JPS628945B2 - - Google Patents

Info

Publication number
JPS628945B2
JPS628945B2 JP54083742A JP8374279A JPS628945B2 JP S628945 B2 JPS628945 B2 JP S628945B2 JP 54083742 A JP54083742 A JP 54083742A JP 8374279 A JP8374279 A JP 8374279A JP S628945 B2 JPS628945 B2 JP S628945B2
Authority
JP
Japan
Prior art keywords
conductor layer
photoresist
etching
protrusion
back surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54083742A
Other languages
English (en)
Japanese (ja)
Other versions
JPS568834A (en
Inventor
Kazuyoshi Haniwara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP8374279A priority Critical patent/JPS568834A/ja
Publication of JPS568834A publication Critical patent/JPS568834A/ja
Publication of JPS628945B2 publication Critical patent/JPS628945B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/142—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations exposing the passive side of the semiconductor body
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Wire Bonding (AREA)
JP8374279A 1979-07-02 1979-07-02 Manufacture of projection for substrate conductor layer Granted JPS568834A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8374279A JPS568834A (en) 1979-07-02 1979-07-02 Manufacture of projection for substrate conductor layer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8374279A JPS568834A (en) 1979-07-02 1979-07-02 Manufacture of projection for substrate conductor layer

Publications (2)

Publication Number Publication Date
JPS568834A JPS568834A (en) 1981-01-29
JPS628945B2 true JPS628945B2 (https=) 1987-02-25

Family

ID=13810970

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8374279A Granted JPS568834A (en) 1979-07-02 1979-07-02 Manufacture of projection for substrate conductor layer

Country Status (1)

Country Link
JP (1) JPS568834A (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57204158A (en) * 1981-06-11 1982-12-14 Shindo Denshi Kogyo Kk Manufacture of wiring section for mounting chip
JPS57204157A (en) * 1981-06-11 1982-12-14 Shindo Denshi Kogyo Kk Manufacture of wiring section for mounting chip
WO2001021289A1 (en) 1999-09-24 2001-03-29 Nasa Auto Exhaust gas cleaner

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS546775A (en) * 1977-06-17 1979-01-19 Nec Corp Semiconductor device featuring stepped electrode structure

Also Published As

Publication number Publication date
JPS568834A (en) 1981-01-29

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