WO2000034916A1 - Module electronique sans contact, carte a puce comportant un tel module, et leurs procedes de fabrication - Google Patents
Module electronique sans contact, carte a puce comportant un tel module, et leurs procedes de fabrication Download PDFInfo
- Publication number
- WO2000034916A1 WO2000034916A1 PCT/FR1999/002864 FR9902864W WO0034916A1 WO 2000034916 A1 WO2000034916 A1 WO 2000034916A1 FR 9902864 W FR9902864 W FR 9902864W WO 0034916 A1 WO0034916 A1 WO 0034916A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- antenna
- integrated circuit
- electronic module
- circuit chip
- cavity
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
- G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48237—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a die pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01068—Erbium [Er]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Definitions
- the present invention relates to the field of portable elements such as contactless smart cards provided with an electronic module comprising an integrated circuit chip.
- the invention further relates to a method of manufacturing such cards and also to a method of manufacturing contactless electronic modules intended to be inserted into these cards.
- Chip cards whether contactless and / or contactless, are made to standardized dimensions.
- a standard which is common but not limiting for the present invention is that known as ISO 7810 which corresponds to a standard format card 85 mm in length, 54 mm in width, and 0.76 mm in thickness.
- the telephone cards for example, used until now are smart cards of the contact type.
- the metallizations flush with the surface of these cards are intended to come into contact with a read head of a reader for the purpose of electrical data transmission.
- the use of this type of card requires regular maintenance of the read head connectors, in order to permanently ensure an electrical transmission of good quality data. However, such regular maintenance generates significant expenses.
- the present invention proposes to avoid such expenses and to eliminate maintenance operations. For this, it proposes to replace the existing smart cards with contacts by contactless smart cards that can be used in the same reader.
- the exchange of information takes place through an electromagnetic coupling (of the inductive type) between the electronics of the card and the receiver or reader device.
- the coupling can be carried out in read-only mode, or in read / write mode.
- An integrated circuit chip 26 is then transferred and fixed by bonding to the dielectric support 21.
- This chip is connected to the connection pads 28 of the antenna 25 for example by means of conducting wires 27 (FIG. 1A), or then directly by applying an electrically conducting adhesive to the connection terminals 28 of the antenna 25 (FIG. 1B). In the latter case, an insulator must however be interposed between the chip 26 and the areas of the antenna turns covered by the chip, in order to avoid the appearance of short circuits.
- the chip 26 and its connections to the antenna 25 are then protected by a coating resin 29 (FIG. 1A).
- the module 20 thus obtained is then transferred to the cavity 11 of the card 10, and it is fixed by gluing 30, so that the dielectric support 21 of the module is flush with the surface of the card 10 (FIG. 1A).
- the invention makes it possible to further reduce these costs and to make contactless smart cards at very low cost.
- an electronic module of the type suitable for the manufacture of contactless smart cards and comprising an integrated circuit chip connected to an antenna so as to allow contactless operation of the module, said module antenna being entirely contained in the module, characterized in that said antenna is constituted by at least one conductive turn, obtained by cutting a metallic film, the two ends of said antenna being electrically connected to two contact pads of the integrated circuit chip.
- the antenna coil has a width of the order of 750 ⁇ m to 1 mm.
- the module according to the invention does not include a dielectric support and the antenna is obtained by a simple cutting of a metallic film and not by lamination on a dielectric support.
- the cost of the module according to the invention is reduced by a value of around 30 cents compared to the module of the prior art described above. This cost reduction is considerable when it is desired, for example, to manufacture around 30,000 smart cards per day.
- the integrated circuit chip is disposed astride the antenna coil, the antenna connection terminals being connected to corresponding contact pads of the integrated circuit chip by the intermediate of conductive wires, and an insulating adhesive being interposed between the integrated circuit chip and at least one area of the antenna coil situated under said chip.
- the integrated circuit chip is disposed astride the two ends of the antenna turn, so that two of its contact pads are electrically connected to the connection terminals of said antenna .
- the electrical connection between the contact pads of the integrated circuit chip and the antenna connection terminals is obtained by means of an electrically conductive adhesive.
- Another object of the invention relates to a method of manufacturing this contactless electronic module.
- This method is characterized in that it comprises the following steps: precut an antenna turn by punching a metallic film then, in any order, - fix, on said antenna turn, a chip integrated circuit and make an electrical connection between the contact pads of said chip and the antenna connection terminals,
- Another object of the invention relates to a contactless smart card characterized in that it is provided with the electronic module according to the invention.
