SG97124A1 - Resin molding machine - Google Patents

Resin molding machine

Info

Publication number
SG97124A1
SG97124A1 SG9702924A SG1997002924A SG97124A1 SG 97124 A1 SG97124 A1 SG 97124A1 SG 9702924 A SG9702924 A SG 9702924A SG 1997002924 A SG1997002924 A SG 1997002924A SG 97124 A1 SG97124 A1 SG 97124A1
Authority
SG
Singapore
Prior art keywords
molding machine
resin molding
resin
machine
molding
Prior art date
Application number
SG9702924A
Inventor
Kobayashi Kazuhiko
Original Assignee
Apic Yamada Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP21822196A external-priority patent/JP3642637B2/en
Priority claimed from JP09381097A external-priority patent/JP3714765B2/en
Application filed by Apic Yamada Corp filed Critical Apic Yamada Corp
Publication of SG97124A1 publication Critical patent/SG97124A1/en

Links

SG9702924A 1996-08-20 1997-08-13 Resin molding machine SG97124A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP21822196A JP3642637B2 (en) 1996-08-20 1996-08-20 Resin molding equipment
JP33937196 1996-12-19
JP09381097A JP3714765B2 (en) 1997-04-11 1997-04-11 Conveying mechanism of press machine

Publications (1)

Publication Number Publication Date
SG97124A1 true SG97124A1 (en) 2003-07-18

Family

ID=29715811

Family Applications (1)

Application Number Title Priority Date Filing Date
SG9702924A SG97124A1 (en) 1996-08-20 1997-08-13 Resin molding machine

Country Status (1)

Country Link
SG (1) SG97124A1 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4997355A (en) * 1987-11-17 1991-03-05 Mitsubishi Denki Kabushiki Kaisha Apparatus for producing semiconductor devices
EP0428792A2 (en) * 1989-11-24 1991-05-29 Fico B.V. Single strip molding apparatus
GB2280141A (en) * 1993-07-22 1995-01-25 Towa Corp Method and apparatus for resin transfer encapsulation of electronic components
JPH08197571A (en) * 1995-01-25 1996-08-06 Towa Kk Resin seal molding apparatus for electronic part

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4997355A (en) * 1987-11-17 1991-03-05 Mitsubishi Denki Kabushiki Kaisha Apparatus for producing semiconductor devices
EP0428792A2 (en) * 1989-11-24 1991-05-29 Fico B.V. Single strip molding apparatus
GB2280141A (en) * 1993-07-22 1995-01-25 Towa Corp Method and apparatus for resin transfer encapsulation of electronic components
JPH08197571A (en) * 1995-01-25 1996-08-06 Towa Kk Resin seal molding apparatus for electronic part

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