JPH11503566A - 集積再分配経路設定導体、はんだバンプならびにそれらにより形成された構造を形成する方法 - Google Patents
集積再分配経路設定導体、はんだバンプならびにそれらにより形成された構造を形成する方法Info
- Publication number
- JPH11503566A JPH11503566A JP8530317A JP53031796A JPH11503566A JP H11503566 A JPH11503566 A JP H11503566A JP 8530317 A JP8530317 A JP 8530317A JP 53031796 A JP53031796 A JP 53031796A JP H11503566 A JPH11503566 A JP H11503566A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- bump
- metal layer
- under
- solder structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1. 露出部分のある電気接点を含む微小電子基板用のはんだバンプ構造であ って、 前記微小電子基板上にあり、前記電気接点の露出部分に電気的に接触している バンプ下金属層と、 前記微小電子基板に相対して前記バンプ下金属層上にあり、伸長部分と幅広部 分をもつはんだ構造と、から成ることを特徴とする前記はんだバンプ構造。 2. 前記はんだ構造の前記伸長部分は、前記電気接点の前記露出部分に隣接 した第1端部と、前記はんだ構造の前記幅広部分に接合した第2端部とを含む請 求項1に記載のはんだバンプ構造。 3. 前記はんだ構造の前記伸長部分と前記はんだ構造の前記幅広部分の厚さ はどちらも同じ所定の長さである請求項1に記載のはんだバンプ構造。 4. 前記微小電子構造の表面に電気接点パッドを含む微小電子基板上に再分 配経路設定導体を形成する方法であって、 前記表面にバンプ下金属層を形成し、前記電気接点パッドに電気的に接触し、 前記微小電子基板に相対する前記バンプ下金属層上に、伸長部分と幅広部分の あるはんだ構造を形成する工程から構成される前記方法。 5. 前記はんだ構造におけるはんだを前記伸長部分から前記幅広部分に流し て、前記はんだ構造の幅広部分に隆起はんだバンプを、前記はんだ構造の前記伸 長部分にはんだの薄層を形成する工程をさらに含む請求項12に記載の方法。 6. 前記伸長部分が前記電気接点パッド上を延在する請求項12に記載の方 法。 7. 前記はんだ部分は、前記はんだ構造により覆われてない前記バンプ下金 属層の第1部分と、前記はんだ構造により覆われた前記バンプ下金属層の第2部 分とを画定して、はんだ構造を形成する前記工程の後で、前記バンプ下金属層の 前記第1部分を選択的に除去する工程が続く請求項12に記載の方法。 8. 前記はんだ構造は、前記はんだ構造により覆われてない前記バンプ下金 属層の第1部分と、前記はんだ構造により覆われた前記バンプ下金属層の第2部 分とを画定して、前記方法はさらに、 前記バンプ下金属層の前記第1部分にはんだダム層を形成し、 はんだが前記はんだ構造の前記伸長部分から前記はんだ構造の前記幅広部分に 流れて、前記バンプ下金属層の前記幅広部分に隆起はんだバンプを、前記バンプ 下金属層のの伸長部分にはんだの薄層を形成するように前記はんだ構造がはんだ を流す工程を含む請求項12に記載の方法。 9. 前記はんだ構造がはんだを流す前記工程は、前記バンプ下金属層と前記 はんだ構造の間に金属間化合物の領域を形成し、前記金属間化合物は前記金属層 と前記はんだ構造を構成要素として含む請求項16に記載の方法。 10. 前記はんだ構造は、前記はんだ構造により覆われていない前記バンプ 下金属層の第1部分と、前記はんだ構造により覆われている前記バンプ下金属層 の第2部分とを画定し、前記はんだ構造を形成する前記工程は、 前記バンプ下金属層にパターン化マスク層を形成し、前記パターン化マスク層 は前記バンプ下金属層の前記第1部分を覆い、前記バンプ下金属層の前記第2部 分を画定し、 前記バンプ下金属層の前記第2部分に前記はんだ構造を形成し、 前記パターン化マスク層を選択的に除去する工程から構成される請求項12に 記載の方法。
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US41661995A | 1995-04-05 | 1995-04-05 | |
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JPH11503566A true JPH11503566A (ja) | 1999-03-26 |
JP3549208B2 JP3549208B2 (ja) | 2004-08-04 |
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Family Applications (1)
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JP53031796A Expired - Lifetime JP3549208B2 (ja) | 1995-04-05 | 1996-03-21 | 集積再分配経路設定導体、はんだバイプならびにそれらにより形成された構造を形成する方法 |
Country Status (10)
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US (3) | US5892179A (ja) |
EP (1) | EP0819318B1 (ja) |
JP (1) | JP3549208B2 (ja) |
KR (2) | KR100425750B1 (ja) |
CN (1) | CN1179412C (ja) |
AT (1) | ATE240586T1 (ja) |
AU (1) | AU5316996A (ja) |
DE (1) | DE69628161T2 (ja) |
HK (1) | HK1008266A1 (ja) |
WO (1) | WO1996031905A1 (ja) |
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-
1996
- 1996-03-21 JP JP53031796A patent/JP3549208B2/ja not_active Expired - Lifetime
- 1996-03-21 WO PCT/US1996/003751 patent/WO1996031905A1/en active IP Right Grant
- 1996-03-21 CN CNB96193624XA patent/CN1179412C/zh not_active Expired - Fee Related
- 1996-03-21 AT AT96909782T patent/ATE240586T1/de not_active IP Right Cessation
- 1996-03-21 KR KR1019970706975A patent/KR100425750B1/ko not_active IP Right Cessation
- 1996-03-21 DE DE69628161T patent/DE69628161T2/de not_active Expired - Fee Related
- 1996-03-21 EP EP96909782A patent/EP0819318B1/en not_active Expired - Lifetime
- 1996-03-21 AU AU53169/96A patent/AU5316996A/en not_active Abandoned
-
1997
- 1997-10-02 KR KR19977006975A patent/KR19987003571A/ko unknown
- 1997-11-24 US US08/977,258 patent/US5892179A/en not_active Expired - Lifetime
-
1998
- 1998-07-20 HK HK98109292A patent/HK1008266A1/xx not_active IP Right Cessation
-
1999
- 1999-04-05 US US09/286,143 patent/US6329608B1/en not_active Expired - Lifetime
- 1999-04-05 US US09/286,015 patent/US6389691B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
KR100425750B1 (ko) | 2004-07-16 |
JP3549208B2 (ja) | 2004-08-04 |
EP0819318B1 (en) | 2003-05-14 |
AU5316996A (en) | 1996-10-23 |
KR19987003571A (en) | 1998-11-05 |
CN1183169A (zh) | 1998-05-27 |
EP0819318A1 (en) | 1998-01-21 |
ATE240586T1 (de) | 2003-05-15 |
DE69628161T2 (de) | 2004-03-25 |
KR19980703571A (ko) | 1998-11-05 |
US6389691B1 (en) | 2002-05-21 |
US6329608B1 (en) | 2001-12-11 |
US5892179A (en) | 1999-04-06 |
DE69628161D1 (de) | 2003-06-18 |
CN1179412C (zh) | 2004-12-08 |
HK1008266A1 (en) | 1999-05-07 |
WO1996031905A1 (en) | 1996-10-10 |
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