- a final object of the invention relates to a method of manufacturing such a contactless smart card, comprising a card body and the electronic module according to the invention, characterized in that it comprises the following steps:
- FIGS. 1A and 1B already described, respectively a sectional view and a top view of a contactless electronic module, according to two alternative embodiments of the prior art, inserted in a card body,
- FIGS. 2A and 2B respectively a sectional view and a top view of a contactless electronic module, according to a first embodiment of the invention, inserted in a card body,
- FIG. 3A and 3B respectively a sectional view and a top view of a contactless electronic module, according to a second embodiment of the invention, inserted in a card body.
- FIGS. 2A and 2B represent a contactless electronic module 100, according to a first embodiment, inserted in a cavity 41 of a card body 40.
- This electronic module comprises an integrated circuit chip 55 connected to an antenna 50 to allow contactless operation of the module.
- the antenna 50 is entirely contained in the module. It consists of at least one conductive turn obtained by cutting a metallic film. Two zones 51 of this antenna turn 50 are on the other hand electrically connected to two contact pads 58 of the integrated circuit chip 55.
- the antenna turn also has a greater width than conventional multi-turn antennas . The width is indeed between approximately 750 ⁇ m and 1 mm. This antenna coil is sufficient to ensure the possibility of an electromagnetic transmission between the electronics of the card and the reader.
- the contactless card at very low cost according to the invention being intended to replace the traditional contact card, it can also be inserted in the reader slot.
- the contactless card will be located at a distance very close to the reader, typically less than 5 cm, so that the antenna coil, of width between 750 ⁇ m and 1 mm, will be sufficient to ensure electromagnetic transmission. of data.
- the embodiment of the electronic module is not limited to these steps.
- a first step a complete cutting of the antenna coil; then, in a second step, a transfer and a connection of the chip to the antenna.
- the first manufacturing method consisting of pre-cutting the antenna and detaching it from the metallic film only after having transferred and connected the chip, is preferred because, in this case, the transfer of the chip is easier and more precise. enforce.
- the method according to the invention makes it possible to produce such electronic modules without contact continuously. Indeed, the metal film can be driven continuously and, as it advances, the precut steps are carried out, to form an antenna turn, then transfer and connection of an integrated circuit chip .
- the electronic modules formed are then permanently detached from the metallic film just before their transfer into the cavity of a card body.
- the chip 55 and its connections to the antenna 50 can optionally be coated in a protective resin.
- this coating is not essential and it is moreover not shown in FIGS. 2A and 2B.
- this coating is not necessary because, during the transfer of the module 100 thus produced in a cavity 41 of the card body 40, this module is embedded in a resin 60 which is injected or cast in the cavity 41.
- the cavity 41 of the card body 40 can be obtained by machining or by injection molding. This resin simultaneously allows the module to be fixedly fixed in its location and to protect it against external aggressions.
- the module is transferred into the cavity 41 so that the integrated circuit chip 55 is placed in the bottom of the cavity, below the antenna turn (as shown in the sectional view of FIG. 2A).
- FIGS. 3A and 3B respectively represent a sectional view and a top view of another contactless electronic module 100 inserted in a cavity 41 previously machined in a card body 40.
- the production of the module 100 and its transfer into the cavity 41 of the card body 40 are performed in the same manner as previously described.
- the integrated circuit chip 75 is transferred and connected to the antenna coil 70.
- the integrated circuit chip 75 is disposed at astride the two ends 71 of the antenna coil 70, so that two of its contact pads 76 rest on the two ends (or connection terminals) 71 of the antenna coil 70.
- the electrical connection between the contact pads 76 of the chip 75 and the connection terminals 71 of the antenna 70 is for example made using an electrically conductive adhesive which simultaneously makes it possible to secure the chip on the antenna.
- the cavity 41, formed in the card body, as well as the antenna turn 50, 70 are produced in a circular shape.
- the invention is not limited to this form. Indeed, the antenna turn, as well as the cavity 41, could very well be produced according to any other possible shape, such as a rectangular shape, or even triangular for example.
- the invention makes it possible to considerably reduce the manufacturing costs of contactless cards. It also uses the same production lines to produce electronic modules with integrated antenna, and contactless cards.
- a known construction of a contactless module is used which is placed in a cavity 41 and which is covered with filling resin.
- the module can for example be that of FIG. 1A.
- the economical method according to the invention can be implemented regardless of the construction of the module, in particular the antenna.
- the antenna can be produced in particular by a metal wire.
- the economic structure of the card obtained is therefore a card body provided with a cavity, for example circular, wide for example from 0.5 to 1.5 cm, comprising a chip connected to an antenna placed entirely in the cavity and a filling material covering the chip and the antenna and the level of which is flush with the surface of the card body as much as possible.
- the cavity 41 of the card body 40 according to the invention can comprise centering means having the function of centering the antenna 70 precisely with respect to the cavity 41 and therefore with respect to the edges of the card.
- the antenna 70 will be perfectly centered in a reader.
- these means can consist of one or more conical fingers erected from the bottom and in the middle of the cavity, the edge of the cavity can be flared outwards.
