FR3086099B1 - Procede de fabrication d'un module a carte et le module obtenu - Google Patents

Procede de fabrication d'un module a carte et le module obtenu Download PDF

Info

Publication number
FR3086099B1
FR3086099B1 FR1858423A FR1858423A FR3086099B1 FR 3086099 B1 FR3086099 B1 FR 3086099B1 FR 1858423 A FR1858423 A FR 1858423A FR 1858423 A FR1858423 A FR 1858423A FR 3086099 B1 FR3086099 B1 FR 3086099B1
Authority
FR
France
Prior art keywords
module
manufacturing
card
card module
module obtained
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1858423A
Other languages
English (en)
Other versions
FR3086099A1 (fr
Inventor
Benjamin Mear
Guillaume Gerin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Smart Packaging Solutions SAS
Original Assignee
Smart Packaging Solutions SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Smart Packaging Solutions SAS filed Critical Smart Packaging Solutions SAS
Priority to FR1858423A priority Critical patent/FR3086099B1/fr
Priority to PCT/EP2019/074999 priority patent/WO2020058331A1/fr
Priority to CN201980060762.1A priority patent/CN112714915A/zh
Priority to EP19768845.0A priority patent/EP3853775B1/fr
Publication of FR3086099A1 publication Critical patent/FR3086099A1/fr
Application granted granted Critical
Publication of FR3086099B1 publication Critical patent/FR3086099B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
    • G06K19/07769—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G06K19/07754—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being galvanic
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G06K19/07756—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being non-galvanic, e.g. capacitive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Wire Bonding (AREA)
FR1858423A 2018-09-18 2018-09-18 Procede de fabrication d'un module a carte et le module obtenu Active FR3086099B1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
FR1858423A FR3086099B1 (fr) 2018-09-18 2018-09-18 Procede de fabrication d'un module a carte et le module obtenu
PCT/EP2019/074999 WO2020058331A1 (fr) 2018-09-18 2019-09-18 Procede de fabrication d'un module a carte et le module obtenu
CN201980060762.1A CN112714915A (zh) 2018-09-18 2019-09-18 制造卡片模块的方法及所获得的模块
EP19768845.0A EP3853775B1 (fr) 2018-09-18 2019-09-18 Procede de fabrication d'un module a carte et le module obtenu

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR1858423A FR3086099B1 (fr) 2018-09-18 2018-09-18 Procede de fabrication d'un module a carte et le module obtenu

Publications (2)

Publication Number Publication Date
FR3086099A1 FR3086099A1 (fr) 2020-03-20
FR3086099B1 true FR3086099B1 (fr) 2022-12-16

Family

ID=65443942

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1858423A Active FR3086099B1 (fr) 2018-09-18 2018-09-18 Procede de fabrication d'un module a carte et le module obtenu

Country Status (4)

Country Link
EP (1) EP3853775B1 (fr)
CN (1) CN112714915A (fr)
FR (1) FR3086099B1 (fr)
WO (1) WO2020058331A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116235180A (zh) * 2020-09-25 2023-06-06 兰克森控股公司 智能卡的预层合嵌体、形成智能卡的预层合嵌体的方法、以及智能卡

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2753819B1 (fr) * 1996-09-20 1998-11-27 Carte a circuit integre a connexion mixte
FR2786902B1 (fr) * 1998-12-04 2001-01-26 Gemplus Card Int Module electronique sans contact, carte a puce comportant un tel module, et leurs procedes de fabrication
DE10108080C1 (de) * 2001-02-20 2002-04-04 Infineon Technologies Ag Kontaktlos arbeitender Datenträger mit einer kapazitiv an das Modul gekoppelten Antennenspule
FR2880160B1 (fr) * 2004-12-28 2007-03-30 K Sa As Module electronique double face pour carte a puce hybride
FR2957175B1 (fr) * 2010-03-08 2012-08-17 Sansystems Dispositif electronique a puce et procede de fabrication par bobines.
US8870080B2 (en) * 2010-08-12 2014-10-28 Féinics Amatech Teoranta RFID antenna modules and methods

