FR2786902B1 - Module electronique sans contact, carte a puce comportant un tel module, et leurs procedes de fabrication - Google Patents
Module electronique sans contact, carte a puce comportant un tel module, et leurs procedes de fabricationInfo
- Publication number
- FR2786902B1 FR2786902B1 FR9815374A FR9815374A FR2786902B1 FR 2786902 B1 FR2786902 B1 FR 2786902B1 FR 9815374 A FR9815374 A FR 9815374A FR 9815374 A FR9815374 A FR 9815374A FR 2786902 B1 FR2786902 B1 FR 2786902B1
- Authority
- FR
- France
- Prior art keywords
- module
- methods
- chip card
- making same
- contactless electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
- G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48237—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a die pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01068—Erbium [Er]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9815374A FR2786902B1 (fr) | 1998-12-04 | 1998-12-04 | Module electronique sans contact, carte a puce comportant un tel module, et leurs procedes de fabrication |
EP99956106A EP1138017A1 (fr) | 1998-12-04 | 1999-11-22 | Module electronique sans contact, carte a puce comportant un tel module, et leurs procedes de fabrication |
AU12783/00A AU1278300A (en) | 1998-12-04 | 1999-11-22 | Contactless electronic module, chip card comprising same, and methods for makingsame |
PCT/FR1999/002864 WO2000034916A1 (fr) | 1998-12-04 | 1999-11-22 | Module electronique sans contact, carte a puce comportant un tel module, et leurs procedes de fabrication |
CN99814106A CN1329735A (zh) | 1998-12-04 | 1999-11-22 | 无触点电子模块、带有该模块的芯片卡及制造该模块的方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9815374A FR2786902B1 (fr) | 1998-12-04 | 1998-12-04 | Module electronique sans contact, carte a puce comportant un tel module, et leurs procedes de fabrication |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2786902A1 FR2786902A1 (fr) | 2000-06-09 |
FR2786902B1 true FR2786902B1 (fr) | 2001-01-26 |
Family
ID=9533625
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9815374A Expired - Fee Related FR2786902B1 (fr) | 1998-12-04 | 1998-12-04 | Module electronique sans contact, carte a puce comportant un tel module, et leurs procedes de fabrication |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP1138017A1 (fr) |
CN (1) | CN1329735A (fr) |
AU (1) | AU1278300A (fr) |
FR (1) | FR2786902B1 (fr) |
WO (1) | WO2000034916A1 (fr) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU3150000A (en) | 2000-01-19 | 2001-07-31 | Fractus, S.A. | Space-filling miniature antennas |
DE10016037B4 (de) * | 2000-03-31 | 2005-01-05 | Interlock Ag | Verfahren zur Herstellung eines Etiketts oder einer Chipkarte |
TW594588B (en) * | 2001-06-13 | 2004-06-21 | Nagracard Sa | Detachable smart card on a pre-punched support |
DE10139383B4 (de) * | 2001-08-10 | 2006-06-01 | Infineon Technologies Ag | Chipmodul |
CN1582515A (zh) | 2001-12-10 | 2005-02-16 | 弗拉克托斯股份有限公司 | 无触点识别装置 |
WO2004042868A1 (fr) | 2002-11-07 | 2004-05-21 | Fractus, S.A. | Boitier de circuit integre incluant une antenne miniature |
US8305213B2 (en) | 2004-01-23 | 2012-11-06 | Semiconductor Energy Laboratory Co., Ltd. | Film-like article and method for manufacturing the same |
US8330259B2 (en) | 2004-07-23 | 2012-12-11 | Fractus, S.A. | Antenna in package with reduced electromagnetic interaction with on chip elements |
US8196829B2 (en) | 2006-06-23 | 2012-06-12 | Fractus, S.A. | Chip module, sim card, wireless device and wireless communication method |
US8738103B2 (en) | 2006-07-18 | 2014-05-27 | Fractus, S.A. | Multiple-body-configuration multimedia and smartphone multifunction wireless devices |
WO2011062272A1 (fr) * | 2009-11-19 | 2011-05-26 | 株式会社フジクラ | Dispositif d'antenne |
JP5672067B2 (ja) | 2010-03-09 | 2015-02-18 | 株式会社リコー | 可逆性感熱記録媒体の製造方法及び製造装置、並びに可逆性感熱記録媒体 |
WO2015113184A1 (fr) * | 2014-01-29 | 2015-08-06 | 北京嘉岳同乐极电子有限公司 | Capteur magnétique à haute sensibilité et son procédé de fabrication |
FR3049739B1 (fr) * | 2016-03-30 | 2021-03-12 | Linxens Holding | Procedes de fabrication de cartes a puce et de supports d’antenne pour carte a puce |
FR3086099B1 (fr) * | 2018-09-18 | 2022-12-16 | Smart Packaging Solutions | Procede de fabrication d'un module a carte et le module obtenu |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3721822C1 (en) * | 1987-07-02 | 1988-11-10 | Philips Patentverwaltung | Chip card |
EP0646893A1 (fr) * | 1993-10-05 | 1995-04-05 | Gemplus S.C.A. | Jeton de paiement électronique anti-fraude et procédé de fabrication |
FR2716555B1 (fr) * | 1994-02-24 | 1996-05-15 | Gemplus Card Int | Procédé de fabrication d'une carte sans contact. |
-
1998
- 1998-12-04 FR FR9815374A patent/FR2786902B1/fr not_active Expired - Fee Related
-
1999
- 1999-11-22 WO PCT/FR1999/002864 patent/WO2000034916A1/fr not_active Application Discontinuation
- 1999-11-22 EP EP99956106A patent/EP1138017A1/fr not_active Withdrawn
- 1999-11-22 CN CN99814106A patent/CN1329735A/zh active Pending
- 1999-11-22 AU AU12783/00A patent/AU1278300A/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
WO2000034916A1 (fr) | 2000-06-15 |
AU1278300A (en) | 2000-06-26 |
EP1138017A1 (fr) | 2001-10-04 |
FR2786902A1 (fr) | 2000-06-09 |
CN1329735A (zh) | 2002-01-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |
Effective date: 20090831 |