DE602004016690D1 - Verfahren zur herstellung eines elektronischen labels - Google Patents
Verfahren zur herstellung eines elektronischen labelsInfo
- Publication number
- DE602004016690D1 DE602004016690D1 DE602004016690T DE602004016690T DE602004016690D1 DE 602004016690 D1 DE602004016690 D1 DE 602004016690D1 DE 602004016690 T DE602004016690 T DE 602004016690T DE 602004016690 T DE602004016690 T DE 602004016690T DE 602004016690 D1 DE602004016690 D1 DE 602004016690D1
- Authority
- DE
- Germany
- Prior art keywords
- electronic label
- producing
- chip
- antenna
- conducting wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 title abstract 2
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/06—Coil winding
- H01F41/076—Forming taps or terminals while winding, e.g. by wrapping or soldering the wire onto pins, or by directly forming terminals from the wire
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
- Y10T29/4914—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture with deforming of lead or terminal
- Y10T29/49142—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture with deforming of lead or terminal including metal fusion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
- Y10T29/49149—Assembling terminal to base by metal fusion bonding
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49158—Manufacturing circuit on or in base with molding of insulated base
- Y10T29/4916—Simultaneous circuit manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49162—Manufacturing circuit on or in base by using wire as conductive path
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49174—Assembling terminal to elongated conductor
- Y10T29/49179—Assembling terminal to elongated conductor by metal fusion bonding
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Details Of Aerials (AREA)
- Credit Cards Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/IB2004/000887 WO2005093645A1 (fr) | 2004-03-25 | 2004-03-25 | Procede de fabrication d'une etiquette electronique et etiquette electronique obtenue par ledit procede |
Publications (1)
Publication Number | Publication Date |
---|---|
DE602004016690D1 true DE602004016690D1 (de) | 2008-10-30 |
Family
ID=34957214
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE602004016690T Expired - Lifetime DE602004016690D1 (de) | 2004-03-25 | 2004-03-25 | Verfahren zur herstellung eines elektronischen labels |
Country Status (5)
Country | Link |
---|---|
US (1) | US7815122B2 (de) |
EP (1) | EP1738303B1 (de) |
AT (1) | ATE408870T1 (de) |
DE (1) | DE602004016690D1 (de) |
WO (1) | WO2005093645A1 (de) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE602004016690D1 (de) * | 2004-03-25 | 2008-10-30 | Bauer Eric | Verfahren zur herstellung eines elektronischen labels |
CN102133686B (zh) * | 2011-01-24 | 2013-12-18 | 东莞市锐祥智能卡科技有限公司 | 一种双界面卡激光焊线方法及设备 |
CN103632186B (zh) * | 2012-08-23 | 2017-01-25 | 东莞市锐祥智能卡科技有限公司 | 双界面卡芯片碰焊及封装的方法及其装置 |
JP2016518992A (ja) * | 2013-05-03 | 2016-06-30 | マグナ インターナショナル インコーポレイテッド | アルミニウム溶接方法 |
US10010966B2 (en) * | 2014-02-14 | 2018-07-03 | GM Global Technology Operations LLC | Electrode for resistance spot welding of dissimilar metals |
US10602932B2 (en) | 2015-12-16 | 2020-03-31 | Siren Care, Inc. | System and method for detecting inflammation in a foot |
CA3038078A1 (en) | 2016-09-27 | 2018-04-05 | Siren Care, Inc. | Smart yarn and method for manufacturing a yarn containing an electronic device |
