JPS57103333A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS57103333A
JPS57103333A JP17932180A JP17932180A JPS57103333A JP S57103333 A JPS57103333 A JP S57103333A JP 17932180 A JP17932180 A JP 17932180A JP 17932180 A JP17932180 A JP 17932180A JP S57103333 A JPS57103333 A JP S57103333A
Authority
JP
Japan
Prior art keywords
wiring layer
film
covered
insulating film
spionglass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17932180A
Other languages
Japanese (ja)
Other versions
JPS646543B2 (en
Inventor
Shohei Shima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP17932180A priority Critical patent/JPS57103333A/en
Publication of JPS57103333A publication Critical patent/JPS57103333A/en
Publication of JPS646543B2 publication Critical patent/JPS646543B2/ja
Granted legal-status Critical Current

Links

Abstract

PURPOSE:To obtain high passivation effect by forming the first wiring layer on a semiconductor substrate covered with an insulating layer formed with an element, and employing a spionglass film baked in plasma as an interlayer insulating film when forming the second wiring layer via an interlayer insulating film thereon. CONSTITUTION:The first aluminum wiring layer 12 is formed on a semiconductor substrate 11 covered with an insulating film formed with an element. A spionglass film 13 is coated on the overall surface including the layer, and the surface is smoothened while burying the space between the layers 12. Thereafter, the film 13 is annealed in oxygen plasma to be baked, and the second aluminum wiring layer 14 is covered thereon. Thus, annealing effect equivalent to the heat annealing at 550 deg.C can be presented even if the specimen temperature thus annealed is only up to approx. 300 deg.C, producing no crack, thereby obtaining high reliability in the multilayer wire.
JP17932180A 1980-12-18 1980-12-18 Manufacture of semiconductor device Granted JPS57103333A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17932180A JPS57103333A (en) 1980-12-18 1980-12-18 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17932180A JPS57103333A (en) 1980-12-18 1980-12-18 Manufacture of semiconductor device

Publications (2)

Publication Number Publication Date
JPS57103333A true JPS57103333A (en) 1982-06-26
JPS646543B2 JPS646543B2 (en) 1989-02-03

Family

ID=16063785

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17932180A Granted JPS57103333A (en) 1980-12-18 1980-12-18 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS57103333A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63164342A (en) * 1986-12-26 1988-07-07 Matsushita Electric Ind Co Ltd Formation of insulating film
JPH0497527A (en) * 1990-08-16 1992-03-30 Applied Materials Japan Kk Method of preventing precipitation
WO2004012252A1 (en) * 2002-07-30 2004-02-05 Tokyo Electron Limited Method for forming insulating layer

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS542070A (en) * 1977-06-07 1979-01-09 Toshiba Corp Manufacture for semiconductor element
JPS556291A (en) * 1978-06-26 1980-01-17 Contraves Ag Digital interporation system for three pahse analog signal period

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS542070A (en) * 1977-06-07 1979-01-09 Toshiba Corp Manufacture for semiconductor element
JPS556291A (en) * 1978-06-26 1980-01-17 Contraves Ag Digital interporation system for three pahse analog signal period

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63164342A (en) * 1986-12-26 1988-07-07 Matsushita Electric Ind Co Ltd Formation of insulating film
JPH0497527A (en) * 1990-08-16 1992-03-30 Applied Materials Japan Kk Method of preventing precipitation
WO2004012252A1 (en) * 2002-07-30 2004-02-05 Tokyo Electron Limited Method for forming insulating layer

Also Published As

Publication number Publication date
JPS646543B2 (en) 1989-02-03

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