FI20002543A - Menetelmä piisirulle integroidun piirin kiinnittämiseksi älytarraan ja menetelmä piikiekon esikäsittelemiseksi - Google Patents
Menetelmä piisirulle integroidun piirin kiinnittämiseksi älytarraan ja menetelmä piikiekon esikäsittelemiseksi Download PDFInfo
- Publication number
- FI20002543A FI20002543A FI20002543A FI20002543A FI20002543A FI 20002543 A FI20002543 A FI 20002543A FI 20002543 A FI20002543 A FI 20002543A FI 20002543 A FI20002543 A FI 20002543A FI 20002543 A FI20002543 A FI 20002543A
- Authority
- FI
- Finland
- Prior art keywords
- integrated circuit
- silicon
- chip
- pretreating
- attaching
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
- B32B37/20—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of continuous webs only
- B32B37/203—One or more of the layers being plastic
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/04—Punching, slitting or perforating
- B32B2038/042—Punching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2305/00—Condition, form or state of the layers or laminate
- B32B2305/34—Inserts
- B32B2305/342—Chips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2310/00—Treatment by energy or chemical effects
- B32B2310/08—Treatment by energy or chemical effects by wave energy or particle radiation
- B32B2310/0806—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation
- B32B2310/0825—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation using IR radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2519/00—Labels, badges
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/79—Apparatus for Tape Automated Bonding [TAB]
- H01L2224/7965—Means for transporting the components to be connected
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
- H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19043—Component type being a resistor
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Die Bonding (AREA)
- Adhesive Tapes (AREA)
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20002543A FI113851B (fi) | 2000-11-20 | 2000-11-20 | Menetelmä piisirulle integroidun piirin kiinnittämiseksi älytarraan ja menetelmä piikiekon esikäsittelemiseksi |
PCT/FI2001/000961 WO2002041387A1 (en) | 2000-11-20 | 2001-11-05 | A method for attaching an integrated circuit on a silicon chip to a smart label |
AU2002214066A AU2002214066A1 (en) | 2000-11-20 | 2001-11-05 | A method for attaching an integrated circuit on a silicon chip to a smart label |
EP01982504A EP1336194A1 (en) | 2000-11-20 | 2001-11-05 | A method for attaching an integrated circuit on a silicon chip to a smart label |
JP2002543690A JP2004514291A (ja) | 2000-11-20 | 2001-11-05 | シリコンチップ上の集積回路のスマートラベルへの取付け方法 |
US10/438,589 US20040005754A1 (en) | 2000-11-20 | 2003-05-15 | Method for attaching an integrated circuit on a silicon chip to a smart label |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20002543 | 2000-11-20 | ||
FI20002543A FI113851B (fi) | 2000-11-20 | 2000-11-20 | Menetelmä piisirulle integroidun piirin kiinnittämiseksi älytarraan ja menetelmä piikiekon esikäsittelemiseksi |
Publications (3)
Publication Number | Publication Date |
---|---|
FI20002543A0 FI20002543A0 (fi) | 2000-11-20 |
FI20002543A true FI20002543A (fi) | 2002-05-21 |
FI113851B FI113851B (fi) | 2004-06-30 |
Family
ID=8559534
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FI20002543A FI113851B (fi) | 2000-11-20 | 2000-11-20 | Menetelmä piisirulle integroidun piirin kiinnittämiseksi älytarraan ja menetelmä piikiekon esikäsittelemiseksi |
Country Status (6)
Country | Link |
---|---|
US (1) | US20040005754A1 (fi) |
EP (1) | EP1336194A1 (fi) |
JP (1) | JP2004514291A (fi) |
AU (1) | AU2002214066A1 (fi) |
FI (1) | FI113851B (fi) |
WO (1) | WO2002041387A1 (fi) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6951596B2 (en) * | 2002-01-18 | 2005-10-04 | Avery Dennison Corporation | RFID label technique |
ATE426215T1 (de) * | 2004-01-31 | 2009-04-15 | Atlantic Zeiser Gmbh | Verfahren zur herstellung von kontaklosen chip- karten |
JP2005306470A (ja) * | 2004-03-25 | 2005-11-04 | Tatsuo Sasazaki | シート状成形材 |
