JPH11501696A - ポリマー、金属またはセラミックの表面改質 - Google Patents
ポリマー、金属またはセラミックの表面改質Info
- Publication number
- JPH11501696A JPH11501696A JP8531635A JP53163596A JPH11501696A JP H11501696 A JPH11501696 A JP H11501696A JP 8531635 A JP8531635 A JP 8531635A JP 53163596 A JP53163596 A JP 53163596A JP H11501696 A JPH11501696 A JP H11501696A
- Authority
- JP
- Japan
- Prior art keywords
- ion
- contact angle
- polymer
- sample
- particles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920000642 polymer Polymers 0.000 title claims abstract description 126
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 48
- 239000002184 metal Substances 0.000 title claims abstract description 48
- 239000000919 ceramic Substances 0.000 title claims abstract description 41
- 150000002739 metals Chemical class 0.000 title claims description 16
- 238000012986 modification Methods 0.000 title description 45
- 230000004048 modification Effects 0.000 title description 45
- 239000002245 particle Substances 0.000 claims abstract description 100
- 238000000034 method Methods 0.000 claims abstract description 77
- 238000007664 blowing Methods 0.000 claims abstract description 27
- 230000001678 irradiating effect Effects 0.000 claims abstract description 21
- 150000002500 ions Chemical class 0.000 claims description 147
- 239000007789 gas Substances 0.000 claims description 91
- 229910052760 oxygen Inorganic materials 0.000 claims description 64
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 63
- 239000001301 oxygen Substances 0.000 claims description 60
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 55
- 229910052786 argon Inorganic materials 0.000 claims description 42
- -1 polyethylene terephthalate Polymers 0.000 claims description 41
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 21
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 17
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 17
- 239000000203 mixture Substances 0.000 claims description 13
- 239000004809 Teflon Substances 0.000 claims description 12
- 229920006362 Teflon® Polymers 0.000 claims description 12
- 239000001257 hydrogen Substances 0.000 claims description 11
- 229910052739 hydrogen Inorganic materials 0.000 claims description 11
- 229910052757 nitrogen Inorganic materials 0.000 claims description 10
- 239000004417 polycarbonate Substances 0.000 claims description 10
- 239000004698 Polyethylene Substances 0.000 claims description 8
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 6
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 6
- 229920002379 silicone rubber Polymers 0.000 claims description 6
- 239000004945 silicone rubber Substances 0.000 claims description 6
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 claims description 5
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 5
- 229910002091 carbon monoxide Inorganic materials 0.000 claims description 5
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 4
- 244000043261 Hevea brasiliensis Species 0.000 claims description 4
- 229920000877 Melamine resin Polymers 0.000 claims description 4
- 239000004640 Melamine resin Substances 0.000 claims description 4
- 229920000459 Nitrile rubber Polymers 0.000 claims description 4
- 239000002033 PVDF binder Substances 0.000 claims description 4
- 229930040373 Paraformaldehyde Natural products 0.000 claims description 4
- 239000004952 Polyamide Substances 0.000 claims description 4
- 239000004743 Polypropylene Substances 0.000 claims description 4
- 239000004793 Polystyrene Substances 0.000 claims description 4
