CN1160447A - 制作用于无触点智能卡的智能卡模块的方法 - Google Patents

制作用于无触点智能卡的智能卡模块的方法 Download PDF

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CN1160447A
CN1160447A CN95195671A CN95195671A CN1160447A CN 1160447 A CN1160447 A CN 1160447A CN 95195671 A CN95195671 A CN 95195671A CN 95195671 A CN95195671 A CN 95195671A CN 1160447 A CN1160447 A CN 1160447A
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semi
coil
conductor chip
smart card
card module
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CN1105988C (zh
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J·蒙迪戈尔
D·霍迪奥
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Infineon Technologies AG
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Siemens AG
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Abstract

一种具有天线线圈(5)的智能卡，线圈(5)布置在载物体(1)上，它们通过粘结结合连接到半导体芯片(3)上，半导体芯片也类似地布置在载物体(1)上。

Description

制作用于无触点智能卡的 智能卡模块的方法
在无触点智能卡中，运行其中包含的半导体芯片所需的能量是经由至少一个天线线圈供应的，通常选用变压器传输。数据的传送也经由此线圈。
这时，常用的线圈不仅有条形的印制或刻蚀的线圈或电解沉淀生长的线圈，而且有漆包线绕制的线圈，铜被用作这种漆包线线圈的基本材料。
为将线圈连接到半导体芯片上，首先通过如加热、刷洗、化学处理或涂锡等方法除去线圈连结处的绝缘物，然后通过如激光焊接、间隙焊接、超声焊接、绕接或用银漆粘结剂粘结结合等方法产生接触。因而，每次制作这种连接要求多种不同工作操作和装配步骤，这要求多种机器以完成连接。
DE3721822 C1公开了经粘结将天线线圈连结到半导体芯片的方法。在该公开文本中，必须首先绕制，然后在进一步的步骤中其端部经粘结连接至半导体芯片上。
本发明的目的是提供一种制作用于无触点智能卡的智能卡模块的方法，该方法简单、成本低且易于自动化。
本发明的目的通过权利要求1的方法实现。本发明的有利改进在从属权利要求中公开。
线圈连接以一种发明性的方式直接粘接在半导体芯片的接触区上。这时，粘结器件直接与自动绕线机的引线头集成一体，结果所有的装配步骤能使用一个机器完成。线圈使用铝线具有特别的优点。该线比铜线轻一半以上，它的弹性模量也只有约一半大，结果最后得到的卡的刚性较低。这种类型的厚线粘结在如电力电子学中是公知的，可控性很好，并能达到高的成品率。
在本发明的有利改进中，半导体芯片被布置得只通过载物体中的凹部的粘结接触区自由地悬持，结果在智能卡受弯曲应力时被很好地保持以防破裂。
在下面借助一幅图使用示范性实施例更详细地说明本发明。
由柔性非导电材料制成的平载物体1具有凹部2。半导体芯片3插入所述凹部中。半导体芯片3具有两个接触区4，它们通过如镀金的方法与常规半导体芯片相比被放大了。天线线圈5的连接6通过粘结结合安装在接触区4上。这时，该线由铝制成，首先粘结在一个接触区4上，然后通过自动绕线机的引线头绕制多圈以形成一个线圈(图中只示出了两圈，但可有更多圈)，最后再粘结到另一个接触区上，粘结器件集成在自动绕线机中。其上发明性地安装了线圈5的半导体芯片3随后插入载物体1的凹部2中，结果线圈5被布置在载物体1上。这时，载物体1的长度和宽度与最后的智能卡相同，结果只需相应地覆盖载物体就可完成智能卡。然而，载物体1可比智能卡的尺寸小，结果它能作为插入物插入框形的智能卡的中间部分。

Claims (2)

1.一种制作智能卡模块的方法，具有以下步骤：
-将薄线的一端粘结在半导体芯片(3)的第一接触区(4)上；
-通过粘结头将该线绕成多个圈(5)；
-将该线粘结在半导体芯片(3)的第二接触区(4)上；
-该线圈形成的天线线圈(5)和半导体芯片(3)被布置在载物体(1)上。
2.根据权利要求1的方法，其特征在于，该线绕圈形成的天线线圈(5)以下面方式布置在载物体(1)上，即，使得半导体芯片(3)以悬在线端部(6)的粘结处的方式保持在载物体(1)的凹部(2)中。
CN95195671A 1994-09-05 1995-09-05 制作用于无触点智能卡的智能卡模块的方法 Expired - Lifetime CN1105988C (zh)

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WO1993009551A1 (de) * 1991-11-08 1993-05-13 Herbert Stowasser Transponder sowie verfahren und vorrichtung zur herstellung
FI89752C (fi) * 1992-04-01 1993-11-10 Picopak Oy Foerfarande foer anslutning av en mikrokrets till en induktiv spole i ett smartkort samt anordning vid ett induktivt smartkort

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101065880B (zh) * 2004-10-12 2012-05-16 Ask股份有限公司 带有y形全向天线的无触点标签
CN101573716B (zh) * 2006-09-26 2013-06-12 Hid环球有限责任公司 连接天线到应答器芯片和相应的嵌件基底的方法
CN101689249B (zh) * 2007-04-24 2013-07-31 斯迈达Ip有限公司 电子接口装置及其制造方法和系统
CN101933034A (zh) * 2008-01-23 2010-12-29 斯迈达Ip有限公司 智能卡的制造
CN101933034B (zh) * 2008-01-23 2015-04-01 斯迈达Ip有限公司 用于制造智能卡嵌体的方法和系统
CN101976368A (zh) * 2010-09-21 2011-02-16 深圳市卡的智能科技有限公司 Ic卡的制作方法

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DE4431605A1 (de) 1996-03-07
ATE173553T1 (de) 1998-12-15
FI970924A (fi) 1997-03-04
ES2125650T3 (es) 1999-03-01
WO1996007984A1 (de) 1996-03-14
FI970924A0 (fi) 1997-03-04
CN1105988C (zh) 2003-04-16
US5809633A (en) 1998-09-22
DE4431605C2 (de) 1998-06-04
KR100358785B1 (ko) 2003-04-21
KR970705803A (ko) 1997-10-09
EP0780006A1 (de) 1997-06-25
EP0780006B1 (de) 1998-11-18
UA54374C2 (uk) 2003-03-17
JPH10505023A (ja) 1998-05-19
DE59504285D1 (de) 1998-12-24
RU2155379C2 (ru) 2000-08-27

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