JPS56140655A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS56140655A JPS56140655A JP4196180A JP4196180A JPS56140655A JP S56140655 A JPS56140655 A JP S56140655A JP 4196180 A JP4196180 A JP 4196180A JP 4196180 A JP4196180 A JP 4196180A JP S56140655 A JPS56140655 A JP S56140655A
- Authority
- JP
- Japan
- Prior art keywords
- masks
- poly
- etched
- oxide film
- source
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/0123—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs
- H10D84/0126—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs
- H10D84/0165—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs the components including complementary IGFETs, e.g. CMOS devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/02—Manufacture or treatment characterised by using material-based technologies
- H10D84/03—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
- H10D84/038—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
Landscapes
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4196180A JPS56140655A (en) | 1980-04-02 | 1980-04-02 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4196180A JPS56140655A (en) | 1980-04-02 | 1980-04-02 | Manufacture of semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56140655A true JPS56140655A (en) | 1981-11-04 |
JPS6129551B2 JPS6129551B2 (enrdf_load_stackoverflow) | 1986-07-07 |
Family
ID=12622777
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4196180A Granted JPS56140655A (en) | 1980-04-02 | 1980-04-02 | Manufacture of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56140655A (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6342161A (ja) * | 1986-08-07 | 1988-02-23 | Toshiba Corp | Cmos型半導体装置の製造方法 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04216226A (ja) * | 1990-12-17 | 1992-08-06 | Tokyo Electric Co Ltd | 受信信号検出装置 |
JPH0548492A (ja) * | 1991-08-09 | 1993-02-26 | Uchu Tsushin Kiso Gijutsu Kenkyusho:Kk | 送受信装置 |
-
1980
- 1980-04-02 JP JP4196180A patent/JPS56140655A/ja active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6342161A (ja) * | 1986-08-07 | 1988-02-23 | Toshiba Corp | Cmos型半導体装置の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JPS6129551B2 (enrdf_load_stackoverflow) | 1986-07-07 |
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