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 229910052743 krypton Inorganic materials 0.000 claims description 4
- DNNSSWSSYDEUBZ-UHFFFAOYSA-N krypton atom Chemical compound [Kr] DNNSSWSSYDEUBZ-UHFFFAOYSA-N 0.000 claims description 4
- 229920003052 natural elastomer Polymers 0.000 claims description 4
- 229920001194 natural rubber Polymers 0.000 claims description 4
- 229920002492 poly(sulfone) Polymers 0.000 claims description 4
- 229920002647 polyamide Polymers 0.000 claims description 4
- 229920000515 polycarbonate Polymers 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 229920006324 polyoxymethylene Polymers 0.000 claims description 4
- 229920006380 polyphenylene oxide Polymers 0.000 claims description 4
- 229920001155 polypropylene Polymers 0.000 claims description 4
- 229920002223 polystyrene Polymers 0.000 claims description 4
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 4
- 229920000915 polyvinyl chloride Polymers 0.000 claims description 4
- 239000004800 polyvinyl chloride Substances 0.000 claims description 4
- 229920002981 polyvinylidene fluoride Polymers 0.000 claims description 4
- 229920003048 styrene butadiene rubber Polymers 0.000 claims description 4
- 229920003051 synthetic elastomer Polymers 0.000 claims description 4
- 239000005061 synthetic rubber Substances 0.000 claims description 4
- 239000004642 Polyimide Substances 0.000 claims description 3
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 claims description 3
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 claims description 3
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 claims description 3
- SLGWESQGEUXWJQ-UHFFFAOYSA-N formaldehyde;phenol Chemical compound O=C.OC1=CC=CC=C1 SLGWESQGEUXWJQ-UHFFFAOYSA-N 0.000 claims description 3
- 229920001568 phenolic resin Polymers 0.000 claims description 3
- 229920000573 polyethylene Polymers 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 claims description 2
- 229910021529 ammonia Inorganic materials 0.000 claims description 2
- 229920002301 cellulose acetate Polymers 0.000 claims description 2
- 239000003570 air Substances 0.000 claims 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims 1
- 239000000523 sample Substances 0.000 description 110
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 66
- 230000008859 change Effects 0.000 description 41
- 239000000463 material Substances 0.000 description 41
- 238000012360 testing method Methods 0.000 description 38
- 230000007423 decrease Effects 0.000 description 32
- 125000000524 functional group Chemical group 0.000 description 28
- 238000004833 X-ray photoelectron spectroscopy Methods 0.000 description 25
- 238000004458 analytical method Methods 0.000 description 21
- 239000000853 adhesive Substances 0.000 description 18
- 230000001070 adhesive effect Effects 0.000 description 18
- 238000010884 ion-beam technique Methods 0.000 description 18
- 230000003746 surface roughness Effects 0.000 description 16
- 238000005259 measurement Methods 0.000 description 15
- 229910052799 carbon Inorganic materials 0.000 description 13
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 12
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 12
- 238000004381 surface treatment Methods 0.000 description 12
- 229910052782 aluminium Inorganic materials 0.000 description 11
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 11
- 230000015572 biosynthetic process Effects 0.000 description 11
- 230000000694 effects Effects 0.000 description 11
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 10
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 9