Also Published As

Publication number Publication date
WO2020058331A1 (fr) 2020-03-26
FR3086099A1 (fr) 2020-03-20
CN112714915A (zh) 2021-04-27
EP3853775A1 (fr) 2021-07-28
EP3853775B1 (fr) 2023-07-26

Similar Documents

Publication Publication Date Title
FR3021145B1 (fr) Procede de fabrication d'un circuit pour module de carte a puce et circuit pour module de carte a puce
FR2925254B1 (fr) Dispositif de refroidissement d'une carte electronique par conduction a l'aide de caloducs,et procede de fabrication correspondant.
FR3003723B1 (fr) Procede de fabrication d'un circuit imprime flexible, circuit imprime flexible obtenu par ce procede et module de carte a puce comportant un tel circuit imprime flexible
FR3033977B1 (fr) Procede de fabrication d'un circuit imprime et circuits imprimes correspondants
FR3025056B1 (fr) Dispositif laser et procede de fabrication d'un tel dispositif laser
FR3086099B1 (fr) Procede de fabrication d'un module a carte et le module obtenu
FR3046425B1 (fr) Photocathode pour un dispositif de photoelectrolyse, un procede de fabrication d'une telle photocathode et un dispositif de photoelectrolyse
FR3058258B1 (fr) Procede de fabrication de plots d'assemblage sur un support pour l'auto-assemblage d'un circuit electronique sur le support
FR3037859B1 (fr) Dispositif et procede de production d'un element multicouche
FR3035815B1 (fr) Procede de fabrication d'une piece plastique, et dispositif associe
FR3057586B1 (fr) Procede de fabrication d'un balcon et balcon obtenu
FR3050670B1 (fr) Virole et procede de fabrication d'un carter comprenant une virole
FR3040822B1 (fr) Procede de fabrication d'un dispositif a jonction electronique et dispositif associe
FR3067855B1 (fr) Dispositif a multiples transistors, redresseurs en pont et procede de fabrication d'un tel dispositif
FR3022077B1 (fr) Dispositif thermoelectrique, module thermoelectrique comprenant un tel dispositif thermoelectrique et procede de fabrication d'un tel dispositif thermoelectrique.
FR3013872B1 (fr) Procede de fabrication d'une carte a relief apparent
FR3036536B1 (fr) Procede de fabrication d'un nanogenerateur piezo-electrique, nanogenerateur piezo-electrique obtenu par ce procede et dispositif comportant un tel nanogenerateur piezo-electrique
FR3050563B1 (fr) Dispositif d'affichage pour vehicule et procede de fabrication correspondant
TH1701006480A (th) วิธีการสำหรับการผลิตแม่เหล็กที่มี RFeB เป็นพื้นฐาน
FR3036670B1 (fr) Procede de fabrication d'un habillage et habillage correspondant
FR3001332B1 (fr) Procede de fabrication d'un corps de carte a puce
TH181956A (th) เครื่องจักร, ระบบ, และวิธีการสำหรับการจัดดำเนินการชิ้นส่วนปั๊ม ขึ้นรูปที่วางซ้อนภายใน
UA45205S (uk) 1.-6. малюнок для етикетки
FR3055449B1 (fr) Procede de fabrication d'un organigramme de serrures.
TH1701006536A (th) วิธีการสำหรับการผลิตระบบสีมัลติโค้ทบนซับสเทรทพลาสติก

Legal Events

Date Code Title Description
PLFP Fee payment

Year of fee payment: 2

PLSC Publication of the preliminary search report

Effective date: 20200320

PLFP Fee payment

Year of fee payment: 3

PLFP Fee payment

Year of fee payment: 4

PLFP Fee payment

Year of fee payment: 5

PLFP Fee payment

Year of fee payment: 6