JPH1072668A - 基板支持具ならびに該支持具を用いた薄膜の製造方法およびその製造装置 - Google Patents
基板支持具ならびに該支持具を用いた薄膜の製造方法およびその製造装置Info
- Publication number
- JPH1072668A JPH1072668A JP23171296A JP23171296A JPH1072668A JP H1072668 A JPH1072668 A JP H1072668A JP 23171296 A JP23171296 A JP 23171296A JP 23171296 A JP23171296 A JP 23171296A JP H1072668 A JPH1072668 A JP H1072668A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- forming
- thin film
- substrate support
- transparent electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 216
- 239000010409 thin film Substances 0.000 title claims description 27
- 238000004519 manufacturing process Methods 0.000 title claims description 21
- 229920005989 resin Polymers 0.000 claims abstract description 26
- 239000011347 resin Substances 0.000 claims abstract description 26
- 229920003002 synthetic resin Polymers 0.000 claims abstract description 16
- 239000000057 synthetic resin Substances 0.000 claims abstract description 16
- 238000003825 pressing Methods 0.000 claims abstract description 15
- 238000000034 method Methods 0.000 claims description 30
- 239000011521 glass Substances 0.000 claims description 15
- 238000004544 sputter deposition Methods 0.000 claims description 11
- 238000007733 ion plating Methods 0.000 claims description 9
- 229920001721 polyimide Polymers 0.000 claims description 8
- 238000001771 vacuum deposition Methods 0.000 claims description 7
- 239000009719 polyimide resin Substances 0.000 claims description 6
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 claims description 5
- 238000004040 coloring Methods 0.000 claims description 4
- 229920000642 polymer Polymers 0.000 claims description 4
- 229920006254 polymer film Polymers 0.000 claims description 4
- 229920002050 silicone resin Polymers 0.000 claims description 2
- 239000000428 dust Substances 0.000 abstract description 3
- 230000000873 masking effect Effects 0.000 abstract description 3
- 239000010408 film Substances 0.000 description 31
- 229910052751 metal Inorganic materials 0.000 description 18
- 239000002184 metal Substances 0.000 description 18
- 239000010935 stainless steel Substances 0.000 description 9
- 229910001220 stainless steel Inorganic materials 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- 238000001755 magnetron sputter deposition Methods 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000002834 transmittance Methods 0.000 description 5
- 239000003513 alkali Substances 0.000 description 4
- 238000002845 discoloration Methods 0.000 description 4
- 238000000206 photolithography Methods 0.000 description 4
- 229910000838 Al alloy Inorganic materials 0.000 description 3
- 101100269850 Caenorhabditis elegans mask-1 gene Proteins 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000010410 dusting Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000013007 heat curing Methods 0.000 description 2
- 229910003437 indium oxide Inorganic materials 0.000 description 2
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000002243 precursor Substances 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 2
- 229910001887 tin oxide Inorganic materials 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 238000001552 radio frequency sputter deposition Methods 0.000 description 1
- 229910001256 stainless steel alloy Inorganic materials 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Landscapes
- Physical Vapour Deposition (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23171296A JPH1072668A (ja) | 1996-09-02 | 1996-09-02 | 基板支持具ならびに該支持具を用いた薄膜の製造方法およびその製造装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23171296A JPH1072668A (ja) | 1996-09-02 | 1996-09-02 | 基板支持具ならびに該支持具を用いた薄膜の製造方法およびその製造装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH1072668A true JPH1072668A (ja) | 1998-03-17 |
