JPS54111763A - Carrier tape for tape carrier - Google Patents

Carrier tape for tape carrier

Info

Publication number
JPS54111763A
JPS54111763A JP1846878A JP1846878A JPS54111763A JP S54111763 A JPS54111763 A JP S54111763A JP 1846878 A JP1846878 A JP 1846878A JP 1846878 A JP1846878 A JP 1846878A JP S54111763 A JPS54111763 A JP S54111763A
Authority
JP
Japan
Prior art keywords
carrier
tape
bonded
lead
copper foil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1846878A
Other languages
Japanese (ja)
Inventor
Hiroaki Okudaira
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP1846878A priority Critical patent/JPS54111763A/en
Publication of JPS54111763A publication Critical patent/JPS54111763A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To obtain the carrier tape for tape carrier repetitively usable for heat- proof resin film.
CONSTITUTION: The copper foil 13 is bonded except for the sprocket holes of the resin films 11, and the lead holder 12 is bonded with a given position of the copper foil exposed to the square holes. The wiring pattern 3 is made with photo etching. The copper foil exposed to the film 11 is coated for resist in advance and it is removed after etching. Next, the inner lead 7 is bonded with the bump 5 of IC4, and the outer lead 8 of the pattern 3 is bonded with the wiring terminal of the wiring substrate 15. Next, the lead 8 is cut off at the circumference of the square hole, separating the carrier 11. The carrier 11 separated is removed for the residual pattern 3 by etching and it is reused.
COPYRIGHT: (C)1979,JPO&Japio
JP1846878A 1978-02-22 1978-02-22 Carrier tape for tape carrier Pending JPS54111763A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1846878A JPS54111763A (en) 1978-02-22 1978-02-22 Carrier tape for tape carrier

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1846878A JPS54111763A (en) 1978-02-22 1978-02-22 Carrier tape for tape carrier

Publications (1)

Publication Number Publication Date
JPS54111763A true JPS54111763A (en) 1979-09-01

Family

ID=11972463

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1846878A Pending JPS54111763A (en) 1978-02-22 1978-02-22 Carrier tape for tape carrier

Country Status (1)

Country Link
JP (1) JPS54111763A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01283842A (en) * 1988-05-10 1989-11-15 Fujitsu Ltd Semiconductor device
JPH0260134A (en) * 1988-08-26 1990-02-28 Mitsui Toatsu Chem Inc Board for semiconductor element mounting use
JPH02119150A (en) * 1989-09-28 1990-05-07 Casio Comput Co Ltd Method for joining metallic lead foil

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01283842A (en) * 1988-05-10 1989-11-15 Fujitsu Ltd Semiconductor device
JPH0260134A (en) * 1988-08-26 1990-02-28 Mitsui Toatsu Chem Inc Board for semiconductor element mounting use
JPH02119150A (en) * 1989-09-28 1990-05-07 Casio Comput Co Ltd Method for joining metallic lead foil

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