JPH10505023A - 無接触チップカード用のチップカードモジュールの製造方法 - Google Patents

無接触チップカード用のチップカードモジュールの製造方法

Info

Publication number
JPH10505023A
JPH10505023A JP8509119A JP50911996A JPH10505023A JP H10505023 A JPH10505023 A JP H10505023A JP 8509119 A JP8509119 A JP 8509119A JP 50911996 A JP50911996 A JP 50911996A JP H10505023 A JPH10505023 A JP H10505023A
Authority
JP
Japan
Prior art keywords
wire
chip card
semiconductor chip
manufacturing
antenna coil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8509119A
Other languages
English (en)
Inventor
ムンデイグル、ヨーゼフ
ホードー、デトレフ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=6527470&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JPH10505023(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Siemens AG filed Critical Siemens AG
Publication of JPH10505023A publication Critical patent/JPH10505023A/ja
Pending legal-status Critical Current

Links

Classifications

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    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • G—PHYSICS
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    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
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  • Physics & Mathematics (AREA)
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  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Power Engineering (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

(57)【要約】 保持体（１）の上に配置されているアンテナコイル（５）を有するチップカードモジュールにおいて、その接続端（６）が同じく保持体（１）の上に配置されている半導体チップ（３）とボンド接続により接続されている。

Description

【発明の詳細な説明】 無接触チップカード用のチップカードモジュールの製造方法 無接触チップカードではそのなかに含まれている半導体チップの作動のために 必要なエネルギーが少なくとも１つのアンテナコイルを介して供給され、その際 にたいてい電磁誘導結合による伝達が選ばれる。データ転送もこれらのコイルを 介して行われる。 その際に印刷、エッチングまたは電気メッキ成長により形成されたストリップ 導体の形態のコイルも、巻かれたエナメル線コイルも一般に用いられており、そ の際にこのようなエナメル線コイルの基本材料としては銅が使用される。 コイルを半導体チップと接続するためには先ずコイルの接続端がたとえば加熱 ブラシかけ、化学的処理または錫めっきにより絶縁除去され、また次いでたとえ ばレーザーろう付け、スリット溶接、超音波溶接、ワイヤーラップまたは銀ラッ ク接着剤による接着により接触化される。このような接続を形成するにはそれぞ れ多数のさまざまな作業工程または組立工程が必要であり、これらはその実施の ために多くの機械を必要とする。 ドイツ特許第 3721822号明細書から、アンテナコイルをボンド接続を介して半 導体チップと接続することは公知である。そこでば先ずコイルが巻かれ、その端 部が次いで別の作業工程でボンド接続を介して半導体チップと接続されなければ ならない。 本発明の課題は、無接触チップカード用のチップカードモジュールの製造方法 であって、簡単で、経済的で、かつ容易に自動化可能な製造方法を提供すること にある。 この課題は請求項１による方法により解決される。本発明の有利な実施態様は 従属請求項に記載されている。 本発明によればコイル接続端が直接に半導体チップの接触領域の上にボンディ ングされる。その際にボンダーは直接に自動コイル巻き機械のワイヤー案内ヘッ ドに一体化されているので、すべての組立工程は１つの機械により行うことがで きる。特に有利なことはコイルに対してアルミニウムワイヤーが使用されること である。これは銅の半分以下の軽量であり、また銅の半分に過ぎない弾性係数を 有するので、仕上がったカードはより小さい剛性を有する。この形式の太いワイ ヤーによるボンディングはたとえばパワーエレクトロニクスから知られており、 また高い収率が得られるように良好に制御される。 本発明の有利な実施態様では、半導体チップは、チップカードの曲げ応力の際 の損傷から良好に保護されるように、自由に浮いてボンド接触によってのみ保持 体の孔のなかに配置されている。 以下、図面に示されている実施例により本発明を一層詳細に説明する。その際 に図面は本発明によるチップカードの可能な実施例を示す。 可撓性で非導電性の材料から成る平坦な保持体１は孔２を有する。この孔のな かに半導体チップ３が入れられている。半導体チップ３は、通常のチップカード 領域にくらべてたとえば金被覆により拡大されている２つの接触領域４を有する 。接触領域４の上にアンテナコイル５の接続端部６がボンド接触により取付けら れている。その際に、有利なことにアルミニウムから成っているワイヤーは先ず 接触領域４の１つの上にボンドされ、次いで、ボンダーが一体に組み込まれてい る自動ワイヤー巻き機械の案内ヘッドを用いて多数のターンのコイルとして巻か れ（図面には２つのターンしか示されていないが、それよりも多いターン数であ ってもよい）、また最後に再び他方の接触領域の上にボンドされた。続いて半導 体チップ３が本発明による仕方でそれに取付けられたコイル５と共に、コイル５ が保持体１の上に配置されるように、保持体１の孔２のなかに入れられる。その 際に保持体１は、単に保持体の相応の被覆除去によりチップカードが完成される ように、完成したチップカードの長さおよび幅を持つことができる。しかし保持 体１は、チップカードの枠状の中心部分のなかに入れ子として入れることができ るように、チップカードよりも小さい寸法を有してもよい。

Claims (1)

  1. 【特許請求の範囲】 １．細いワイヤーの一端が半導体チップ（３）の第１の接触領域（４）の上にボ ンディングされ、 ワイヤーがボンドヘッドを用いて多数のターン（５）に導かれ、 ワイヤーが半導体チップ（３）の第２の接触領域（４）の上にボンディングさ れ、 アンテナコイル（５）を形成するワイヤーターンおよび半導体チップ（３）が 保持体（１）の上に配置される ことを特徴とするチップカードモジュールの製造方法。 ２．アンテナコイル（５）を形成するワイヤーターンが、半導体チップ（３）が 保持体（１）の孔（２）のなかにワイヤー端（６）のボンド接続から浮いて保た れるように、保持体（１）の上に配置されることを特徴とする請求項１記載の方 法。
JP8509119A 1994-09-05 1995-09-05 無接触チップカード用のチップカードモジュールの製造方法 Pending JPH10505023A (ja)

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DE4431605.4 1994-09-05
DE4431605A DE4431605C2 (de) 1994-09-05 1994-09-05 Verfahren zur Herstellung eines Chipkartenmoduls für kontaktlose Chipkarten
PCT/DE1995/001201 WO1996007984A1 (de) 1994-09-05 1995-09-05 Verfahren zur herstellung eines chipkartenmoduls für kontaktlose chipkarten

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RU2155379C2 (ru) 2000-08-27
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EP0780006B1 (de) 1998-11-18
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FI970924A (fi) 1997-03-04
DE59504285D1 (de) 1998-12-24
KR100358785B1 (ko) 2003-04-21
EP0780006A1 (de) 1997-06-25
US5809633A (en) 1998-09-22
DE4431605C2 (de) 1998-06-04
ATE173553T1 (de) 1998-12-15
WO1996007984A1 (de) 1996-03-14
CN1160447A (zh) 1997-09-24
FI970924A0 (fi) 1997-03-04
KR970705803A (ko) 1997-10-09
ES2125650T3 (es) 1999-03-01

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