US7109867B2 (en) * | 2004-09-09 | 2006-09-19 | Avery Dennison Corporation | RFID tags with EAS deactivation ability |
US7500307B2 (en) * | 2004-09-22 | 2009-03-10 | Avery Dennison Corporation | High-speed RFID circuit placement method |
US7623034B2 (en) * | 2005-04-25 | 2009-11-24 | Avery Dennison Corporation | High-speed RFID circuit placement method and device |
US7555826B2 (en) | 2005-12-22 | 2009-07-07 | Avery Dennison Corporation | Method of manufacturing RFID devices |
FI120018B (fi) | 2006-04-28 | 2009-05-29 | Wisteq Oy | Etätunniste ja sen aihio sekä rakennustapa etätunnistimen valmistamiseksi |
US7546676B2 (en) * | 2007-05-31 | 2009-06-16 | Symbol Technologies, Inc. | Method for manufacturing micro-strip antenna element |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE792488A (fr) * | 1971-12-08 | 1973-03-30 | Dainippon Printing Co Ltd | Cartes d'identification et procede de fabrication de ces cartes |
DE3130032A1 (de) * | 1981-07-30 | 1983-02-17 | Agfa-Gevaert Ag, 5090 Leverkusen | Faelschungssicheres dokument |
US4954814A (en) * | 1986-09-29 | 1990-09-04 | Monarch Marking Systems, Inc. | Tag and method of making same |
US4846922A (en) * | 1986-09-29 | 1989-07-11 | Monarch Marking Systems, Inc. | Method of making deactivatable tags |
JP2833111B2 (ja) * | 1989-03-09 | 1998-12-09 | 日立化成工業株式会社 | 回路の接続方法及びそれに用いる接着剤フィルム |
KR0147813B1 (ko) * | 1989-05-16 | 1998-08-01 | 월터 클리웨인, 한스-피터 위트린 | 적층 구조물 및 그의 제조방법 |
JPH03239595A (ja) * | 1990-02-16 | 1991-10-25 | Dainippon Printing Co Ltd | カード製造方法 |
JPH04321190A (ja) * | 1991-04-22 | 1992-11-11 | Mitsubishi Electric Corp | 非接触型携帯記憶装置のアンテナ回路 |
JP3842362B2 (ja) * | 1996-02-28 | 2006-11-08 | 株式会社東芝 | 熱圧着方法および熱圧着装置 |
US5936847A (en) * | 1996-05-02 | 1999-08-10 | Hei, Inc. | Low profile electronic circuit modules |
US5918363A (en) * | 1996-05-20 | 1999-07-06 | Motorola, Inc. | Method for marking functional integrated circuit chips with underfill material |
JPH1084014A (ja) * | 1996-07-19 | 1998-03-31 | Shinko Electric Ind Co Ltd | 半導体装置の製造方法 |
JP3928753B2 (ja) * | 1996-08-06 | 2007-06-13 | 日立化成工業株式会社 | マルチチップ実装法、および接着剤付チップの製造方法 |
US5867102C1 (en) * | 1997-02-27 | 2002-09-10 | Wallace Comp Srvices Inc | Electronic article surveillance label assembly and method of manufacture |
US6077382A (en) * | 1997-05-09 | 2000-06-20 | Citizen Watch Co., Ltd | Mounting method of semiconductor chip |
CA2301640C (en) * | 1997-09-11 | 2005-05-03 | Precision Dynamics Corporation | Laminated radio frequency identification device |
US5982284A (en) * | 1997-09-19 | 1999-11-09 | Avery Dennison Corporation | Tag or label with laminated thin, flat, flexible device |
US6040630A (en) * | 1998-04-13 | 2000-03-21 | Harris Corporation | Integrated circuit package for flip chip with alignment preform feature and method of forming same |
EP1014302B1 (en) * | 1998-07-08 | 2005-09-21 | Dai Nippon Printing Co., Ltd. | Noncontact ic card and manufacture thereof |
JP2000113147A (ja) * | 1998-10-08 | 2000-04-21 | Hitachi Chem Co Ltd | Icカードとその製造法 |
-
2000
- 2000-11-20 FI FI20002543A patent/FI113851B/fi active
-
2001
- 2001-11-05 EP EP01982504A patent/EP1336194A1/en not_active Withdrawn
- 2001-11-05 AU AU2002214066A patent/AU2002214066A1/en not_active Abandoned
- 2001-11-05 WO PCT/FI2001/000961 patent/WO2002041387A1/en not_active Application Discontinuation
- 2001-11-05 JP JP2002543690A patent/JP2004514291A/ja not_active Abandoned
-
2003
- 2003-05-15 US US10/438,589 patent/US20040005754A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
AU2002214066A1 (en) | 2002-05-27 |
JP2004514291A (ja) | 2004-05-13 |
US20040005754A1 (en) | 2004-01-08 |
FI113851B (fi) | 2004-06-30 |
WO2002041387A1 (en) | 2002-05-23 |
EP1336194A1 (en) | 2003-08-20 |
FI20002543A0 (fi) | 2000-11-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Transfer of assignment of patent |
Owner name: UPM RAFLATAC OY Free format text: UPM RAFLATAC OY |
|
PC | Transfer of assignment of patent |
Owner name: SMARTRAC IP B.V. |
|
PC | Transfer of assignment of patent |
Owner name: SMARTRAC INVESTMENT B.V. |