JPS55162234A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS55162234A JPS55162234A JP7035079A JP7035079A JPS55162234A JP S55162234 A JPS55162234 A JP S55162234A JP 7035079 A JP7035079 A JP 7035079A JP 7035079 A JP7035079 A JP 7035079A JP S55162234 A JPS55162234 A JP S55162234A
- Authority
- JP
- Japan
- Prior art keywords
- film
- substrate
- boundary
- ion injection
- irradiating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
Abstract
PURPOSE:To eliminate O2 shortage regions on the boundary and at the same time to eliminate loss or damage due to ion injection by the method wherein, when SiO2 film is formed on the surface of Si substrate, O2 ions are injected into the boundary and it is annealed by irradiating a light beam or an electron beam. CONSTITUTION:When SiO2 film 2 is grown on the surface of Si substrate 1 by heat-oxidization, region 3 lacking O2 is produced in the boundary between the lower surface of film 2 and the upper surface of substrate 1. For this reason, to supplement O2 shortage, O2 ions are injected. Subsequently, region 3 is removed by irradiating an Ar laser beam for a short time. Thus, the substrate and film 2 are integrated, and at the same time, losses and damages caused by the ion injection are repaired. Corresponding to the thickness of film 2 formed at this time, the amount of ion injection and the laser energy density are properly selected.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7035079A JPS55162234A (en) | 1979-06-05 | 1979-06-05 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7035079A JPS55162234A (en) | 1979-06-05 | 1979-06-05 | Manufacture of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS55162234A true JPS55162234A (en) | 1980-12-17 |
Family
ID=13428886
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7035079A Pending JPS55162234A (en) | 1979-06-05 | 1979-06-05 | Manufacture of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55162234A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57153429A (en) * | 1981-03-17 | 1982-09-22 | Nec Corp | Manufacture of semiconductor device |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5160453A (en) * | 1974-11-22 | 1976-05-26 | Hitachi Ltd | Shirikonsankamaku * sio2 * noanteikaho |
-
1979
- 1979-06-05 JP JP7035079A patent/JPS55162234A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5160453A (en) * | 1974-11-22 | 1976-05-26 | Hitachi Ltd | Shirikonsankamaku * sio2 * noanteikaho |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57153429A (en) * | 1981-03-17 | 1982-09-22 | Nec Corp | Manufacture of semiconductor device |
JPH0516174B2 (en) * | 1981-03-17 | 1993-03-03 | Nippon Electric Co |
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