JPS5518045A - Method of fabricating carrier tape for semiconductor device - Google Patents

Method of fabricating carrier tape for semiconductor device

Info

Publication number
JPS5518045A
JPS5518045A JP9091678A JP9091678A JPS5518045A JP S5518045 A JPS5518045 A JP S5518045A JP 9091678 A JP9091678 A JP 9091678A JP 9091678 A JP9091678 A JP 9091678A JP S5518045 A JPS5518045 A JP S5518045A
Authority
JP
Japan
Prior art keywords
holes
tape
foil
carrier tape
varnish
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9091678A
Other languages
Japanese (ja)
Other versions
JPS6130751B2 (en
Inventor
Toshio Kobayashi
Masanori Nakamura
Hiroaki Okudaira
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP9091678A priority Critical patent/JPS5518045A/en
Publication of JPS5518045A publication Critical patent/JPS5518045A/en
Publication of JPS6130751B2 publication Critical patent/JPS6130751B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To accurately and readily form element holes and sprocket holes at a carrier tape for a semiconductor device by coating photosensitive resin on a metallic foil, perforating element holes at the resin tape and etching the metallic foil.
CONSTITUTION: Photo-setting varnish 2 is coated on a metallic foil such as, for example, copper foil tape 1. Then, light is irradiated through a mask 2 formed in advance with pattern to the metallic foil. This foil is then immersed in a solvent to dissolve the portions where light is not irradiated to thereby perforate predetermined semiconductor element connecting holes 4A and tape position feeding sprocket holes 4B at the varnish. Then, when the varnish is completely hardened, a carrier tape can be thus obtained. Then, the copper foil 1 is etched to form a conductor pattern 5. Thus, it can accurately and readily form the element holes 4A and sprocket holes 4B with superior mechanical strength and heat insulation.
COPYRIGHT: (C)1980,JPO&Japio
JP9091678A 1978-07-27 1978-07-27 Method of fabricating carrier tape for semiconductor device Granted JPS5518045A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9091678A JPS5518045A (en) 1978-07-27 1978-07-27 Method of fabricating carrier tape for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9091678A JPS5518045A (en) 1978-07-27 1978-07-27 Method of fabricating carrier tape for semiconductor device

Publications (2)

Publication Number Publication Date
JPS5518045A true JPS5518045A (en) 1980-02-07
JPS6130751B2 JPS6130751B2 (en) 1986-07-15

Family

ID=14011737

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9091678A Granted JPS5518045A (en) 1978-07-27 1978-07-27 Method of fabricating carrier tape for semiconductor device

Country Status (1)

Country Link
JP (1) JPS5518045A (en)

Also Published As

Publication number Publication date
JPS6130751B2 (en) 1986-07-15

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