JPS55160446A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS55160446A JPS55160446A JP6761479A JP6761479A JPS55160446A JP S55160446 A JPS55160446 A JP S55160446A JP 6761479 A JP6761479 A JP 6761479A JP 6761479 A JP6761479 A JP 6761479A JP S55160446 A JPS55160446 A JP S55160446A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- sio2
- type
- si3n4
- mask
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Element Separation (AREA)
- Weting (AREA)
- Local Oxidation Of Silicon (AREA)
- Bipolar Transistors (AREA)
Abstract
PURPOSE:To obtain a fine isolation layer in the semiconductor device by laminating Si3N4 and SiO2 on an epitaxial layer on the semiconductor substrate, forming a resist mask thereon, implanting impurity thereon, etching the Si3N4 with the SiO2 as a mask to form openings thereat and heat treating it. CONSTITUTION:The Si3N4 24 and SiO2 25 are superimposed on the N type epitaxial layer 23 of the P type Si substrate 22 having an N<+> type buried layer 21. A resist mask is coated thereon, B ion is implanted on an isolating forming portion to form a P<+> type layer 28, P ion is implanted on a collector connecting layer to form an N<+> type layer 30. Then, openings are perforated at the SiO2 25 with HF gas in heated state, and a residual resist 26 is removed. With the SiO2 25 as a mask openings are perforated at the Si3N4. Thereafter, the SiO2 25 is etched, and the Si substrate surface is etched. When it is subsequently heat treated at high temperature, the B in the layer 28 is diffused to form a P<+> type isolation layer, the P in the layer 30 is diffused to form a collector connecting layer, and an oxide thick film 33 is coated thereon. According to this method, it can form an isolation layer having desired fine size.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6761479A JPS55160446A (en) | 1979-05-31 | 1979-05-31 | Manufacture of semiconductor device |
EP19800301781 EP0020144B1 (en) | 1979-05-31 | 1980-05-29 | Method of producing a semiconductor device |
DE8080301781T DE3071380D1 (en) | 1979-05-31 | 1980-05-29 | Method of producing a semiconductor device |
US06/155,124 US4376664A (en) | 1979-05-31 | 1980-05-30 | Method of producing a semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6761479A JPS55160446A (en) | 1979-05-31 | 1979-05-31 | Manufacture of semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS55160446A true JPS55160446A (en) | 1980-12-13 |
JPS5751978B2 JPS5751978B2 (en) | 1982-11-05 |
Family
ID=13350004
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6761479A Granted JPS55160446A (en) | 1979-05-31 | 1979-05-31 | Manufacture of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55160446A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS583246A (en) * | 1981-06-29 | 1983-01-10 | Fujitsu Ltd | Manufacture of semiconductor device |
JPS58218137A (en) * | 1982-06-11 | 1983-12-19 | Fujitsu Ltd | Manufacture of semiconductor device |
JPS59121951A (en) * | 1982-12-28 | 1984-07-14 | Fujitsu Ltd | Semiconductor device and its manufacture |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04135773U (en) * | 1991-06-10 | 1992-12-17 | 株式会社日本商品開発センター | display display card |
-
1979
- 1979-05-31 JP JP6761479A patent/JPS55160446A/en active Granted
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS583246A (en) * | 1981-06-29 | 1983-01-10 | Fujitsu Ltd | Manufacture of semiconductor device |
JPH0241169B2 (en) * | 1981-06-29 | 1990-09-14 | Fujitsu Ltd | |
JPS58218137A (en) * | 1982-06-11 | 1983-12-19 | Fujitsu Ltd | Manufacture of semiconductor device |
JPS59121951A (en) * | 1982-12-28 | 1984-07-14 | Fujitsu Ltd | Semiconductor device and its manufacture |
Also Published As
Publication number | Publication date |
---|---|
JPS5751978B2 (en) | 1982-11-05 |
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