- 238000000576 coating method Methods 0.000 description 9
- 238000005211 surface analysis Methods 0.000 description 9
- VZSRBBMJRBPUNF-UHFFFAOYSA-N 2-(2,3-dihydro-1H-inden-2-ylamino)-N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]pyrimidine-5-carboxamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C(=O)NCCC(N1CC2=C(CC1)NN=N2)=O VZSRBBMJRBPUNF-UHFFFAOYSA-N 0.000 description 8
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 8
- 238000000149 argon plasma sintering Methods 0.000 description 8
- 229910001882 dioxygen Inorganic materials 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 240000002989 Euphorbia neriifolia Species 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 6
- 239000004810 polytetrafluoroethylene Substances 0.000 description 6
- 238000003776 cleavage reaction Methods 0.000 description 5
- 238000007796 conventional method Methods 0.000 description 5
- 238000001035 drying Methods 0.000 description 5
- 238000002474 experimental method Methods 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 5
- 230000007017 scission Effects 0.000 description 5
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 4
- 238000009833 condensation Methods 0.000 description 4
- 230000005494 condensation Effects 0.000 description 4
- 238000012790 confirmation Methods 0.000 description 4
- 230000003247 decreasing effect Effects 0.000 description 4
- 150000002431 hydrogen Chemical class 0.000 description 4
- 239000011261 inert gas Substances 0.000 description 4
- 239000003960 organic solvent Substances 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000007480 spreading Effects 0.000 description 4
- 238000003892 spreading Methods 0.000 description 4
- 238000003786 synthesis reaction Methods 0.000 description 4
- 238000012795 verification Methods 0.000 description 4
- 238000009736 wetting Methods 0.000 description 4
- 230000005495 cold plasma Effects 0.000 description 3
- 238000002715 modification method Methods 0.000 description 3
- 239000000049 pigment Substances 0.000 description 3
- 230000009257 reactivity Effects 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 238000002207 thermal evaporation Methods 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- LDXJRKWFNNFDSA-UHFFFAOYSA-N 2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)-1-[4-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]piperazin-1-yl]ethanone Chemical compound C1CN(CC2=NNN=C21)CC(=O)N3CCN(CC3)C4=CN=C(N=C4)NCC5=CC(=CC=C5)OC(F)(F)F LDXJRKWFNNFDSA-UHFFFAOYSA-N 0.000 description 2
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 2
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 2
- 125000003277 amino group Chemical group 0.000 description 2
- 125000004429 atom Chemical group 0.000 description 2
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 239000004568 cement Substances 0.000 description 2
- 239000003610 charcoal Substances 0.000 description 2
- 238000010835 comparative analysis Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 125000004185 ester group Chemical group 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 230000002209 hydrophobic effect Effects 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- CSJDCSCTVDEHRN-UHFFFAOYSA-N methane;molecular oxygen Chemical compound C.O=O CSJDCSCTVDEHRN-UHFFFAOYSA-N 0.000 description 2
- 238000001000 micrograph Methods 0.000 description 2
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 2
- 239000002861 polymer material Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000012495 reaction gas Substances 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 238000002407 reforming Methods 0.000 description 2
