JPS5676537A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS5676537A JPS5676537A JP15341979A JP15341979A JPS5676537A JP S5676537 A JPS5676537 A JP S5676537A JP 15341979 A JP15341979 A JP 15341979A JP 15341979 A JP15341979 A JP 15341979A JP S5676537 A JPS5676537 A JP S5676537A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- insulating film
- amorphous
- manufacture
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/32105—Oxidation of silicon-containing layers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Formation Of Insulating Films (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15341979A JPS5676537A (en) | 1979-11-27 | 1979-11-27 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15341979A JPS5676537A (en) | 1979-11-27 | 1979-11-27 | Manufacture of semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5676537A true JPS5676537A (en) | 1981-06-24 |
JPS6211781B2 JPS6211781B2 (enrdf_load_stackoverflow) | 1987-03-14 |
Family
ID=15562082
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15341979A Granted JPS5676537A (en) | 1979-11-27 | 1979-11-27 | Manufacture of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5676537A (enrdf_load_stackoverflow) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5878465A (ja) * | 1981-11-04 | 1983-05-12 | Toshiba Corp | 半導体装置の製造方法 |
FR2536208A1 (fr) * | 1982-11-12 | 1984-05-18 | Rca Corp | Procede de formation de bioxyde de silicium et dispositif a semi-conducteurs avec une couche de bioxyde de silicium |
JPS59127841A (ja) * | 1983-01-12 | 1984-07-23 | Nippon Telegr & Teleph Corp <Ntt> | 半導体装置の製造方法 |
JPS59184547A (ja) * | 1983-04-04 | 1984-10-19 | Agency Of Ind Science & Technol | 半導体装置及びその製造方法 |
JPS63502470A (ja) * | 1986-02-25 | 1988-09-14 | アメリカン テレフォン アンド テレグラフ カムパニ− | 誘電体薄層を有する装置の製造方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS504314A (enrdf_load_stackoverflow) * | 1973-05-17 | 1975-01-17 | ||
JPS5436181A (en) * | 1977-08-26 | 1979-03-16 | Fujitsu Ltd | Manufacture for semiconductor device |
JPS54128678A (en) * | 1978-03-30 | 1979-10-05 | Toshiba Corp | Forming method of insulation film |
-
1979
- 1979-11-27 JP JP15341979A patent/JPS5676537A/ja active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS504314A (enrdf_load_stackoverflow) * | 1973-05-17 | 1975-01-17 | ||
JPS5436181A (en) * | 1977-08-26 | 1979-03-16 | Fujitsu Ltd | Manufacture for semiconductor device |
JPS54128678A (en) * | 1978-03-30 | 1979-10-05 | Toshiba Corp | Forming method of insulation film |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5878465A (ja) * | 1981-11-04 | 1983-05-12 | Toshiba Corp | 半導体装置の製造方法 |
FR2536208A1 (fr) * | 1982-11-12 | 1984-05-18 | Rca Corp | Procede de formation de bioxyde de silicium et dispositif a semi-conducteurs avec une couche de bioxyde de silicium |
JPS59103347A (ja) * | 1982-11-12 | 1984-06-14 | ゼネラル・エレクトリック・カンパニイ | シリコン層上に2酸化シリコンの絶縁誘電体層を有する半導体装置とその製造法 |
JPS59127841A (ja) * | 1983-01-12 | 1984-07-23 | Nippon Telegr & Teleph Corp <Ntt> | 半導体装置の製造方法 |
JPS59184547A (ja) * | 1983-04-04 | 1984-10-19 | Agency Of Ind Science & Technol | 半導体装置及びその製造方法 |
JPS63502470A (ja) * | 1986-02-25 | 1988-09-14 | アメリカン テレフォン アンド テレグラフ カムパニ− | 誘電体薄層を有する装置の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JPS6211781B2 (enrdf_load_stackoverflow) | 1987-03-14 |
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