SG97124A1 - Resin molding machine - Google Patents
Resin molding machineInfo
- Publication number
- SG97124A1 SG97124A1 SG9702924A SG1997002924A SG97124A1 SG 97124 A1 SG97124 A1 SG 97124A1 SG 9702924 A SG9702924 A SG 9702924A SG 1997002924 A SG1997002924 A SG 1997002924A SG 97124 A1 SG97124 A1 SG 97124A1
- Authority
- SG
- Singapore
- Prior art keywords
- molding machine
- resin molding
- resin
- machine
- molding
- Prior art date
Links
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21822196A JP3642637B2 (en) | 1996-08-20 | 1996-08-20 | Resin molding equipment |
JP33937196 | 1996-12-19 | ||
JP09381097A JP3714765B2 (en) | 1997-04-11 | 1997-04-11 | Conveying mechanism of press machine |
Publications (1)
Publication Number | Publication Date |
---|---|
SG97124A1 true SG97124A1 (en) | 2003-07-18 |
Family
ID=29715811
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG9702924A SG97124A1 (en) | 1996-08-20 | 1997-08-13 | Resin molding machine |
Country Status (1)
Country | Link |
---|---|
SG (1) | SG97124A1 (en) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4997355A (en) * | 1987-11-17 | 1991-03-05 | Mitsubishi Denki Kabushiki Kaisha | Apparatus for producing semiconductor devices |
EP0428792A2 (en) * | 1989-11-24 | 1991-05-29 | Fico B.V. | Single strip molding apparatus |
GB2280141A (en) * | 1993-07-22 | 1995-01-25 | Towa Corp | Method and apparatus for resin transfer encapsulation of electronic components |
JPH08197571A (en) * | 1995-01-25 | 1996-08-06 | Towa Kk | Resin seal molding apparatus for electronic part |
-
1997
- 1997-08-13 SG SG9702924A patent/SG97124A1/en unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4997355A (en) * | 1987-11-17 | 1991-03-05 | Mitsubishi Denki Kabushiki Kaisha | Apparatus for producing semiconductor devices |
EP0428792A2 (en) * | 1989-11-24 | 1991-05-29 | Fico B.V. | Single strip molding apparatus |
GB2280141A (en) * | 1993-07-22 | 1995-01-25 | Towa Corp | Method and apparatus for resin transfer encapsulation of electronic components |
JPH08197571A (en) * | 1995-01-25 | 1996-08-06 | Towa Kk | Resin seal molding apparatus for electronic part |
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