JPS5493971A - Production of semiconductor device - Google Patents
Production of semiconductor deviceInfo
- Publication number
- JPS5493971A JPS5493971A JP62578A JP62578A JPS5493971A JP S5493971 A JPS5493971 A JP S5493971A JP 62578 A JP62578 A JP 62578A JP 62578 A JP62578 A JP 62578A JP S5493971 A JPS5493971 A JP S5493971A
- Authority
- JP
- Japan
- Prior art keywords
- photo resistor
- resistor pattern
- lift
- metal
- adhere
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Weting (AREA)
Abstract
PURPOSE: To prevent ohmic contact forming defects in the next lift-off process by burying metal into a contact aperture part in the process where a metallic wiring pattern of an integrated circuit is formed by the lift-off method.
CONSTITUTION: A photo resistor pattern is formed on insulating film 2 and is used as a mask to form diffusion layer 3, which will be brought into ohmic contact with a metallic wiring layer, in semiconductor substrate 1. The photo resistor pattern above is left as it is, and metal 5 is caused to adhere to all the surface, and the photo resistor pattern is removed. Next, photo resistor pattern 6 is formed by the lift-off method, and metal is caused to adhere to all the surface, and photo resistor pattern 6 is removed.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62578A JPS5493971A (en) | 1978-01-06 | 1978-01-06 | Production of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62578A JPS5493971A (en) | 1978-01-06 | 1978-01-06 | Production of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5493971A true JPS5493971A (en) | 1979-07-25 |
Family
ID=11478902
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62578A Pending JPS5493971A (en) | 1978-01-06 | 1978-01-06 | Production of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5493971A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57153447A (en) * | 1981-03-17 | 1982-09-22 | Nec Corp | Forming method for multilayer wiring |
-
1978
- 1978-01-06 JP JP62578A patent/JPS5493971A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57153447A (en) * | 1981-03-17 | 1982-09-22 | Nec Corp | Forming method for multilayer wiring |
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