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP99956106A EP1138017A1 (fr) | 1998-12-04 | 1999-11-22 | Module electronique sans contact, carte a puce comportant un tel module, et leurs procedes de fabrication |
AU12783/00A AU1278300A (en) | 1998-12-04 | 1999-11-22 | Contactless electronic module, chip card comprising same, and methods for makingsame |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9815374A FR2786902B1 (fr) | 1998-12-04 | 1998-12-04 | Module electronique sans contact, carte a puce comportant un tel module, et leurs procedes de fabrication |
FR98/15374 | 1998-12-04 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2000034916A1 true WO2000034916A1 (fr) | 2000-06-15 |
Family
ID=9533625
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/FR1999/002864 WO2000034916A1 (fr) | 1998-12-04 | 1999-11-22 | Module electronique sans contact, carte a puce comportant un tel module, et leurs procedes de fabrication |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP1138017A1 (fr) |
CN (1) | CN1329735A (fr) |
AU (1) | AU1278300A (fr) |
FR (1) | FR2786902B1 (fr) |
WO (1) | WO2000034916A1 (fr) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10016037A1 (de) * | 2000-03-31 | 2001-10-18 | Interlock Ag Schlieren | Verfahren zur Herstellung eines Etiketts oder einer Chipkarte, Vorrichtung zur Durchführung des Verfahrens und danach hergestelltes Etikett oder Chipkarte |
US7463199B2 (en) | 2002-11-07 | 2008-12-09 | Fractus, S.A. | Integrated circuit package including miniature antenna |
US7520440B2 (en) | 2001-12-10 | 2009-04-21 | Fractus, S.A. | Contactless identification device |
US8196829B2 (en) | 2006-06-23 | 2012-06-12 | Fractus, S.A. | Chip module, sim card, wireless device and wireless communication method |
US8207893B2 (en) | 2000-01-19 | 2012-06-26 | Fractus, S.A. | Space-filling miniature antennas |
US8330259B2 (en) | 2004-07-23 | 2012-12-11 | Fractus, S.A. | Antenna in package with reduced electromagnetic interaction with on chip elements |
US9099773B2 (en) | 2006-07-18 | 2015-08-04 | Fractus, S.A. | Multiple-body-configuration multimedia and smartphone multifunction wireless devices |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW594588B (en) * | 2001-06-13 | 2004-06-21 | Nagracard Sa | Detachable smart card on a pre-punched support |
DE10139383B4 (de) * | 2001-08-10 | 2006-06-01 | Infineon Technologies Ag | Chipmodul |
WO2005071607A1 (fr) | 2004-01-23 | 2005-08-04 | Semiconductor Energy Laboratory Co., Ltd. | Article de type film et procede de fabrication de l'article |
JP5511841B2 (ja) * | 2009-11-19 | 2014-06-04 | 株式会社フジクラ | アンテナ装置 |
JP5672067B2 (ja) * | 2010-03-09 | 2015-02-18 | 株式会社リコー | 可逆性感熱記録媒体の製造方法及び製造装置、並びに可逆性感熱記録媒体 |
CN106104290B (zh) * | 2014-01-29 | 2019-06-04 | 北京嘉岳同乐极电子有限公司 | 高灵敏磁传感器及其制作方法 |
FR3049739B1 (fr) * | 2016-03-30 | 2021-03-12 | Linxens Holding | Procedes de fabrication de cartes a puce et de supports d’antenne pour carte a puce |
FR3086099B1 (fr) * | 2018-09-18 | 2022-12-16 | Smart Packaging Solutions | Procede de fabrication d'un module a carte et le module obtenu |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3721822C1 (en) * | 1987-07-02 | 1988-11-10 | Philips Patentverwaltung | Chip card |
EP0646893A1 (fr) * | 1993-10-05 | 1995-04-05 | Gemplus S.C.A. | Jeton de paiement électronique anti-fraude et procédé de fabrication |
EP0669597A1 (fr) * | 1994-02-24 | 1995-08-30 | Gemplus Card International | Procédé de fabrication d'une carte sans contact |
-
1998
- 1998-12-04 FR FR9815374A patent/FR2786902B1/fr not_active Expired - Fee Related
-
1999
- 1999-11-22 EP EP99956106A patent/EP1138017A1/fr not_active Withdrawn
- 1999-11-22 AU AU12783/00A patent/AU1278300A/en not_active Abandoned
- 1999-11-22 CN CN99814106A patent/CN1329735A/zh active Pending
- 1999-11-22 WO PCT/FR1999/002864 patent/WO2000034916A1/fr not_active Application Discontinuation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3721822C1 (en) * | 1987-07-02 | 1988-11-10 | Philips Patentverwaltung | Chip card |
EP0646893A1 (fr) * | 1993-10-05 | 1995-04-05 | Gemplus S.C.A. | Jeton de paiement électronique anti-fraude et procédé de fabrication |
EP0669597A1 (fr) * | 1994-02-24 | 1995-08-30 | Gemplus Card International | Procédé de fabrication d'une carte sans contact |
Cited By (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8471772B2 (en) | 2000-01-19 | 2013-06-25 | Fractus, S.A. | Space-filling miniature antennas |
US10355346B2 (en) | 2000-01-19 | 2019-07-16 | Fractus, S.A. | Space-filling miniature antennas |
US9331382B2 (en) | 2000-01-19 | 2016-05-03 | Fractus, S.A. | Space-filling miniature antennas |
US8610627B2 (en) | 2000-01-19 | 2013-12-17 | Fractus, S.A. | Space-filling miniature antennas |
US8207893B2 (en) | 2000-01-19 | 2012-06-26 | Fractus, S.A. | Space-filling miniature antennas |
US8212726B2 (en) | 2000-01-19 | 2012-07-03 | Fractus, Sa | Space-filling miniature antennas |
US8558741B2 (en) | 2000-01-19 | 2013-10-15 | Fractus, S.A. | Space-filling miniature antennas |
DE10016037B4 (de) * | 2000-03-31 | 2005-01-05 | Interlock Ag | Verfahren zur Herstellung eines Etiketts oder einer Chipkarte |
DE10016037A1 (de) * | 2000-03-31 | 2001-10-18 | Interlock Ag Schlieren | Verfahren zur Herstellung eines Etiketts oder einer Chipkarte, Vorrichtung zur Durchführung des Verfahrens und danach hergestelltes Etikett oder Chipkarte |
US7520440B2 (en) | 2001-12-10 | 2009-04-21 | Fractus, S.A. | Contactless identification device |
US7793849B2 (en) | 2001-12-10 | 2010-09-14 | Juan Ignacio Ortigosa Vallejo | Contactless identification device |
US10644405B2 (en) | 2002-11-07 | 2020-05-05 | Fractus, S.A. | Integrated circuit package including miniature antenna |
US8203488B2 (en) | 2002-11-07 | 2012-06-19 | Fractus, S.A. | Integrated circuit package including miniature antenna |
US9077073B2 (en) | 2002-11-07 | 2015-07-07 | Fractus, S.A. | Integrated circuit package including miniature antenna |
US10320079B2 (en) | 2002-11-07 | 2019-06-11 | Fractus, S.A. | Integrated circuit package including miniature antenna |
US7791539B2 (en) | 2002-11-07 | 2010-09-07 | Fractus, S.A. | Radio-frequency system in package including antenna |
US9761948B2 (en) | 2002-11-07 | 2017-09-12 | Fractus, S.A. | Integrated circuit package including miniature antenna |
US7463199B2 (en) | 2002-11-07 | 2008-12-09 | Fractus, S.A. | Integrated circuit package including miniature antenna |
US10056691B2 (en) | 2002-11-07 | 2018-08-21 | Fractus, S.A. | Integrated circuit package including miniature antenna |
US8330259B2 (en) | 2004-07-23 | 2012-12-11 | Fractus, S.A. | Antenna in package with reduced electromagnetic interaction with on chip elements |
US8196829B2 (en) | 2006-06-23 | 2012-06-12 | Fractus, S.A. | Chip module, sim card, wireless device and wireless communication method |
US9899727B2 (en) | 2006-07-18 | 2018-02-20 | Fractus, S.A. | Multiple-body-configuration multimedia and smartphone multifunction wireless devices |
US9099773B2 (en) | 2006-07-18 | 2015-08-04 | Fractus, S.A. | Multiple-body-configuration multimedia and smartphone multifunction wireless devices |
US10644380B2 (en) | 2006-07-18 | 2020-05-05 | Fractus, S.A. | Multiple-body-configuration multimedia and smartphone multifunction wireless devices |
US11031677B2 (en) | 2006-07-18 | 2021-06-08 | Fractus, S.A. | Multiple-body-configuration multimedia and smartphone multifunction wireless devices |
US11349200B2 (en) | 2006-07-18 | 2022-05-31 | Fractus, S.A. | Multiple-body-configuration multimedia and smartphone multifunction wireless devices |
US11735810B2 (en) | 2006-07-18 | 2023-08-22 | Fractus, S.A. | Multiple-body-configuration multimedia and smartphone multifunction wireless devices |
Also Published As
Publication number | Publication date |
---|---|
AU1278300A (en) | 2000-06-26 |
FR2786902B1 (fr) | 2001-01-26 |
CN1329735A (zh) | 2002-01-02 |
FR2786902A1 (fr) | 2000-06-09 |
EP1138017A1 (fr) | 2001-10-04 |
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