JPS5473529A - Bonding pad forming method for bubble memory chip - Google Patents

Bonding pad forming method for bubble memory chip

Info

Publication number
JPS5473529A
JPS5473529A JP14091977A JP14091977A JPS5473529A JP S5473529 A JPS5473529 A JP S5473529A JP 14091977 A JP14091977 A JP 14091977A JP 14091977 A JP14091977 A JP 14091977A JP S5473529 A JPS5473529 A JP S5473529A
Authority
JP
Japan
Prior art keywords
pad
pattern
memory chip
sio
bonding pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14091977A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5740587B2 (enrdf_load_stackoverflow
Inventor
Niwaji Majima
Mikio Segawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP14091977A priority Critical patent/JPS5473529A/ja
Publication of JPS5473529A publication Critical patent/JPS5473529A/ja
Publication of JPS5740587B2 publication Critical patent/JPS5740587B2/ja
Granted legal-status Critical Current

Links

JP14091977A 1977-11-24 1977-11-24 Bonding pad forming method for bubble memory chip Granted JPS5473529A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14091977A JPS5473529A (en) 1977-11-24 1977-11-24 Bonding pad forming method for bubble memory chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14091977A JPS5473529A (en) 1977-11-24 1977-11-24 Bonding pad forming method for bubble memory chip

Publications (2)

Publication Number Publication Date
JPS5473529A true JPS5473529A (en) 1979-06-12
JPS5740587B2 JPS5740587B2 (enrdf_load_stackoverflow) 1982-08-28

Family

ID=15279858

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14091977A Granted JPS5473529A (en) 1977-11-24 1977-11-24 Bonding pad forming method for bubble memory chip

Country Status (1)

Country Link
JP (1) JPS5473529A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5892242A (ja) * 1981-11-27 1983-06-01 Mitsubishi Electric Corp セラミツク多層基板

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5892242A (ja) * 1981-11-27 1983-06-01 Mitsubishi Electric Corp セラミツク多層基板

Also Published As

Publication number Publication date
JPS5740587B2 (enrdf_load_stackoverflow) 1982-08-28

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