JPH1058457A5 - - Google Patents

Info

Publication number
JPH1058457A5
JPH1058457A5 JP1996218221A JP21822196A JPH1058457A5 JP H1058457 A5 JPH1058457 A5 JP H1058457A5 JP 1996218221 A JP1996218221 A JP 1996218221A JP 21822196 A JP21822196 A JP 21822196A JP H1058457 A5 JPH1058457 A5 JP H1058457A5
Authority
JP
Japan
Prior art keywords
press
unit
resin molding
molded product
basic unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1996218221A
Other languages
English (en)
Japanese (ja)
Other versions
JPH1058457A (ja
JP3642637B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP21822196A external-priority patent/JP3642637B2/ja
Priority to JP21822196A priority Critical patent/JP3642637B2/ja
Priority to TW086111539A priority patent/TW410194B/zh
Priority to SG9702924A priority patent/SG97124A1/en
Priority to MYPI97003717A priority patent/MY119447A/en
Priority to EP97306222A priority patent/EP0825006B1/en
Priority to US08/912,611 priority patent/US6050802A/en
Priority to KR1019970039569A priority patent/KR100257957B1/ko
Priority to CN97117725A priority patent/CN1106922C/zh
Publication of JPH1058457A publication Critical patent/JPH1058457A/ja
Publication of JPH1058457A5 publication Critical patent/JPH1058457A5/ja
Publication of JP3642637B2 publication Critical patent/JP3642637B2/ja
Application granted granted Critical
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP21822196A 1996-08-20 1996-08-20 樹脂モールド装置 Expired - Fee Related JP3642637B2 (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP21822196A JP3642637B2 (ja) 1996-08-20 1996-08-20 樹脂モールド装置
TW086111539A TW410194B (en) 1996-08-20 1997-08-12 Resin molding machine
SG9702924A SG97124A1 (en) 1996-08-20 1997-08-13 Resin molding machine
MYPI97003717A MY119447A (en) 1996-08-20 1997-08-14 Resin molding machine
EP97306222A EP0825006B1 (en) 1996-08-20 1997-08-15 Resin molding machine
US08/912,611 US6050802A (en) 1996-08-20 1997-08-18 Resin molding machine
KR1019970039569A KR100257957B1 (ko) 1996-08-20 1997-08-20 수지 성형 장치
CN97117725A CN1106922C (zh) 1996-08-20 1997-08-20 树脂模制机

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21822196A JP3642637B2 (ja) 1996-08-20 1996-08-20 樹脂モールド装置

Publications (3)

Publication Number Publication Date
JPH1058457A JPH1058457A (ja) 1998-03-03
JPH1058457A5 true JPH1058457A5 (en:Method) 2004-08-26
JP3642637B2 JP3642637B2 (ja) 2005-04-27

Family

ID=16716520

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21822196A Expired - Fee Related JP3642637B2 (ja) 1996-08-20 1996-08-20 樹脂モールド装置

Country Status (1)

Country Link
JP (1) JP3642637B2 (en:Method)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100605312B1 (ko) * 1999-09-17 2006-07-31 삼성전자주식회사 반도체 칩 패키지 몰딩 장치
TW509615B (en) 2000-04-21 2002-11-11 Apic Yamada Corp Resin molding machine and resin tablet feeding machine
JP4797688B2 (ja) * 2006-02-24 2011-10-19 株式会社大真空 電子部品の気密封止装置
JP5010303B2 (ja) * 2007-02-09 2012-08-29 住友重機械工業株式会社 樹脂封止装置
JP5192749B2 (ja) * 2007-08-10 2013-05-08 Ｔｏｗａ株式会社 光素子の樹脂封止成形方法及び装置
JP5551018B2 (ja) * 2010-08-24 2014-07-16 住友重機械工業株式会社 封止装置及び封止方法
JP5627619B2 (ja) * 2012-02-28 2014-11-19 Ｔｏｗａ株式会社 樹脂封止装置及び樹脂封止体の製造方法
JP7335647B2 (ja) * 2018-08-10 2023-08-30 アピックヤマダ株式会社 ワーク搬送装置及び樹脂モールド装置
JP7068094B2 (ja) * 2018-08-10 2022-05-16 アピックヤマダ株式会社 ワーク搬送装置、樹脂搬送装置及び樹脂モールド方法
JP7445974B2 (ja) * 2020-10-20 2024-03-08 アピックヤマダ株式会社 樹脂封止装置

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