JPS57188846A - Forming method for buried wiring - Google Patents
Forming method for buried wiringInfo
- Publication number
- JPS57188846A JPS57188846A JP7232981A JP7232981A JPS57188846A JP S57188846 A JPS57188846 A JP S57188846A JP 7232981 A JP7232981 A JP 7232981A JP 7232981 A JP7232981 A JP 7232981A JP S57188846 A JPS57188846 A JP S57188846A
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- shaped
- layers
- layer
- whole surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
PURPOSE:To form and laminate flat wiring layers through nonselective ion etching by coating the wiring layers shaped onto an insulating layer patterned with resists and flatly forming the layers. CONSTITUTION:The insulating layer 2 on a semiconductor substate 1 is patterned, contact holes, etc. are shaped, and an Al conductor layer 3 is formed onto the whole surface. The resist layer 4 is flatly shaped onto the whole surface through an application method, and the whole surface is etched through nonselective etching such as reactive ion etching to form the flat wiring surface. Multilayer wiring can be shaped without generating disconnection by also forming each wiring 6 after the second layer, insulating layers 5, etc. similarly.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7232981A JPS57188846A (en) | 1981-05-15 | 1981-05-15 | Forming method for buried wiring |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7232981A JPS57188846A (en) | 1981-05-15 | 1981-05-15 | Forming method for buried wiring |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57188846A true JPS57188846A (en) | 1982-11-19 |
Family
ID=13486133
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7232981A Pending JPS57188846A (en) | 1981-05-15 | 1981-05-15 | Forming method for buried wiring |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57188846A (en) |
-
1981
- 1981-05-15 JP JP7232981A patent/JPS57188846A/en active Pending
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