JPS54158863A - Integrated-circuit device - Google Patents

Integrated-circuit device

Info

Publication number
JPS54158863A
JPS54158863A JP6796778A JP6796778A JPS54158863A JP S54158863 A JPS54158863 A JP S54158863A JP 6796778 A JP6796778 A JP 6796778A JP 6796778 A JP6796778 A JP 6796778A JP S54158863 A JPS54158863 A JP S54158863A
Authority
JP
Japan
Prior art keywords
mounting part
leads
circumference
holding
current leaking
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6796778A
Other languages
Japanese (ja)
Other versions
JPS6156619B2 (en
Inventor
Masakazu Matsushima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP6796778A priority Critical patent/JPS54158863A/en
Publication of JPS54158863A publication Critical patent/JPS54158863A/en
Publication of JPS6156619B2 publication Critical patent/JPS6156619B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48253—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a potential ring of the item

Abstract

PURPOSE: To prevent bad influence of a current leaking to the mounting part of an IC element, and also to increase the degree of freedom in terms of design as well as free derivation of the lowest potential, by providing an outer circumference part which comes in contact with the mounting part.
CONSTITUTION: On the surface of frame 11 made of ceramic such as alumina and beryllia, mounting part 12 of a metallized layer is formed, on which IC element 13 is fitted. At the circumference of mounting part 12, external leads 14 are wired with their terminals gathered and holding lead 15 is connected to mounting part 12. Mounting part 12 is also provided at its circumference with outer external part 17 connecting to mount part 12 and holding leads 15. In this constitution, a current leaking from element 13 to mounting part 12 is by-passed by way of outer circumference part 17 and holding leads 15. As a result, no current leaking toward mounting part 12 is fed back to element 13. Further, a lowest-potential electrode, arranged at any position of the mounting part, can be connected to external leads.
COPYRIGHT: (C)1979,JPO&Japio
JP6796778A 1978-06-05 1978-06-05 Integrated-circuit device Granted JPS54158863A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6796778A JPS54158863A (en) 1978-06-05 1978-06-05 Integrated-circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6796778A JPS54158863A (en) 1978-06-05 1978-06-05 Integrated-circuit device

Publications (2)

Publication Number Publication Date
JPS54158863A true JPS54158863A (en) 1979-12-15
JPS6156619B2 JPS6156619B2 (en) 1986-12-03

Family

ID=13360244

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6796778A Granted JPS54158863A (en) 1978-06-05 1978-06-05 Integrated-circuit device

Country Status (1)

Country Link
JP (1) JPS54158863A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4663650A (en) * 1984-05-02 1987-05-05 Gte Products Corporation Packaged integrated circuit chip

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4663650A (en) * 1984-05-02 1987-05-05 Gte Products Corporation Packaged integrated circuit chip

Also Published As

Publication number Publication date
JPS6156619B2 (en) 1986-12-03

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