- 238000009877 rendering Methods 0.000 description 2
- 238000007788 roughening Methods 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- KZBUYRJDOAKODT-UHFFFAOYSA-N Chlorine Chemical compound ClCl KZBUYRJDOAKODT-UHFFFAOYSA-N 0.000 description 1
- JYGLAHSAISAEAL-UHFFFAOYSA-N Diphenadione Chemical compound O=C1C2=CC=CC=C2C(=O)C1C(=O)C(C=1C=CC=CC=1)C1=CC=CC=C1 JYGLAHSAISAEAL-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 241001364889 Helius Species 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- MKYBYDHXWVHEJW-UHFFFAOYSA-N N-[1-oxo-1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propan-2-yl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(C(C)NC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 MKYBYDHXWVHEJW-UHFFFAOYSA-N 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- YBCVMFKXIKNREZ-UHFFFAOYSA-N acoh acetic acid Chemical compound CC(O)=O.CC(O)=O YBCVMFKXIKNREZ-UHFFFAOYSA-N 0.000 description 1
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 239000013068 control sample Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 230000005660 hydrophilic surface Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004573 interface analysis Methods 0.000 description 1
- 230000005055 memory storage Effects 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000344 soap Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/16—Surface shaping of articles, e.g. embossing; Apparatus therefor by wave energy or particle radiation, e.g. infrared heating
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/0027—Ion-implantation, ion-irradiation or ion-injection
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/12—Chemical modification
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C10/00—Solid state diffusion of only metal elements or silicon into metallic material surfaces
- C23C10/02—Pretreatment of the material to be coated
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C8/00—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C8/02—Pretreatment of the material to be coated
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C8/00—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C8/06—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using gases
- C23C8/08—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using gases only one element being applied
- C23C8/10—Oxidising
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C8/00—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C8/06—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using gases
- C23C8/08—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using gases only one element being applied
- C23C8/20—Carburising
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C8/00—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C8/06—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using gases
- C23C8/08—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using gases only one element being applied
- C23C8/24—Nitriding
-
- D—TEXTILES; PAPER
- D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
- D06P—DYEING OR PRINTING TEXTILES; DYEING LEATHER, FURS OR SOLID MACROMOLECULAR SUBSTANCES IN ANY FORM
- D06P5/00—Other features in dyeing or printing textiles, or dyeing leather, furs, or solid macromolecular substances in any form
- D06P5/20—Physical treatments affecting dyeing, e.g. ultrasonic or electric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0866—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using particle radiation
