JPS568834A - Manufacture of projection for substrate conductor layer - Google Patents

Manufacture of projection for substrate conductor layer

Info

Publication number
JPS568834A
JPS568834A JP8374279A JP8374279A JPS568834A JP S568834 A JPS568834 A JP S568834A JP 8374279 A JP8374279 A JP 8374279A JP 8374279 A JP8374279 A JP 8374279A JP S568834 A JPS568834 A JP S568834A
Authority
JP
Japan
Prior art keywords
layer
projection
conductor layer
resist
etched
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8374279A
Other languages
English (en)
Japanese (ja)
Other versions
JPS628945B2 (https=
Inventor
Kazuyoshi Haniwara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Suwa Seikosha KK
Original Assignee
Seiko Epson Corp
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, Suwa Seikosha KK filed Critical Seiko Epson Corp
Priority to JP8374279A priority Critical patent/JPS568834A/ja
Publication of JPS568834A publication Critical patent/JPS568834A/ja
Publication of JPS628945B2 publication Critical patent/JPS628945B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/142—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations exposing the passive side of the semiconductor body
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Wire Bonding (AREA)
JP8374279A 1979-07-02 1979-07-02 Manufacture of projection for substrate conductor layer Granted JPS568834A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8374279A JPS568834A (en) 1979-07-02 1979-07-02 Manufacture of projection for substrate conductor layer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8374279A JPS568834A (en) 1979-07-02 1979-07-02 Manufacture of projection for substrate conductor layer

Publications (2)

Publication Number Publication Date
JPS568834A true JPS568834A (en) 1981-01-29
JPS628945B2 JPS628945B2 (https=) 1987-02-25

Family

ID=13810970

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8374279A Granted JPS568834A (en) 1979-07-02 1979-07-02 Manufacture of projection for substrate conductor layer

Country Status (1)

Country Link
JP (1) JPS568834A (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57204158A (en) * 1981-06-11 1982-12-14 Shindo Denshi Kogyo Kk Manufacture of wiring section for mounting chip
JPS57204157A (en) * 1981-06-11 1982-12-14 Shindo Denshi Kogyo Kk Manufacture of wiring section for mounting chip
US6740148B2 (en) 1999-09-24 2004-05-25 Nasa Auto Exhaust gas cleaner

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS546775A (en) * 1977-06-17 1979-01-19 Nec Corp Semiconductor device featuring stepped electrode structure

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS546775A (en) * 1977-06-17 1979-01-19 Nec Corp Semiconductor device featuring stepped electrode structure

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57204158A (en) * 1981-06-11 1982-12-14 Shindo Denshi Kogyo Kk Manufacture of wiring section for mounting chip
JPS57204157A (en) * 1981-06-11 1982-12-14 Shindo Denshi Kogyo Kk Manufacture of wiring section for mounting chip
US6740148B2 (en) 1999-09-24 2004-05-25 Nasa Auto Exhaust gas cleaner

Also Published As

Publication number Publication date
JPS628945B2 (https=) 1987-02-25

Similar Documents

Publication Publication Date Title
JPS5240969A (en) Process for production of semiconductor device
JPS568834A (en) Manufacture of projection for substrate conductor layer
JPS568833A (en) Manufacture of projection for substrate conductor layer
JPS5331964A (en) Production of semiconductor substrates
JPS57145340A (en) Manufacture of semiconductor device
JPS5674911A (en) Manufacture of multilayer thin film coil
JPS5649541A (en) Multilayer wiring structure for integrated circuit
JPS56130951A (en) Manufacture of semiconductor device
JPS5732654A (en) Semiconductor integrated circuit device
JPS5526613A (en) Manufacturing of carrier tape useful for ic
JPS5568655A (en) Manufacturing method of wiring
JPS54111763A (en) Carrier tape for tape carrier
JPS5211862A (en) Semiconductor device
JPS5526612A (en) Manufacturing of carrier tape useful for ic
JPS56130947A (en) Manufacture of semiconductor device
JPS5380167A (en) Manufacture of semiconductor device
JPS5732653A (en) Manufacture of semiconductor device
JPS54113277A (en) Production of semiconductor device
JPS54158183A (en) Manufacture of semiconductor device
JPS5690535A (en) Production of integrated multilayer wiring strcuture
JPS5546534A (en) Method of manufacturing semiconductor device
JPS5612743A (en) Processing method of projection for conductive layer of substrate
JPS57188846A (en) Forming method for buried wiring
JPS5759357A (en) Forming method for structure of multilayer wiring
JPS56155552A (en) Manufacture of semiconductor device