JPS6216749B2 - - Google Patents
Info
- Publication number
- JPS6216749B2 JPS6216749B2 JP11598179A JP11598179A JPS6216749B2 JP S6216749 B2 JPS6216749 B2 JP S6216749B2 JP 11598179 A JP11598179 A JP 11598179A JP 11598179 A JP11598179 A JP 11598179A JP S6216749 B2 JPS6216749 B2 JP S6216749B2
- Authority
- JP
- Japan
- Prior art keywords
- brazing
- filler metal
- brazing filler
- melting point
- fluidity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/302—Cu as the principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Ceramic Products (AREA)
- Conductive Materials (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11598179A JPS5641096A (en) | 1979-09-10 | 1979-09-10 | Low melting point cu-mn system soldering material having excellent wetting property and fluidity |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11598179A JPS5641096A (en) | 1979-09-10 | 1979-09-10 | Low melting point cu-mn system soldering material having excellent wetting property and fluidity |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5641096A JPS5641096A (en) | 1981-04-17 |
JPS6216749B2 true JPS6216749B2 (enrdf_load_stackoverflow) | 1987-04-14 |
Family
ID=14675913
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11598179A Granted JPS5641096A (en) | 1979-09-10 | 1979-09-10 | Low melting point cu-mn system soldering material having excellent wetting property and fluidity |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5641096A (enrdf_load_stackoverflow) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA2736881A1 (en) * | 2008-09-10 | 2010-03-18 | Pmx Industries Inc. | White-colored copper alloy with reduced nickel content |
DE102009032371A1 (de) * | 2009-07-08 | 2011-01-13 | Berkenhoff Gmbh | Zusatzwerkstoff zum Löten von Stahlblechen |
CN103074516A (zh) * | 2013-01-28 | 2013-05-01 | 江西理工大学 | 一种低镍无铅易切削白铜及其制备方法 |
CN117120645A (zh) * | 2021-06-28 | 2023-11-24 | 古河电气工业株式会社 | 铜合金材料以及使用其的电阻器用电阻材料及电阻器 |
KR20240026277A (ko) * | 2021-06-28 | 2024-02-27 | 후루카와 덴키 고교 가부시키가이샤 | 구리 합금재와, 이를 이용한 저항기용 저항 재료 및 저항기 |
WO2023276906A1 (ja) * | 2021-06-28 | 2023-01-05 | 古河電気工業株式会社 | 銅合金材ならびにそれを用いた抵抗器用抵抗材料および抵抗器 |
WO2023276904A1 (ja) * | 2021-06-28 | 2023-01-05 | 古河電気工業株式会社 | 銅合金材ならびにそれを用いた抵抗器用抵抗材料および抵抗器 |
-
1979
- 1979-09-10 JP JP11598179A patent/JPS5641096A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5641096A (en) | 1981-04-17 |