FR2801122B1 - Carte a memoire du type sans contact et procedes de fabrication d'une telle carte - Google Patents

Carte a memoire du type sans contact et procedes de fabrication d'une telle carte

Info

Publication number
FR2801122B1
FR2801122B1 FR9914342A FR9914342A FR2801122B1 FR 2801122 B1 FR2801122 B1 FR 2801122B1 FR 9914342 A FR9914342 A FR 9914342A FR 9914342 A FR9914342 A FR 9914342A FR 2801122 B1 FR2801122 B1 FR 2801122B1
Authority
FR
France
Prior art keywords
card
manufacturing
methods
contact type
type memory
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9914342A
Other languages
English (en)
Other versions
FR2801122A1 (fr
Inventor
Benoit Thevenot
Pascal Billebaud
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Axalto SA
Original Assignee
Schlumberger Systemes SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schlumberger Systemes SA filed Critical Schlumberger Systemes SA
Priority to FR9914342A priority Critical patent/FR2801122B1/fr
Publication of FR2801122A1 publication Critical patent/FR2801122A1/fr
Application granted granted Critical
Publication of FR2801122B1 publication Critical patent/FR2801122B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01087—Francium [Fr]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
FR9914342A 1999-11-16 1999-11-16 Carte a memoire du type sans contact et procedes de fabrication d'une telle carte Expired - Fee Related FR2801122B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR9914342A FR2801122B1 (fr) 1999-11-16 1999-11-16 Carte a memoire du type sans contact et procedes de fabrication d'une telle carte

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9914342A FR2801122B1 (fr) 1999-11-16 1999-11-16 Carte a memoire du type sans contact et procedes de fabrication d'une telle carte

Publications (2)

Publication Number Publication Date
FR2801122A1 FR2801122A1 (fr) 2001-05-18
FR2801122B1 true FR2801122B1 (fr) 2004-02-20

Family

ID=9552137

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9914342A Expired - Fee Related FR2801122B1 (fr) 1999-11-16 1999-11-16 Carte a memoire du type sans contact et procedes de fabrication d'une telle carte

Country Status (1)

Country Link
FR (1) FR2801122B1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1734799A1 (fr) * 2005-06-13 2006-12-20 MBBS Holding SA Transpondeur passif compact

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4410732C2 (de) * 1994-03-28 1997-05-07 Amatech Gmbh & Co Kg Verfahren zur Anordnung einer zumindest einen Chip und eine Drahtspule aufweisenden Transpondereinheit auf einem Substrat sowie Chipkarte mit entsprechend angeordneter Transpondereinheit
DE4431605C2 (de) * 1994-09-05 1998-06-04 Siemens Ag Verfahren zur Herstellung eines Chipkartenmoduls für kontaktlose Chipkarten
DE19642378C2 (de) * 1996-10-14 2000-06-08 Fraunhofer Ges Forschung Kontaktlose Chipkarte
FR2756955B1 (fr) * 1996-12-11 1999-01-08 Schlumberger Ind Sa Procede de realisation d'un circuit electronique pour une carte a memoire sans contact

Also Published As

Publication number Publication date
FR2801122A1 (fr) 2001-05-18

Similar Documents

Publication Publication Date Title
FR2778475B1 (fr) Carte a memoire du type sans contact, et procede de fabrication d'une telle carte
FR2756648B1 (fr) Carte a memoire du type sans contact
DE69936524D1 (de) Betriebsweise und schaltkreis eines speichers mit seriellem zugriff
FR2716281B1 (fr) Procédé de fabrication d'une carte sans contact.
FR2716555B1 (fr) Procédé de fabrication d'une carte sans contact.
DE60001685T2 (de) Halbleiterspeicherkarte und Datenlesevorrichtung
FR2770328B1 (fr) Point memoire remanent
DE69932059D1 (de) Trilineare texturfiltering mit optimiertem speicherzugriff
DE69927643D1 (de) Informationsverarbeitung und Datenspeicherung
DE69829618D1 (de) Platzeffizienter Halbleiterspeicher mit hierarchischer Spaltenauswahlleitungsarchitektur
DE60013079D1 (de) Doppeltes magnetisches Element mit zwei magnetischen Zustände und Herstellungsverfahren dafür
DE69834011D1 (de) Statische Direktzugriffspeicherschaltungen
FR2749687B1 (fr) Carte a memoire et procede de fabrication d'une telle carte
DE59900872D1 (de) Speicherzellenanordnung und entsprechendes Herstellungsverfahren
FR2684471B1 (fr) Procede de fabrication d'une carte a memoire et carte a memoire ainsi obtenue.
DE60132726D1 (de) Speicherzugriffschaltung und Speicherzugriffsteuerungsschaltung
MA25391A1 (fr) Inhibiteurs d'alcenyl et alcynyl metalloproteases.
DE69911102D1 (de) Verbesserte dynamische Direktzugriffspeicherschaltung und Herstellungsverfahren
DE59803426D1 (de) Speicherzellenanordnung und entsprechendes Herstellungsverfahren
FR2786902B1 (fr) Module electronique sans contact, carte a puce comportant un tel module, et leurs procedes de fabrication
DE69831294D1 (de) Platzeffizienter Halbleiterspeicher
DE60128323D1 (de) Datenverarbeitungsgerät und eine Speicherkarte mit dem Gerät
FR2801122B1 (fr) Carte a memoire du type sans contact et procedes de fabrication d'une telle carte
IT1301880B1 (it) Circuito elettronico di memoria e corrispondente metodo difabbricazione
FR2764414B1 (fr) Procede de fabrication de carte a puce sans contact

Legal Events

Date Code Title Description
CA Change of address
CD Change of name or company name
ST Notification of lapse

Effective date: 20090731