- B29C2035/0872—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using particle radiation using ion-radiation, e.g. alpha-rays
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Ceramic Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Health & Medical Sciences (AREA)
- Structural Engineering (AREA)
- Toxicology (AREA)
- Physics & Mathematics (AREA)
- General Chemical & Material Sciences (AREA)
- Medicinal Chemistry (AREA)
- Textile Engineering (AREA)
- Polymers & Plastics (AREA)
- High Energy & Nuclear Physics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
- Physical Vapour Deposition (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1.ポリマー、金属およびセラミックの表面を改質するための方法であって、 真空条件下において、前記表面上に直接的に反応性ガスを吹き込みながら、予め 決められた距離(照射距離)からエネルギーを有するイオン粒子を前記表面上に 照射して、前記表面の接触角を低下させまたは前記表面の接着力を上げること、 を含む方法。 2.前記反応性ガスは、酸素、窒素、水素、アンモニア、一酸化炭素およびそ れらのいずれかのガスの混合物からなる群より選ばれる、請求項1記載の方法。 3.前記反応性ガスの導入量が1〜8ml/分である、請求項1記載の方法。 4.前記ポリマーが、ポリカーボネート、ポリメチルメタクリレート、ポリイ ミド、テフロン、ポリフッ化ビニリデン、ポリエチレンテレフタレート、ポリエ チレン、および、シリコーンゴム、天然ゴム、合成ゴム、セルロースアセテート 、再生アセテート、ポリプロピレン、ポリスチレン、アクリロニトリル−ブタジ エン−スチレンコポリマー、ポリアミド、エポキシ樹脂、ポリ塩化ビニル、ポリ ビニルアルコール、ポリオキシメチレン、ポリフェニレンオキシド、ポリスルホ ン、フェノール−ホルムアルデヒド、メラミン樹脂、アクリロニトリル−ブタジ エンゴム、スチレン−ブタジエンゴム、およびそれらのポリマーの混合物からな る群より選ばれる、請求項1記載の方法。 5.前記エネルギーを有するイオン粒子が、アルゴン、酸素、空気、クリプト ンおよびそれらのいずれかの混合物からなる群より選ばれる、請求項1記載の方 法。 6.前記イオン粒子のエネルギーが0.5KeV〜2.5KeV である、請求項1記載の方法。 7.前記エネルギーを有するイオン粒子の照射量が1x1014〜5x1017イ オン/cm2である、請求項1記載の方法。 8.前記照射距離は、エネルギーを有するイオン粒子が表面上に照射されると きの真空度により決まり、そして、5x10−3〜1x10−6トールの高真空 では25〜55cmであり、そして、10−6トール以上の超高真空では55c m以上であり、そして5x10−3トール以下の低真空では25cm以下である 、請求項1記載の方法。 9.真空下において、ポリマー、金属またはセラミックの表面上に直接的に反 応性ガスを吹き込みながら、エネルギーを有する粒子を前記表面上に照射するこ とにより、前記表面上の接触角が低下され、または、接着力が上げられた表面を 有するポリマー、金属またはセラミック。
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR19950009194 | 1995-04-19 | ||
KR1995/9194 | 1995-04-19 | ||
KR19950017514 | 1995-06-26 | ||
KR1995/17514 | 1995-06-26 | ||
KR1996/2456 | 1996-02-01 | ||
KR19960002456 | 1996-02-01 | ||
PCT/KR1996/000032 WO1996033293A1 (en) | 1995-04-19 | 1996-02-29 | Modification of surfaces of polymers, metal or ceramic |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH11501696A true JPH11501696A (ja) | 1999-02-09 |
JP3213005B2 JP3213005B2 (ja) | 2001-09-25 |
Family
ID=27349166
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP53163596A Expired - Lifetime JP3213005B2 (ja) | 1995-04-19 | 1996-02-29 | ポリマー、金属またはセラミックの表面改質 |
Country Status (10)
Country | Link |
---|---|
US (1) | US5783641A (ja) |
EP (1) | EP0822995B1 (ja) |
JP (1) | JP3213005B2 (ja) |
KR (3) | KR100316586B1 (ja) |
CN (1) | CN1107124C (ja) |
AU (1) | AU4956996A (ja) |
BR (1) | BR9608228A (ja) |
DE (1) | DE69617221T2 (ja) |
ES (1) | ES2164873T3 (ja) |
WO (1) | WO1996033293A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014141732A (ja) * | 2013-01-22 | 2014-08-07 | J&L Tech Co Ltd | ステンレス鋼を母材とする耐食性及び伝導性ナノカーボンコーティング方法及びそれによる燃料電池分離板 |
JP2018184614A (ja) * | 2018-07-26 | 2018-11-22 | 日東電工株式会社 | 接着シート |
Families Citing this family (45)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5965629A (en) | 1996-04-19 | 1999-10-12 | Korea Institute Of Science And Technology | Process for modifying surfaces of materials, and materials having surfaces modified thereby |
JP3124508B2 (ja) * | 1996-04-19 | 2001-01-15 | 韓国科学技術研究院 | 窒化物表面の改質方法及びその方法により表面改質された窒化物 |
KR19990040319A (ko) * | 1997-11-17 | 1999-06-05 | 성재갑 | 고분자 표면의 이온 입자 조사에 의한 미세 기공 막의 제조 |
KR19990047370A (ko) * | 1997-12-04 | 1999-07-05 | 구자홍 | 표면의 친수성 또는 소수성이 향상된 냉동, 공조용 금속재료 및 그 향상 방법 |