| JPH1072668A5 JPH1072668A5 (enExample) | 2004-09-16 |
Family
ID=16927838
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23171296A Pending JPH1072668A (ja) | 1996-09-02 | 1996-09-02 | 基板支持具ならびに該支持具を用いた薄膜の製造方法およびその製造装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH1072668A (enExample) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001326075A (ja) * | 2000-05-18 | 2001-11-22 | Tohoku Pioneer Corp | 有機el素子の製造方法 |
| KR20030003086A (ko) * | 2001-06-29 | 2003-01-09 | 산요 덴키 가부시키가이샤 | 일렉트로 루미네센스 표시 장치의 제조 방법 |
| KR100485300B1 (ko) * | 2001-06-29 | 2005-04-27 | 산요덴키가부시키가이샤 | 일렉트로 루미네센스 표시 장치의 제조 방법 |
| JP2007096056A (ja) * | 2005-09-29 | 2007-04-12 | Dainippon Printing Co Ltd | スパッタ装置およびスパッタ装置用キャリア |
| KR100722099B1 (ko) | 2005-12-16 | 2007-05-25 | 삼성에스디아이 주식회사 | 기판 지지대 및 그 제조 방법 |
| JP2007204823A (ja) * | 2006-02-03 | 2007-08-16 | Dainippon Printing Co Ltd | 成膜装置 |
| JP2007204824A (ja) * | 2006-02-03 | 2007-08-16 | Dainippon Printing Co Ltd | 基板ホルダー部および成膜装置 |
| JP2008277614A (ja) * | 2007-05-01 | 2008-11-13 | Ihi Corp | 基板搬送装置 |
| WO2014139594A1 (en) * | 2013-03-15 | 2014-09-18 | Applied Materials, Inc. | Carrier for a substrate and method for carrying a substrate |
| WO2014139591A1 (en) * | 2013-03-15 | 2014-09-18 | Applied Materials, Inc. | Carrier for substrates |
| CN106637125A (zh) * | 2017-01-09 | 2017-05-10 | 京东方科技集团股份有限公司 | 一种基板承载机构及其使用方法、蒸镀装置 |
| JP2020084320A (ja) * | 2018-11-15 | 2020-06-04 | 日本電気硝子株式会社 | 成膜治具及び成膜方法 |
-
1996
- 1996-09-02 JP JP23171296A patent/JPH1072668A/ja active Pending
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001326075A (ja) * | 2000-05-18 | 2001-11-22 | Tohoku Pioneer Corp | 有機el素子の製造方法 |
| KR20030003086A (ko) * | 2001-06-29 | 2003-01-09 | 산요 덴키 가부시키가이샤 | 일렉트로 루미네센스 표시 장치의 제조 방법 |
| KR100485300B1 (ko) * | 2001-06-29 | 2005-04-27 | 산요덴키가부시키가이샤 | 일렉트로 루미네센스 표시 장치의 제조 방법 |
| JP2007096056A (ja) * | 2005-09-29 | 2007-04-12 | Dainippon Printing Co Ltd | スパッタ装置およびスパッタ装置用キャリア |
| KR100722099B1 (ko) | 2005-12-16 | 2007-05-25 | 삼성에스디아이 주식회사 | 기판 지지대 및 그 제조 방법 |
| JP2007204823A (ja) * | 2006-02-03 | 2007-08-16 | Dainippon Printing Co Ltd | 成膜装置 |
| JP2007204824A (ja) * | 2006-02-03 | 2007-08-16 | Dainippon Printing Co Ltd | 基板ホルダー部および成膜装置 |
| JP2008277614A (ja) * | 2007-05-01 | 2008-11-13 | Ihi Corp | 基板搬送装置 |
| WO2014139594A1 (en) * | 2013-03-15 | 2014-09-18 | Applied Materials, Inc. | Carrier for a substrate and method for carrying a substrate |
| WO2014139591A1 (en) * | 2013-03-15 | 2014-09-18 | Applied Materials, Inc. | Carrier for substrates |
| CN105189812A (zh) * | 2013-03-15 | 2015-12-23 | 应用材料公司 | 用于基板的载具 |
| CN105189811A (zh) * | 2013-03-15 | 2015-12-23 | 应用材料公司 | 用于基板的运送器及运送基板的方法 |
| JP2016509985A (ja) * | 2013-03-15 | 2016-04-04 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 基板用キャリア |
| JP2016514369A (ja) * | 2013-03-15 | 2016-05-19 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 基板用キャリア及び基板搬送方法 |
| CN105189811B (zh) * | 2013-03-15 | 2017-06-09 | 应用材料公司 | 用于基板的运送器及运送基板的方法 |
| CN106637125A (zh) * | 2017-01-09 | 2017-05-10 | 京东方科技集团股份有限公司 | 一种基板承载机构及其使用方法、蒸镀装置 |
| JP2020084320A (ja) * | 2018-11-15 | 2020-06-04 | 日本電気硝子株式会社 | 成膜治具及び成膜方法 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A977 | Report on retrieval |
Effective date: 20060726 Free format text: JAPANESE INTERMEDIATE CODE: A971007 |
|
| A131 | Notification of reasons for refusal |
Effective date: 20060801 Free format text: JAPANESE INTERMEDIATE CODE: A131 |
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| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20061205 |