JPS55153343A - Semiconductor device and its manufacture - Google Patents
Semiconductor device and its manufactureInfo
- Publication number
- JPS55153343A JPS55153343A JP6123079A JP6123079A JPS55153343A JP S55153343 A JPS55153343 A JP S55153343A JP 6123079 A JP6123079 A JP 6123079A JP 6123079 A JP6123079 A JP 6123079A JP S55153343 A JPS55153343 A JP S55153343A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- alumina
- polycristalline
- tendency
- constitution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Abstract
PURPOSE:To make high integrated circuit available by a method wherein a dielectric isolation layer is formed by an oxide of a metal which have tendency of forming films and lessening of the film thickness. CONSTITUTION:An Al layer 9 which has tendency of forming films is fabricated on a sapphire substrate 1, and resist mask 10 is applied, and after the Al 9 is etched by phosphoric acid, an alumina wall 13 is formed by anodizing. The resist mask 10 is removed, and the Al 9 is removed by phosphoric acid, and on forming of an epitaxial layer 2 between alumina walls 13, a polycristalline Si layer 11 is generated on the alumina wall 13. Next thereto the polycristalline Si layer 11 is removed by grinding or by means of fluoric acid or its induced materials, and the surface of the alumina wall 13 is exposed. After this process an expected element is formed in a singl crystal layer 2. By this constitution in spite of thinness of the film of the dielectric isolation layer 13, an SOS device with high dielectric strength and high integration can be obtained.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6123079A JPS55153343A (en) | 1979-05-18 | 1979-05-18 | Semiconductor device and its manufacture |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6123079A JPS55153343A (en) | 1979-05-18 | 1979-05-18 | Semiconductor device and its manufacture |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS55153343A true JPS55153343A (en) | 1980-11-29 |
Family
ID=13165201
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6123079A Pending JPS55153343A (en) | 1979-05-18 | 1979-05-18 | Semiconductor device and its manufacture |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55153343A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58169964A (en) * | 1982-03-30 | 1983-10-06 | Fujitsu Ltd | Semiconductor device |
US4460413A (en) * | 1980-12-26 | 1984-07-17 | Nippon Telegraph & Telephone Public Corp. | Method of patterning device regions by oxidizing patterned aluminum layer |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5140767A (en) * | 1974-10-03 | 1976-04-05 | Fujitsu Ltd | Handotaisochi no seizohoho |
-
1979
- 1979-05-18 JP JP6123079A patent/JPS55153343A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5140767A (en) * | 1974-10-03 | 1976-04-05 | Fujitsu Ltd | Handotaisochi no seizohoho |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4460413A (en) * | 1980-12-26 | 1984-07-17 | Nippon Telegraph & Telephone Public Corp. | Method of patterning device regions by oxidizing patterned aluminum layer |
JPS58169964A (en) * | 1982-03-30 | 1983-10-06 | Fujitsu Ltd | Semiconductor device |
JPH0332232B2 (en) * | 1982-03-30 | 1991-05-10 | Fujitsu Ltd |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4400411A (en) | Technique of silicon epitaxial refill | |
JPS57204133A (en) | Manufacture of semiconductor integrated circuit | |
JPS55153343A (en) | Semiconductor device and its manufacture | |
JPS57204165A (en) | Manufacture of charge coupling element | |
US3592707A (en) | Precision masking using silicon nitride and silicon oxide | |
JPS643663A (en) | Forming method for fine pattern | |
JPS5772346A (en) | Manufacture of semiconductor device | |
JPS5670644A (en) | Manufacture of semiconductor integrated circuit | |
JPS57130448A (en) | Manufacture of semiconductor device | |
JPS5742143A (en) | Manufacture of semiconductor device | |
JPS5646531A (en) | Manufacture of semiconductor device | |
JPS56111241A (en) | Preparation of semiconductor device | |
JPS5478668A (en) | Manufacture of semiconductor device | |
JPS5676534A (en) | Manufacture of semiconductor device | |
JPS5797629A (en) | Manufacture of semiconductor device | |
JPS5742144A (en) | Manufacture of semiconductor device | |
JPS5679446A (en) | Production of semiconductor device | |
JPS5646582A (en) | Formation of pattern of filmlike article | |
JPS54124687A (en) | Production of semiconductor device | |
JPS57190355A (en) | Semiconductor device | |
JPS556891A (en) | Manufacturing method of semiconductor device | |
JPS6420641A (en) | Manufacture of semiconductor device | |
JPS649639A (en) | Manufacture of insulating film for element isolation of semiconductor device | |
JPS56169346A (en) | Manufacture of semiconductor device | |
JPS5718362A (en) | Semiconductor device and manufacture thereof |