US20020189931A1 (en) * | 1997-12-04 | 2002-12-19 | Korea Institute Of Science And Technology | Plasma polymerization enhancement of surface of metal for use in refrigerating and air conditioning |
KR19990047679A (ko) | 1997-12-05 | 1999-07-05 | 박호군 | 이온 빔을 이용한 재료의 표면 처리 장치 |
KR100383091B1 (ko) * | 1999-04-10 | 2003-05-12 | 주식회사 엘지화학 | 고분자 표면 개질 방법 |
WO2000032294A1 (en) * | 1998-12-02 | 2000-06-08 | Lg Chemical Ltd. | Methods for reforming polymer surface for improved wettability |
KR100371398B1 (ko) * | 1998-12-08 | 2003-05-12 | 주식회사 엘지화학 | 폴리올레핀블렌드로제조된통기성필름과그의제조방법및2차전지의격리막 |
KR100345289B1 (ko) * | 1999-09-16 | 2002-07-25 | 한국과학기술연구원 | 수소 이온보조 반응법을 이용한 고분자 표면처리 방법 |
KR100336621B1 (ko) * | 2000-02-15 | 2002-05-16 | 박호군 | 고분자 기판 위의 인듐산화물 또는 인듐주석산화물 박막증착 방법 |
KR100347971B1 (ko) * | 2000-03-06 | 2002-08-09 | 한국전력공사 | 낮은 에너지 이온빔조사에 의한 폴리머 표면의 전기 전도성 및 기계적 물성향상 장치 |
KR20010088089A (ko) * | 2000-03-10 | 2001-09-26 | 구자홍 | 플라즈마 중합처리 시스템의 친수성 향상 방법 |
ATE487604T1 (de) | 2000-05-22 | 2010-11-15 | Seiko Epson Corp | Kopfelement und verfahren zur tintenabweisenden behandlung |
KR100405671B1 (ko) * | 2000-07-18 | 2003-11-15 | 현대자동차주식회사 | 고분자 연료전지의 제조방법 및 이 방법으로 제조된고분자 연료전지 |
KR100418379B1 (ko) * | 2001-06-05 | 2004-02-11 | 학교법인고려중앙학원 | 인듐주석산화막 표면개질을 이용한 박막 광전지 및 그 제조방법 |
KR20020096124A (ko) * | 2001-06-18 | 2002-12-31 | 주식회사 피앤아이 | 신분증의 보호층 표면개질 방법 |
KR100753120B1 (ko) * | 2001-06-30 | 2007-08-30 | 주식회사 하이닉스반도체 | 구리배선의 삼원계 확산방지막의 형성 방법 |
WO2003033759A1 (en) * | 2001-10-19 | 2003-04-24 | P & I Co. | The surface reforming method of a piezoelectric or pyroelectric material using an ion-beam |
KR20030033270A (ko) * | 2001-10-19 | 2003-05-01 | 주식회사 피앤아이 | 이온빔을 이용한 압전 또는 초전체 고분자 재료의 표면개질 방법 |
US6878419B2 (en) * | 2001-12-14 | 2005-04-12 | 3M Innovative Properties Co. | Plasma treatment of porous materials |
KR20030069326A (ko) * | 2002-02-20 | 2003-08-27 | 주식회사 엠티티 | 폴리테트라플루오르에틸렌 물질의 화학적 표면개질 방법 |
KR20030080722A (ko) * | 2002-04-10 | 2003-10-17 | 주식회사 효성 | 접착성 및 내부식성이 향상된 스틸코드 |
WO2004001804A2 (en) * | 2002-06-19 | 2003-12-31 | Ziegler Byron J | Device for generation of reactive ions |
KR20040026733A (ko) * | 2002-09-25 | 2004-04-01 | 주식회사 피앤아이 | 표면개질된 모재와의 접착력이 향상된 후막 형성 방법 및그의 장치 |
KR100514952B1 (ko) * | 2003-01-15 | 2005-09-14 | 주식회사 피앤아이 | 씨앗층과 벌크층의 성막 시퀀스 방법을 이용한 인듐 주석산화물 박막 형성 방법 |
US20050164009A1 (en) * | 2004-01-22 | 2005-07-28 | Rieke Peter C. | Polymer surface with increased hydrophilicity and method of making |
US7871154B2 (en) | 2005-07-29 | 2011-01-18 | MVM Technologies, Inc | Piezoelectric printhead |
KR100749928B1 (ko) * | 2005-08-23 | 2007-08-16 | 연세대학교 산학협력단 | 표면이 개질된 ito글래스 및 그 제조방법 |
US7601419B2 (en) * | 2005-12-19 | 2009-10-13 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board and method of manufacturing the same |
KR100710909B1 (ko) * | 2005-12-23 | 2007-04-27 | 고려대학교 산학협력단 | Ptfe표면의 개질방법 및 금속막이 적층된ptfe기판의 제조방법 |
JP2007180420A (ja) * | 2005-12-28 | 2007-07-12 | Fujitsu Ltd | 半導体装置の製造方法及び磁気ヘッドの製造方法 |
KR100847220B1 (ko) | 2006-01-09 | 2008-07-17 | 주식회사 엘지화학 | 표면 처리된 하부전극을 구비한 유기발광소자 |
JP4902437B2 (ja) * | 2006-09-27 | 2012-03-21 | 富士フイルム株式会社 | インクジェット記録方法およびインクジェット記録装置 |
US7955485B2 (en) * | 2008-07-17 | 2011-06-07 | William Kent Gregory | Planar laminate substrate and method for fabricating organic laminate substrate PCBS, semiconductors, semiconductor wafers and semiconductor devices having miniaturized electrical pathways |
US8691331B2 (en) * | 2009-02-09 | 2014-04-08 | Prashant D. Santan | Surface modification of hydrophobic and/or oleophobic coatings |
DE102010000983A1 (de) * | 2010-01-18 | 2011-07-21 | Joanneum Research Forschungsges. M.B.H. | Plasma- bzw. ionengestützes System zur Herstellung haftfester Beschichtungen auf Fluorpolymeren |
