JPH01191477A (en) * | 1988-01-27 | 1989-08-01 | Fuji Electric Co Ltd | Field-effect transistor |
US4956700A (en) * | 1987-08-17 | 1990-09-11 | Siliconix Incorporated | Integrated circuit with high power, vertical output transistor capability |
US4962411A (en) * | 1986-03-21 | 1990-10-09 | Nippondenso Co., Ltd. | Semiconductor device with current detecting function |
US5155563A (en) * | 1991-03-18 | 1992-10-13 | Motorola, Inc. | Semiconductor device having low source inductance |
US5365085A (en) * | 1990-07-30 | 1994-11-15 | Nippondenso Co., Ltd. | Power semiconductor device with a current detecting function |
US6104233A (en) * | 1990-04-13 | 2000-08-15 | Kabushiki Kaisha Toshiba | Substrate structure of semi-conductor device |
-
1981
- 1981-02-26 JP JP56027294A patent/JPS57141965A/en active Pending
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59141270A (en) * | 1983-01-31 | 1984-08-13 | Matsushita Electric Ind Co Ltd | Mos type semiconductor device |
US4962411A (en) * | 1986-03-21 | 1990-10-09 | Nippondenso Co., Ltd. | Semiconductor device with current detecting function |
US4956700A (en) * | 1987-08-17 | 1990-09-11 | Siliconix Incorporated | Integrated circuit with high power, vertical output transistor capability |
JPH01191477A (en) * | 1988-01-27 | 1989-08-01 | Fuji Electric Co Ltd | Field-effect transistor |
US6104233A (en) * | 1990-04-13 | 2000-08-15 | Kabushiki Kaisha Toshiba | Substrate structure of semi-conductor device |
US5365085A (en) * | 1990-07-30 | 1994-11-15 | Nippondenso Co., Ltd. | Power semiconductor device with a current detecting function |
US5155563A (en) * | 1991-03-18 | 1992-10-13 | Motorola, Inc. | Semiconductor device having low source inductance |
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