JPS5641096A - Low melting point cu-mn system soldering material having excellent wetting property and fluidity - Google Patents

Low melting point cu-mn system soldering material having excellent wetting property and fluidity

Info

Publication number
JPS5641096A
JPS5641096A JP11598179A JP11598179A JPS5641096A JP S5641096 A JPS5641096 A JP S5641096A JP 11598179 A JP11598179 A JP 11598179A JP 11598179 A JP11598179 A JP 11598179A JP S5641096 A JPS5641096 A JP S5641096A
Authority
JP
Japan
Prior art keywords
fluidity
melting point
soldering material
low melting
wetting property
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11598179A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6216749B2 (enrdf_load_stackoverflow
Inventor
Masaki Morikawa
Hideaki Yoshida
Kunio Kishida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Metal Corp
Original Assignee
Mitsubishi Metal Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Metal Corp filed Critical Mitsubishi Metal Corp
Priority to JP11598179A priority Critical patent/JPS5641096A/ja
Publication of JPS5641096A publication Critical patent/JPS5641096A/ja
Publication of JPS6216749B2 publication Critical patent/JPS6216749B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/302—Cu as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Ceramic Products (AREA)
  • Conductive Materials (AREA)
JP11598179A 1979-09-10 1979-09-10 Low melting point cu-mn system soldering material having excellent wetting property and fluidity Granted JPS5641096A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11598179A JPS5641096A (en) 1979-09-10 1979-09-10 Low melting point cu-mn system soldering material having excellent wetting property and fluidity

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11598179A JPS5641096A (en) 1979-09-10 1979-09-10 Low melting point cu-mn system soldering material having excellent wetting property and fluidity

Publications (2)

Publication Number Publication Date
JPS5641096A true JPS5641096A (en) 1981-04-17
JPS6216749B2 JPS6216749B2 (enrdf_load_stackoverflow) 1987-04-14

Family

ID=14675913

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11598179A Granted JPS5641096A (en) 1979-09-10 1979-09-10 Low melting point cu-mn system soldering material having excellent wetting property and fluidity

Country Status (1)

Country Link
JP (1) JPS5641096A (enrdf_load_stackoverflow)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012502189A (ja) * 2008-09-10 2012-01-26 ピーエムエックス・インダストリーズ・インコーポレーテッド 低下したニッケル含有率を有する白色銅合金
JP2012532759A (ja) * 2009-07-08 2012-12-20 ベルケンホフ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング シートのろう付け補助材
CN103074516A (zh) * 2013-01-28 2013-05-01 江西理工大学 一种低镍无铅易切削白铜及其制备方法
JP7167385B1 (ja) * 2021-06-28 2022-11-08 古河電気工業株式会社 銅合金材ならびにそれを用いた抵抗器用抵抗材料および抵抗器
WO2023276906A1 (ja) * 2021-06-28 2023-01-05 古河電気工業株式会社 銅合金材ならびにそれを用いた抵抗器用抵抗材料および抵抗器
WO2023276904A1 (ja) * 2021-06-28 2023-01-05 古河電気工業株式会社 銅合金材ならびにそれを用いた抵抗器用抵抗材料および抵抗器
WO2023276905A1 (ja) * 2021-06-28 2023-01-05 古河電気工業株式会社 銅合金材ならびにそれを用いた抵抗器用抵抗材料および抵抗器

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012502189A (ja) * 2008-09-10 2012-01-26 ピーエムエックス・インダストリーズ・インコーポレーテッド 低下したニッケル含有率を有する白色銅合金
JP2012532759A (ja) * 2009-07-08 2012-12-20 ベルケンホフ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング シートのろう付け補助材
CN103074516A (zh) * 2013-01-28 2013-05-01 江西理工大学 一种低镍无铅易切削白铜及其制备方法
JP7167385B1 (ja) * 2021-06-28 2022-11-08 古河電気工業株式会社 銅合金材ならびにそれを用いた抵抗器用抵抗材料および抵抗器
WO2023276906A1 (ja) * 2021-06-28 2023-01-05 古河電気工業株式会社 銅合金材ならびにそれを用いた抵抗器用抵抗材料および抵抗器
WO2023276904A1 (ja) * 2021-06-28 2023-01-05 古河電気工業株式会社 銅合金材ならびにそれを用いた抵抗器用抵抗材料および抵抗器
WO2023276905A1 (ja) * 2021-06-28 2023-01-05 古河電気工業株式会社 銅合金材ならびにそれを用いた抵抗器用抵抗材料および抵抗器
JP7214930B1 (ja) * 2021-06-28 2023-01-30 古河電気工業株式会社 銅合金材ならびにそれを用いた抵抗器用抵抗材料および抵抗器
JP7214931B1 (ja) * 2021-06-28 2023-01-30 古河電気工業株式会社 銅合金材ならびにそれを用いた抵抗器用抵抗材料および抵抗器
CN117157419A (zh) * 2021-06-28 2023-12-01 古河电气工业株式会社 铜合金材料以及使用其的电阻器用电阻材料及电阻器
TWI835180B (zh) * 2021-06-28 2024-03-11 日商古河電氣工業股份有限公司 銅合金材料以及使用該銅合金材料的電阻器用電阻材料及電阻器

Also Published As

Publication number Publication date
JPS6216749B2 (enrdf_load_stackoverflow) 1987-04-14

Similar Documents

Publication Publication Date Title
JPS55134160A (en) Fe alloy with superior molten zinc erosion resistance
JPS5641096A (en) Low melting point cu-mn system soldering material having excellent wetting property and fluidity
JPS56136951A (en) Brazing al material
JPS56165591A (en) Low melting point cu-mn base alloy brazing filler metal having good wetting property
JPS56169746A (en) Mischmetal-calcium base alloy for hydorogen occllision
JPS57158350A (en) Aluminum alloy clad material with pitting corrosion resistance
JPS57171599A (en) Low melting point cu-ag system alloy solder with excellent wetting property
JPS54121247A (en) Innert gas shield arc welding wire material for nickel- containing steel
ES8602149A1 (es) Procedimiento para fabricar una aleacion a base de aluminio.
JPS5760046A (en) Aluminum alloy for brazing
JPS6415350A (en) Fe-base sintered alloy excellent in sliding characteristic
JPS5776171A (en) Body material for metal band saw excellent in fatigue strength and weldability
JPS55152153A (en) Invar alloy having good welding property
JPS569095A (en) Low melting point hard solder material
JPS56127742A (en) Cu-mn alloy solder material free from generation of pinhole deficiency
JPS5471748A (en) Brazing filler metal
JPS54155139A (en) Wire for uncovered arc welding
JPS5767142A (en) Low-temperature aluminum solder
JPS6479346A (en) Sea-water-resisting steel
JPS57100892A (en) Welding wire for cr-mo type heat resistant steel
JPS57140858A (en) Aluminum killed steel for low temperature use with superior critical cod characteristic at weld zone
JPS55131159A (en) High tensile low alloy steel for steel pipe
JPS5658941A (en) Solder alloy for sintered alloy
JPS56154298A (en) High ni alloy type welding wire used for low-temperature steel
JPS56169755A (en) Heat-resisting alloy