CN102926197B (zh) * | 2012-11-15 | 2014-05-07 | 杭州水处理技术研究开发中心有限公司 | 一种用于离子交换膜制备的支撑布制造方法 |
KR20160117295A (ko) * | 2015-03-30 | 2016-10-10 | 주식회사 엘지화학 | 분리막 기재를 대전시키는 분리막의 제조방법 및 이로부터 제조되는 분리막 |
KR102651680B1 (ko) * | 2016-02-17 | 2024-03-27 | 엘지이노텍 주식회사 | 금속판, 및 이를 이용한 oled 패널 |
KR102129316B1 (ko) * | 2018-02-12 | 2020-07-02 | 한국기계연구원 | 유무기 복합체 및 이의 제조방법 |
CN109353036A (zh) * | 2018-10-31 | 2019-02-19 | 东莞太洋橡塑制品有限公司 | 亲水基硅胶表面处理工艺 |
KR102217981B1 (ko) * | 2019-09-25 | 2021-02-18 | 고려대학교 산학협력단 | AlN의 선택적 습식 식각 방법 |
CN111733378B (zh) * | 2020-05-15 | 2022-12-13 | 中国兵器科学研究院宁波分院 | 一种钢表面的涂层结构及其制备方法 |
CN112921444B (zh) * | 2021-03-09 | 2023-02-03 | 无锡市世纪风服饰有限公司 | 一种抗紫外功能纤维及其制备工艺 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4338420A (en) * | 1980-12-31 | 1982-07-06 | Mobil Oil Corporation | Enhanced wettability of hope films |
US4500564A (en) * | 1982-02-01 | 1985-02-19 | Agency Of Industrial Science & Technology | Method for surface treatment by ion bombardment |
JPS6013823A (ja) * | 1983-07-04 | 1985-01-24 | Toyo Soda Mfg Co Ltd | 高分子材料表面の連続改質方法 |
JPS61171740A (ja) * | 1985-10-03 | 1986-08-02 | Nitto Electric Ind Co Ltd | 合成樹脂成形物の表面親水化方法 |
JP2786283B2 (ja) * | 1989-12-22 | 1998-08-13 | 株式会社日立製作所 | 表面改質方法およびその装置並びに表面改質基材 |
NL9100815A (nl) * | 1991-05-10 | 1992-12-01 | Kema Nv | Werkwijze voor het vervaardigen van een ionomeer. |
US5223309A (en) * | 1991-07-10 | 1993-06-29 | Spire Corporation | Ion implantation of silicone rubber |
KR960000190B1 (ko) * | 1992-11-09 | 1996-01-03 | 엘지전자주식회사 | 반도체 제조방법 및 그 장치 |
JP3157943B2 (ja) * | 1993-03-01 | 2001-04-23 | 株式会社リコー | 基体表面の改質処理方法およびその改質処理装置 |
-
1996
- 1996-02-28 US US08/608,054 patent/US5783641A/en not_active Expired - Lifetime
- 1996-02-29 EP EP96906089A patent/EP0822995B1/en not_active Expired - Lifetime
- 1996-02-29 ES ES96906089T patent/ES2164873T3/es not_active Expired - Lifetime
- 1996-02-29 BR BR9608228A patent/BR9608228A/pt not_active IP Right Cessation
- 1996-02-29 WO PCT/KR1996/000032 patent/WO1996033293A1/en active IP Right Grant
- 1996-02-29 CN CN96193367A patent/CN1107124C/zh not_active Expired - Lifetime
- 1996-02-29 JP JP53163596A patent/JP3213005B2/ja not_active Expired - Lifetime
- 1996-02-29 DE DE69617221T patent/DE69617221T2/de not_active Expired - Lifetime
- 1996-02-29 AU AU49569/96A patent/AU4956996A/en not_active Abandoned
- 1996-04-19 KR KR1019960011994A patent/KR100316586B1/ko not_active IP Right Cessation
- 1996-04-19 KR KR1019960011995A patent/KR100324619B1/ko not_active IP Right Cessation
- 1996-04-19 KR KR1019960011996A patent/KR100288500B1/ko not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014141732A (ja) * | 2013-01-22 | 2014-08-07 | J&L Tech Co Ltd | ステンレス鋼を母材とする耐食性及び伝導性ナノカーボンコーティング方法及びそれによる燃料電池分離板 |
JP2018184614A (ja) * | 2018-07-26 | 2018-11-22 | 日東電工株式会社 | 接着シート |
Also Published As
Publication number | Publication date |
---|---|
KR960039135A (ko) | 1996-11-21 |
US5783641A (en) | 1998-07-21 |
JP3213005B2 (ja) | 2001-09-25 |
ES2164873T3 (es) | 2002-03-01 |
EP0822995B1 (en) | 2001-11-21 |
DE69617221D1 (de) | 2002-01-03 |
KR960037742A (ko) | 1996-11-19 |
KR100288500B1 (ko) | 2001-05-02 |
DE69617221T2 (de) | 2002-05-08 |
AU4956996A (en) | 1996-11-07 |
BR9608228A (pt) | 1998-12-29 |
EP0822995A1 (en) | 1998-02-11 |
WO1996033293A1 (en) | 1996-10-24 |
KR100316586B1 (ko) | 2002-02-28 |
CN1107124C (zh) | 2003-04-30 |
KR960039134A (ko) | 1996-11-21 |
KR100324619B1 (ko) | 2002-10-12 |
CN1181787A (zh) | 1998-05-13 |
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