JPS57155769A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS57155769A JPS57155769A JP56041323A JP4132381A JPS57155769A JP S57155769 A JPS57155769 A JP S57155769A JP 56041323 A JP56041323 A JP 56041323A JP 4132381 A JP4132381 A JP 4132381A JP S57155769 A JPS57155769 A JP S57155769A
- Authority
- JP
- Japan
- Prior art keywords
- region
- oxide film
- film
- ion implantation
- gate oxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 4
- 238000005468 ion implantation Methods 0.000 abstract 3
- 238000000034 method Methods 0.000 abstract 3
- 229910052681 coesite Inorganic materials 0.000 abstract 2
- 229910052906 cristobalite Inorganic materials 0.000 abstract 2
- 230000003647 oxidation Effects 0.000 abstract 2
- 238000007254 oxidation reaction Methods 0.000 abstract 2
- 239000000377 silicon dioxide Substances 0.000 abstract 2
- 235000012239 silicon dioxide Nutrition 0.000 abstract 2
- 229910052682 stishovite Inorganic materials 0.000 abstract 2
- 229910052905 tridymite Inorganic materials 0.000 abstract 2
- 229910052581 Si3N4 Inorganic materials 0.000 abstract 1
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 238000002513 implantation Methods 0.000 abstract 1
- 239000012535 impurity Substances 0.000 abstract 1
- 230000000873 masking effect Effects 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
- H01L27/085—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only
- H01L27/088—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Element Separation (AREA)
Abstract
PURPOSE:To form a high pressure-resistant MOS IC on a shallow impurity diffused layer by a method wherein a channel cut region is isolated from a diffused region, and a gate oxide film is formed by two times of growth of SiO2 to increase masking processes by one step for the formation of a diffused layer. CONSTITUTION:The SiO2 film 23 is formed on a p type Si substrate 1 with a pattern consisting of Si3N4 film 24 mounted implantation thereon, and the p<+> channel cut region 2 is formed by B ion implantation with resist film 25 as a mask. Next, the p<++> channel cut region 3 is formed by another B<+> ion implantation with the resist film 25 as a mask. Thereafter, a field oxide film 4 is formed by selective oxidation method. Irepresents for a low pressure-resistant element forming region; II represents for a high pressure-resistant element forming region. Next, the whole surface is oxidized further to form the thin gate oxide film 5 and thick gate oxide film 6 by another oxidation on the whole surface after the removal of the oxide film on the regionI. For the rest, an n<+> region 11 and n<-> region 8 are formed by ion implantation by means of the resist film 9.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56041323A JPS57155769A (en) | 1981-03-20 | 1981-03-20 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56041323A JPS57155769A (en) | 1981-03-20 | 1981-03-20 | Manufacture of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57155769A true JPS57155769A (en) | 1982-09-25 |
Family
ID=12605308
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP56041323A Pending JPS57155769A (en) | 1981-03-20 | 1981-03-20 | Manufacture of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57155769A (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61218164A (en) * | 1985-03-25 | 1986-09-27 | Hitachi Ltd | Semiconductor integrated circuit device |
JPS6219757U (en) * | 1985-07-19 | 1987-02-05 | ||
JPH01120033A (en) * | 1987-11-02 | 1989-05-12 | Hitachi Ltd | Semiconductor device |
DE3915728A1 (en) * | 1988-09-08 | 1990-03-22 | Nt Inc | CUTTING KNIFE |
US5016077A (en) * | 1985-08-26 | 1991-05-14 | Kabushiki Kaisha Toshiba | Insulated gate type semiconductor device and method of manufacturing the same |
EP0545074A2 (en) * | 1991-11-29 | 1993-06-09 | STMicroelectronics S.r.l. | Method for producing electrically erasable and programmable read-only memory cells with a single polysilicon level |
US5338693A (en) * | 1987-01-08 | 1994-08-16 | International Rectifier Corporation | Process for manufacture of radiation resistant power MOSFET and radiation resistant power MOSFET |
US5831318A (en) * | 1996-07-25 | 1998-11-03 | International Rectifier Corporation | Radhard mosfet with thick gate oxide and deep channel region |
-
1981
- 1981-03-20 JP JP56041323A patent/JPS57155769A/en active Pending
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61218164A (en) * | 1985-03-25 | 1986-09-27 | Hitachi Ltd | Semiconductor integrated circuit device |
JPS6219757U (en) * | 1985-07-19 | 1987-02-05 | ||
US5016077A (en) * | 1985-08-26 | 1991-05-14 | Kabushiki Kaisha Toshiba | Insulated gate type semiconductor device and method of manufacturing the same |
US5338693A (en) * | 1987-01-08 | 1994-08-16 | International Rectifier Corporation | Process for manufacture of radiation resistant power MOSFET and radiation resistant power MOSFET |
JPH01120033A (en) * | 1987-11-02 | 1989-05-12 | Hitachi Ltd | Semiconductor device |
DE3915728A1 (en) * | 1988-09-08 | 1990-03-22 | Nt Inc | CUTTING KNIFE |
EP0545074A2 (en) * | 1991-11-29 | 1993-06-09 | STMicroelectronics S.r.l. | Method for producing electrically erasable and programmable read-only memory cells with a single polysilicon level |
US5367483A (en) * | 1991-11-29 | 1994-11-22 | Sgs-Thomson Microelectronics S.R.L. | Electrically erasable and programmable read-only memory cells with a single polysilicon level and method for producing the same |
US5553017A (en) * | 1991-11-29 | 1996-09-03 | Sgs-Thomson Microelectronics S.R.L. | Electrically erasable and programmable read-only memory cells with a single polysilicon level and method for producing the same |
US5831318A (en) * | 1996-07-25 | 1998-11-03 | International Rectifier Corporation | Radhard mosfet with thick gate oxide and deep channel region |
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