JPS5591145A - Production of ceramic package - Google Patents
Production of ceramic packageInfo
- Publication number
- JPS5591145A JPS5591145A JP16116878A JP16116878A JPS5591145A JP S5591145 A JPS5591145 A JP S5591145A JP 16116878 A JP16116878 A JP 16116878A JP 16116878 A JP16116878 A JP 16116878A JP S5591145 A JPS5591145 A JP S5591145A
- Authority
- JP
- Japan
- Prior art keywords
- recess
- cap
- ray
- ceramic
- ceramic base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
- H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
- H01L23/556—Protection against radiation, e.g. light or electromagnetic waves against alpha rays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/15165—Monolayer substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
- H01L2924/1617—Cavity coating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/953—Making radiation resistant device
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Die Bonding (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16116878A JPS5591145A (en) | 1978-12-28 | 1978-12-28 | Production of ceramic package |
US06/105,196 US4323405A (en) | 1978-12-28 | 1979-12-19 | Casing having a layer for protecting a semiconductor memory to be sealed therein against alpha particles and a method of manufacturing same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16116878A JPS5591145A (en) | 1978-12-28 | 1978-12-28 | Production of ceramic package |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5591145A true JPS5591145A (en) | 1980-07-10 |
JPS5725978B2 JPS5725978B2 (ja) | 1982-06-02 |
Family
ID=15729879
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16116878A Granted JPS5591145A (en) | 1978-12-28 | 1978-12-28 | Production of ceramic package |
Country Status (2)
Country | Link |
---|---|
US (1) | US4323405A (ja) |
JP (1) | JPS5591145A (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5598846A (en) * | 1979-01-22 | 1980-07-28 | Nippon Telegr & Teleph Corp <Ntt> | Semiconductor device |
JPS55123149A (en) * | 1979-03-15 | 1980-09-22 | Fujitsu Ltd | Semiconductor device |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55163850A (en) * | 1979-06-08 | 1980-12-20 | Fujitsu Ltd | Semiconductor device |
JPS6015152B2 (ja) * | 1980-01-09 | 1985-04-17 | 株式会社日立製作所 | 樹脂封止半導体メモリ装置 |
JPS56100463A (en) * | 1980-01-14 | 1981-08-12 | Toshiba Corp | Semiconductor memory device |
US4975762A (en) * | 1981-06-11 | 1990-12-04 | General Electric Ceramics, Inc. | Alpha-particle-emitting ceramic composite cover |
US4423548A (en) * | 1981-07-06 | 1984-01-03 | Motorola, Inc. | Method for protecting a semiconductor device from radiation indirect failures |
US4468411A (en) * | 1982-04-05 | 1984-08-28 | Motorola, Inc. | Method for providing alpha particle protection for an integrated circuit die |
US4594770A (en) * | 1982-07-15 | 1986-06-17 | Olin Corporation | Method of making semiconductor casing |
FR2547113B1 (fr) * | 1983-06-03 | 1986-11-07 | Inf Milit Spatiale Aeronaut | Boitier d'encapsulation de composant electronique, durci vis-a-vis des radiations |
JPS6012744A (ja) * | 1983-07-01 | 1985-01-23 | Hitachi Ltd | 半導体装置 |
JPS60204637A (ja) * | 1984-03-19 | 1985-10-16 | Nippon Electric Glass Co Ltd | 低融点封着用組成物 |
US4839716A (en) * | 1987-06-01 | 1989-06-13 | Olin Corporation | Semiconductor packaging |
EP0308749A3 (de) * | 1987-09-25 | 1990-07-11 | Siemens Aktiengesellschaft | Elektrooptische Baugruppe |
US4953002A (en) * | 1988-03-31 | 1990-08-28 | Honeywell Inc. | Semiconductor device housing with magnetic field protection |
JP2572823B2 (ja) * | 1988-09-22 | 1997-01-16 | 日本碍子株式会社 | セラミック接合体 |
US5278429A (en) * | 1989-12-19 | 1994-01-11 | Fujitsu Limited | Semiconductor device having improved adhesive structure and method of producing same |
US5959247A (en) * | 1997-07-22 | 1999-09-28 | Armstrong; Joseph H. | Low cost protective coating and method for a die-on-board electronic assembly |
US6515352B1 (en) * | 2000-09-25 | 2003-02-04 | Micron Technology, Inc. | Shielding arrangement to protect a circuit from stray magnetic fields |
US6531759B2 (en) * | 2001-02-06 | 2003-03-11 | International Business Machines Corporation | Alpha particle shield for integrated circuit |
US6906396B2 (en) * | 2002-01-15 | 2005-06-14 | Micron Technology, Inc. | Magnetic shield for integrated circuit packaging |
DE10229038B4 (de) * | 2002-06-28 | 2013-08-14 | Robert Bosch Gmbh | Verkapptes Mikrostrukturbauelement mit Hochfrequenzdurchführung |
US7191516B2 (en) * | 2003-07-16 | 2007-03-20 | Maxwell Technologies, Inc. | Method for shielding integrated circuit devices |
EP2112471A1 (fr) * | 2008-04-22 | 2009-10-28 | Microcomponents AG | Dispositif de montage pour composant électronique |
US8288177B2 (en) * | 2010-08-17 | 2012-10-16 | International Business Machines Corporation | SER testing for an IC chip using hot underfill |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5588356A (en) * | 1978-12-27 | 1980-07-04 | Hitachi Ltd | Semiconductor device |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3706010A (en) * | 1971-08-20 | 1972-12-12 | Singer Co | Packaging structure having cooling means for a multiplicity of hermetic modules for integrated circuit chips |
GB1327352A (en) * | 1971-10-02 | 1973-08-22 | Kyoto Ceramic | Semiconductor device |
US4032350A (en) * | 1973-03-12 | 1977-06-28 | Owens-Illinois, Inc. | Printing paste vehicle, gold dispensing paste and method of using the paste in the manufacture of microelectronic circuitry components |
US4099200A (en) * | 1976-03-26 | 1978-07-04 | Raytheon Company | Package for semiconductor beam lead devices |
US4034469A (en) * | 1976-09-03 | 1977-07-12 | Ibm Corporation | Method of making conduction-cooled circuit package |
US4142203A (en) * | 1976-12-20 | 1979-02-27 | Avx Corporation | Method of assembling a hermetically sealed semiconductor unit |
-
1978
- 1978-12-28 JP JP16116878A patent/JPS5591145A/ja active Granted
-
1979
- 1979-12-19 US US06/105,196 patent/US4323405A/en not_active Expired - Lifetime
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5588356A (en) * | 1978-12-27 | 1980-07-04 | Hitachi Ltd | Semiconductor device |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5598846A (en) * | 1979-01-22 | 1980-07-28 | Nippon Telegr & Teleph Corp <Ntt> | Semiconductor device |
JPS5718344B2 (ja) * | 1979-01-22 | 1982-04-16 | ||
JPS55123149A (en) * | 1979-03-15 | 1980-09-22 | Fujitsu Ltd | Semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
US4323405A (en) | 1982-04-06 |
JPS5725978B2 (ja) | 1982-06-02 |
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