CN107358781A (zh) * | 2017-09-19 | 2017-11-17 | 绵阳鑫阳知识产权运营有限公司 | 提前预警的绕线机线盘更换系统 |
WO2020118694A1 (en) | 2018-12-14 | 2020-06-18 | Siren Care, Inc. | Temperature-sensing garment and method for making same |
Family Cites Families (41)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2528806C2 (de) * | 1975-06-27 | 1983-09-15 | Texas Instruments Deutschland Gmbh, 8050 Freising | Schweißvorrichtung |
DE2608250C3 (de) * | 1976-02-28 | 1985-06-05 | Telefunken electronic GmbH, 7100 Heilbronn | Verfahren zum Thermokompressions-Verbinden von auf Halbleiterkörpern befindlichen Metall-Anschlußkontakten mit zugeordneten Gehäuseanschlußteilen und Vorrichtung zur Durchführung des Verfahrens |
US4110838A (en) * | 1976-07-30 | 1978-08-29 | Texas Instruments Incorporated | Magnetic bubble memory package |
CH684642A5 (fr) * | 1991-02-25 | 1994-11-15 | Ake Gustafson | Pince de maintien d'un corps de bobine dans une machine de bobinage. |
DE4218741C2 (de) * | 1992-06-06 | 1994-10-20 | Vossloh Schwabe Gmbh | Verfahren zum Verdrahten von Anschlußstellen elektrischer Geräte oder Baugruppenelemente |
DE4410732C2 (de) * | 1994-03-28 | 1997-05-07 | Amatech Gmbh & Co Kg | Verfahren zur Anordnung einer zumindest einen Chip und eine Drahtspule aufweisenden Transpondereinheit auf einem Substrat sowie Chipkarte mit entsprechend angeordneter Transpondereinheit |
DE4431605C2 (de) * | 1994-09-05 | 1998-06-04 | Siemens Ag | Verfahren zur Herstellung eines Chipkartenmoduls für kontaktlose Chipkarten |
FR2743649B1 (fr) * | 1996-01-17 | 1998-04-03 | Gemplus Card Int | Module electronique sans contact, carte etiquette electronique l'incorporant, et leurs procedes de fabrication |
DE19605038A1 (de) * | 1996-02-12 | 1997-08-14 | Daimler Benz Ag | Verfahren zum Bonden von Isolierdraht und Vorrichtung zur Durchführung des Verfahrens |
DE59701709C5 (de) * | 1996-02-12 | 2014-01-09 | Smartrac Ip B.V. | Verfahren und vorrichtung zur kontaktierung eines drahtleiters |
EP0913268A4 (de) * | 1997-05-19 | 2004-11-17 | Hitachi Maxell | Flexibeles ic-modul und verfahren zu seiner herstellung und verfahren zur herstellung eines informationsträgers, der ein ic-modul enthält |
DE69832274T2 (de) * | 1997-05-28 | 2006-08-03 | Synaptics (Uk) Ltd., Harston | Verfahren und drahtbond-vorrichtung zur herstellung eines wandlers |
US6100804A (en) * | 1998-10-29 | 2000-08-08 | Intecmec Ip Corp. | Radio frequency identification system |
WO2000069234A1 (fr) * | 1999-05-07 | 2000-11-16 | The Furukawa Electric Co., Ltd. | Procede de cablage et dispositif de cablage |
FR2801708B1 (fr) * | 1999-11-29 | 2003-12-26 | A S K | Procede de fabrication d'une carte a puce sans contact avec un support d'antenne en materiau fibreux |
WO2001052316A1 (fr) * | 2000-01-14 | 2001-07-19 | Toray Engineering Co., Ltd. | Procede de montage de puce |
US20020099473A1 (en) * | 2000-11-08 | 2002-07-25 | Paul Amadeo | Integrated computer-aided design (CAD) and robotic systems for rapid prototyping and manufacture of smart cards |
US20020055822A1 (en) * | 2000-11-08 | 2002-05-09 | Paul Amadeo | Integrated welding and testing in the manufacture of smart cards |
FR2824939B1 (fr) * | 2001-05-16 | 2003-10-10 | A S K | Procede de fabrication d'une carte a puce sans contact a l'aide de papier transfert et carte a puce obtenue a partir de ce procede |
JP2002353266A (ja) * | 2001-05-30 | 2002-12-06 | Moric Co Ltd | ワイヤボンディング方法および装置 |
