|
KR100230428B1
(ko)
*
|
1997-06-24 |
1999-11-15 |
윤종용 |
다층 도전성 패드를 구비하는 반도체장치 및 그 제조방법
|
|
US6057779A
(en)
*
|
1997-08-14 |
2000-05-02 |
Micron Technology, Inc. |
Method of controlling access to a movable container and to a compartment of a vehicle, and a secure cargo transportation system
|
|
US6356535B1
(en)
*
|
1998-02-04 |
2002-03-12 |
Micron Technology, Inc. |
Communication systems and methods of communicating
|
|
JP2002527886A
(ja)
*
|
1998-10-05 |
2002-08-27 |
キューリック、アンド、ソファー、インベストメンツ、インコーポレーテッド |
半導体の銅ボンドパッドの表面保護
|
|
US6303423B1
(en)
*
|
1998-12-21 |
2001-10-16 |
Megic Corporation |
Method for forming high performance system-on-chip using post passivation process
|
|
US6965165B2
(en)
|
1998-12-21 |
2005-11-15 |
Mou-Shiung Lin |
Top layers of metal for high performance IC's
|
|
US6936531B2
(en)
|
1998-12-21 |
2005-08-30 |
Megic Corporation |
Process of fabricating a chip structure
|
|
US10973397B2
(en)
|
1999-03-01 |
2021-04-13 |
West View Research, Llc |
Computerized information collection and processing apparatus
|
|
US8636648B2
(en)
|
1999-03-01 |
2014-01-28 |
West View Research, Llc |
Endoscopic smart probe
|
|
JP4094174B2
(ja)
*
|
1999-06-04 |
2008-06-04 |
株式会社ルネサステクノロジ |
半導体装置の製造方法
|
|
US8065155B1
(en)
|
1999-06-10 |
2011-11-22 |
Gazdzinski Robert F |
Adaptive advertising apparatus and methods
|
|
US7710273B2
(en)
*
|
1999-09-02 |
2010-05-04 |
Round Rock Research, Llc |
Remote communication devices, radio frequency identification devices, wireless communication systems, wireless communication methods, radio frequency identification device communication methods, and methods of forming a remote communication device
|
|
US20020020898A1
(en)
|
2000-08-16 |
2002-02-21 |
Vu Quat T. |
Microelectronic substrates with integrated devices
|
|
US6713859B1
(en)
|
2000-09-13 |
2004-03-30 |
Intel Corporation |
Direct build-up layer on an encapsulated die package having a moisture barrier structure
|
|
US6818545B2
(en)
*
|
2001-03-05 |
2004-11-16 |
Megic Corporation |
Low fabrication cost, fine pitch and high reliability solder bump
|
|
US7498196B2
(en)
|
2001-03-30 |
2009-03-03 |
Megica Corporation |
Structure and manufacturing method of chip scale package
|
|
US7932603B2
(en)
|
2001-12-13 |
2011-04-26 |
Megica Corporation |
Chip structure and process for forming the same
|
|
US6673698B1
(en)
|
2002-01-19 |
2004-01-06 |
Megic Corporation |
Thin film semiconductor package utilizing a glass substrate with composite polymer/metal interconnect layers
|
|
TW584950B
(en)
|
2001-12-31 |
2004-04-21 |
Megic Corp |
Chip packaging structure and process thereof
|
|
TW544882B
(en)
|
2001-12-31 |
2003-08-01 |
Megic Corp |
Chip package structure and process thereof
|
|
TW503496B
(en)
*
|
2001-12-31 |
2002-09-21 |
Megic Corp |
Chip packaging structure and manufacturing process of the same
|
|
JP3616605B2
(ja)
*
|
2002-04-03 |
2005-02-02 |
沖電気工業株式会社 |
半導体装置
|
|
WO2003107422A1
(ja)
*
|
2002-06-13 |
2003-12-24 |
松下電器産業株式会社 |
半導体デバイス及びその製造方法
|
|
US7119437B2
(en)
|
2002-12-26 |
2006-10-10 |
Yamaha Hatsudoki Kabushiki Kaisha |
Electronic substrate, power module and motor driver
|
|
US7427024B1
(en)
|
2003-12-17 |
2008-09-23 |
Gazdzinski Mark J |
Chattel management apparatus and methods
|
|
DE102004019447A1
(de)
*
|
2004-04-19 |
2005-11-10 |
Siemens Ag |
Vorrichtung, insbesondere intelligentes Leistungsmodul, mit planarer Verbindungstechnik
|
|
US7560808B2
(en)
*
|
2005-10-19 |
2009-07-14 |
Texas Instruments Incorporated |
Chip scale power LDMOS device
|
|
US20090015407A1
(en)
*
|
2007-07-13 |
2009-01-15 |
Micron Technology, Inc. |
Rifid tags and methods of designing rfid tags
|
|
US7777630B2
(en)
*
|
2007-07-26 |
2010-08-17 |
Round Rock Research, Llc |
Methods and systems of RFID tags using RFID circuits and antennas having unmatched frequency ranges
|
|
US8179232B2
(en)
*
|
2008-05-05 |
2012-05-15 |
Round Rock Research, Llc |
RFID interrogator with adjustable signal characteristics
|
|
US7852221B2
(en)
*
|
2008-05-08 |
2010-12-14 |
Round Rock Research, Llc |
RFID devices using RFID circuits and antennas having unmatched frequency ranges
|
|
US8712334B2
(en)
|
2008-05-20 |
2014-04-29 |
Micron Technology, Inc. |
RFID device using single antenna for multiple resonant frequency ranges
|
|
US8053898B2
(en)
*
|
2009-10-05 |
2011-11-08 |
Samsung Electronics Co., Ltd. |
Connection for off-chip electrostatic discharge protection
|
|
US8847293B2
(en)
*
|
2012-03-02 |
2014-09-30 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
Gate structure for semiconductor device
|
|
US9337163B2
(en)
*
|
2012-11-13 |
2016-05-10 |
General Electric Company |
Low profile surface mount package with isolated tab
|
|
US9006584B2
(en)
*
|
2013-08-06 |
2015-04-14 |
Texas Instruments Incorporated |
High voltage polymer dielectric capacitor isolation device
|
|
US9899484B1
(en)
*
|
2016-12-30 |
2018-02-20 |
Texas Instruments Incorporated |
Transistor with source field plates under gate runner layers
|
|
JP2025030915A
(ja)
*
|
2023-08-24 |
2025-03-07 |
新光電気工業株式会社 |
半導体装置
|