FR2826154B1 (fr) * | 2001-06-14 | 2004-07-23 | A S K | Carte a puce sans contact avec un support d'antenne et un support de puce en materiau fibreux |
FR2829857B1 (fr) * | 2001-09-14 | 2004-09-17 | A S K | Carte a puce sans contact ou hybride contact-sans contact a tenue renforcee du module electronique |
DE10223800A1 (de) * | 2002-05-29 | 2003-12-18 | Continental Ag | Transponder zum Einbau in oder auf die Oberfläche von Gegenständen |
WO2004027863A2 (en) * | 2002-09-17 | 2004-04-01 | Axalto Sa | Hybrid card |
JP4141857B2 (ja) * | 2003-02-18 | 2008-08-27 | 日立マクセル株式会社 | 半導体装置 |
US20040200061A1 (en) * | 2003-04-11 | 2004-10-14 | Coleman James P. | Conductive pattern and method of making |
EP1471544B1 (de) * | 2003-04-25 | 2010-06-23 | Assa Abloy AB | Verfahren und Vorrichtung zur Herstellung eines Transponders |
DE602004016690D1 (de) * | 2004-03-25 | 2008-10-30 | Bauer Eric | Verfahren zur herstellung eines elektronischen labels |
US20060005050A1 (en) * | 2004-06-10 | 2006-01-05 | Supercom Ltd. | Tamper-free and forgery-proof passport and methods for providing same |
TWI288885B (en) * | 2004-06-24 | 2007-10-21 | Checkpoint Systems Inc | Die attach area cut-on-fly method and apparatus |
AU2005304141B2 (en) * | 2004-11-02 | 2010-08-26 | Hid Global Gmbh | Laying device, contacting device, advancing system, laying and contacting unit, production system, method for the production and a transponder unit |
FR2880160B1 (fr) * | 2004-12-28 | 2007-03-30 | K Sa As | Module electronique double face pour carte a puce hybride |
ITMO20050017A1 (it) * | 2005-01-28 | 2006-07-29 | Windinglab S R L | Apparato e metodo per realizzare un antenna per un dispositivo di identificazione a radiofrequenza. |
CN2833904Y (zh) * | 2005-07-29 | 2006-11-01 | 北京握奇数据系统有限公司 | 供插入式双界面智能卡使用的天线 |
US7598876B2 (en) * | 2006-03-21 | 2009-10-06 | Stmicroelectronics Sa | Method for manufacturing a RFID electronic tag |
US7581308B2 (en) * | 2007-01-01 | 2009-09-01 | Advanced Microelectronic And Automation Technology Ltd. | Methods of connecting an antenna to a transponder chip |
US8286332B2 (en) * | 2006-09-26 | 2012-10-16 | Hid Global Gmbh | Method and apparatus for making a radio frequency inlay |
US20080179404A1 (en) * | 2006-09-26 | 2008-07-31 | Advanced Microelectronic And Automation Technology Ltd. | Methods and apparatuses to produce inlays with transponders |
DE102007022615A1 (de) * | 2007-05-15 | 2008-11-20 | Infineon Technologies Ag | Kontaktloses Übertragungssystem und Verfahren zum Herstellen desselben |
US8062445B2 (en) * | 2007-08-06 | 2011-11-22 | Avery Dennison Corporation | Method of making RFID devices |
DE602007010634D1 (de) * | 2007-09-18 | 2010-12-30 | Baile Na Habhann Co Galway | Verfahren zur Kontaktierung eines Drahtleiters gelegt auf ein Substrat |
-
2004
- 2004-03-25 DE DE602004016690T patent/DE602004016690D1/de not_active Expired - Lifetime
- 2004-03-25 EP EP04723271A patent/EP1738303B1/de not_active Expired - Lifetime
- 2004-03-25 AT AT04723271T patent/ATE408870T1/de not_active IP Right Cessation
- 2004-03-25 US US10/594,089 patent/US7815122B2/en not_active Expired - Fee Related
- 2004-03-25 WO PCT/IB2004/000887 patent/WO2005093645A1/fr active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
EP1738303A1 (de) | 2007-01-03 |
EP1738303B1 (de) | 2008-09-17 |
ATE408870T1 (de) | 2008-10-15 |
WO2005093645A1 (fr) | 2005-10-06 |
US7815122B2 (en) | 2010-10-19 |
US20070194130A1 (en) | 2007-08-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |