UA54374C2 - Спосіб виготовлення модуля мікросхемної карти для безконтактних мікросхемних карт - Google Patents

Спосіб виготовлення модуля мікросхемної карти для безконтактних мікросхемних карт Download PDF

Info

Publication number
UA54374C2
UA54374C2 UA97030971A UA97030971A UA54374C2 UA 54374 C2 UA54374 C2 UA 54374C2 UA 97030971 A UA97030971 A UA 97030971A UA 97030971 A UA97030971 A UA 97030971A UA 54374 C2 UA54374 C2 UA 54374C2
Authority
UA
Ukraine
Prior art keywords
wire
microcircuit
carrier
manufacture
card module
Prior art date
Application number
UA97030971A
Other languages
English (en)
Russian (ru)
Inventor
Йозеф Мундігл
Йозеф Мундигл
Детлеф Удо
Original Assignee
Сіменс Акцієнгезельшафт
Сименс Акциенгезельшафт
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=6527470&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=UA54374(C2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Сіменс Акцієнгезельшафт, Сименс Акциенгезельшафт filed Critical Сіменс Акцієнгезельшафт
Publication of UA54374C2 publication Critical patent/UA54374C2/uk

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745Mounting details of integrated circuit chips
    • G06K19/07747Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773Antenna details
    • G06K19/07777Antenna details the antenna being of the inductive type
    • G06K19/07779Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773Antenna details
    • G06K19/07777Antenna details the antenna being of the inductive type
    • G06K19/07779Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07781Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being fabricated in a winding process
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773Antenna details
    • G06K19/07777Antenna details the antenna being of the inductive type
    • G06K19/07779Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07783Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001Core members of the connector
    • H01L2224/45099Material
    • H01L2224/451Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124Aluminium (Al) as principal constituent
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/4813Connecting within a semiconductor or solid-state body, i.e. fly wire, bridge wire
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484Connecting portions
    • H01L2224/4847Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/485Material
    • H01L2224/48505Material at the bonding interface
    • H01L2224/48699Principal constituent of the connecting portion of the wire connector being Aluminium (Al)
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00011Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00014Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01005Boron [B]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01013Aluminum [Al]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01029Copper [Cu]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01047Silver [Ag]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/0105Tin [Sn]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01068Erbium [Er]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01078Platinum [Pt]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01079Gold [Au]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01082Lead [Pb]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013Alloys
    • H01L2924/014Solder alloys
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/12Passive devices, e.g. 2 terminal devices
    • H01L2924/1204Optical Diode
    • H01L2924/12042LASER
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49016Antenna or wave energy "plumbing" making
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49121Beam lead frame or beam lead device

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Power Engineering (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

Згідно з винаходом пропонується спосіб виготовлення модуля інтелектуальної картки з котушкою індуктивності, яка розташована на підкладці модуля і виводи якої з'єднані з виводами мікросхеми, також розташованої на підкладці модуля, який полягає в тому, що при виготовленні модуля використовують термокомпресійне зварювання.

Description

Опис винаходу
В случае бесконтактньїх или несоприкасающихся микросхемньїх карт необходимая для работь! находящейся 2 в ней полупроводниковой микросхемь! знергия подводится, по меньшей мере, через одну антенную катушку, причем по большей части вьібирают трансформаторную передачу. Также и передача данньїх происходит через зту катушку.
При зтом обьічньїми являются как печатнье, вьітравленнье или гальванически нарощеннье катушки в виде полОосКовЬІх линий, так и намотаннье катушки из змалированной проволоки, причем в качестве основного 70 материала для таких катушек из змалированной проволоки используют медь.
Для соединения катушки с полупроводниковой микросхемой вначале снимают изоляцию с вьіводов катушки, например, путем нагрева, обработки щетками, химической обработкой или лужения и затем контактируют путем, например, лазерной пайки, сварки по зазору, ультразвуковой сварки, соединения накруткой или приклеивания серебрянозмалевьм клеем. Для изготовления такого соединения необходимо соответственно 72 множество рабочих операций или соответственно монтажньх шагов, которне требуют также множества машин для их вбіполнения.
Из ОЕ 37 21 822 С1 известно соединение антенной катушки с полупроводниковой микросхемой через термокомпрессионнье соединения (Вопамегріпдипдеп). Таким образом там вначале должна наматьваться катушка, концьі которой затем в ходе дальнейшей рабочей операции соединяют с полупроводниковой микросхемой через термокомпрессионнье соєдинения.
Задачей изобретения является позтому создание способа изготовления модуля микросхемной карть! для бесконтактной микросхемной карть, которьйй является простьім, зкономичнь!м с точки зрения расходов и легко автоматизируемь!м.
Зта задача решается способом согласно пункта 1 формуль! изобретения. Предпочтительная форма с 22 дальнейшего развития изобретения указана в зависимом пункте формуль! изобретения. Го)
В соответствующем изобретению способе вьіводьії катушки оприкрепляют Кк контактньм полям полупроводниковой микросхемь! непосредственно. При зтом узел термокомпрессионной сварки (Вопаег) встроен непосредственно в головку направления проволоки намоточного автомата, так что все монтажнье шаги могут вьіполняться одной машиной. Особенно предпочтительньм образом для катушки используют М алюминиевую проволоку. Она является в два раза легче меди и имеет также наполовину меньший модуль ча упругости так, что готовая карта имеет меньшую жесткость. Зтот вид толстопроволочного термокомпрессионного соединения известен, например, из техники сильноточной злектроники и хорошо освоен о так, что достигается вьісокий вьіход годньїх изделий. «І
В предпочтительной форме дальнейшего развития изобретения полупроводниковая микросхема удерживаєтся в свободно подвешенном состояний в вьіємке носителя только за счет термокомпрессионньх о контактов так, что она хорошо защищена от разламьвания при изгибной нагрузке микросхемной карти.
Изобретение описьівается ниже более подробно на примере вьіполнения с помощью одной фигурь!і. Фигура показьивает при зтом возможную форму вьіполнения соответствующего изобретению модуля микросхемной « карти. З 70 Плоский носитель 1 из гибкого, непроводящего материала имеет вьемку 2. В ней установлена с полупроводниковая микросхема 3. Полупроводниковая микросхема 3 имеет две контактньхх площадки 4, з» которье увеличеньї по сравнению с обьічньми контактньми площадками кристалла за счет, например, золотой прокладки. На контактньїх площадках 4 закрепленьі путем термокомпрессионной сварки вьіводьі б антенной катушки 5. При зтом проволоку, которая предпочтительньм образом вьіполнена из алюминия, вначале прикрепляют к одной из контактньїх площадок 4, затем посредством направляющей головки намоточного і-й автомата, в которую встроен узел термокомпрессионной сварки (Вопаег), наматьшвают катушку из нескольких «їз» витков (на фигуре представлень! только два витка, однако их может бьїіть много) и наконец снова прикрепляют к другой контактной площадке. После зтого полупроводниковую микросхему З с прикрепленной к ней о соответствующим изобретению образом катушкой 5 устанавливают в вьемке носителя 1 так, что катушка 5 -І 20 расположена на носителе 1. Носитель 1 может при зтом иметь длину и ширину готовой микросхемной карть! так, что микросхемная карта может бьть завершена путем нанесения соответствующих покрьтий носителя.
Т» Носитель 1 может однако также иметь и меньшие размерь, чем микросхемная карта так, что он может использоваться в качестве вставки (Іпіеє) в имеющей форму рамки средней части микросхемной карти. о

Claims (2)

  1. Формула винаходу о 1. Способ изготовления модуля микросхемной картьї, отличающийся тем, что присоединяют конец тонкой проволоки к первой контактной площадке полупроводниковой микросхемьі, укладьнвают проволоку посредством 60 термокомпрессионной сварочной головки в несколько витков, присоединяют проволоку ко второй контактной площадке полупроводниковой микросхемь, образующие антенную катушку витки проволоки (и полупроводниковую микросхему устанавливают на носителе.
  2. 2. Способ по пункту 1, отличающийся тем, что образующие антенную катушку витки проволоки располагают на носителе так, что полупроводниковая микросхема удерживаєтся в вьемке носителя в подвешенном бо состояниий термокомпрессионньіми соединениями концов проволоки.
UA97030971A 1994-09-05 1995-05-09 Спосіб виготовлення модуля мікросхемної карти для безконтактних мікросхемних карт UA54374C2 (uk)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE4431605A DE4431605C2 (de) 1994-09-05 1994-09-05 Verfahren zur Herstellung eines Chipkartenmoduls für kontaktlose Chipkarten
PCT/DE1995/001201 WO1996007984A1 (de) 1994-09-05 1995-09-05 Verfahren zur herstellung eines chipkartenmoduls für kontaktlose chipkarten

Publications (1)

Publication Number Publication Date
UA54374C2 true UA54374C2 (uk) 2003-03-17

Family

ID=6527470

Family Applications (1)

Application Number Title Priority Date Filing Date
UA97030971A UA54374C2 (uk) 1994-09-05 1995-05-09 Спосіб виготовлення модуля мікросхемної карти для безконтактних мікросхемних карт

Country Status (12)

Country Link
US (1) US5809633A (uk)
EP (1) EP0780006B1 (uk)
JP (1) JPH10505023A (uk)
KR (1) KR100358785B1 (uk)
CN (1) CN1105988C (uk)
AT (1) ATE173553T1 (uk)
DE (2) DE4431605C2 (uk)
ES (1) ES2125650T3 (uk)
FI (1) FI970924A0 (uk)
RU (1) RU2155379C2 (uk)
UA (1) UA54374C2 (uk)
WO (1) WO1996007984A1 (uk)

Families Citing this family (142)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7158031B2 (en) 1992-08-12 2007-01-02 Micron Technology, Inc. Thin, flexible, RFID label and system for use
DE4437721A1 (de) * 1994-10-21 1996-04-25 Giesecke & Devrient Gmbh Kontaktloses elektronisches Modul
AT1470U1 (de) * 1995-08-01 1997-05-26 Austria Card Laminierte karte und verfahren zu ihrer herstellung
US6036099A (en) * 1995-10-17 2000-03-14 Leighton; Keith Hot lamination process for the manufacture of a combination contact/contactless smart card and product resulting therefrom
US5817207A (en) 1995-10-17 1998-10-06 Leighton; Keith R. Radio frequency identification card and hot lamination process for the manufacture of radio frequency identification cards
US6441736B1 (en) 1999-07-01 2002-08-27 Keith R. Leighton Ultra-thin flexible durable radio frequency identification devices and hot or cold lamination process for the manufacture of ultra-thin flexible durable radio frequency identification devices
JP3721520B2 (ja) * 1996-02-12 2005-11-30 フィン,ダーヴィト ワイヤ導体を接触させるための方法
FR2747812B1 (fr) * 1996-04-23 1998-05-22 Solaic Sa Carte a circuit integre sans contact avec antenne en polymere conducteur
DE19616424A1 (de) * 1996-04-25 1997-10-30 Manfred Dr Michalk Elektrisch isolierendes Material mit einem elektronischen Modul
DE19627827A1 (de) * 1996-07-10 1998-01-22 Siemens Ag Chipkarte und Verfahren zu ihrer Herstellung
DE19634473C2 (de) * 1996-07-11 2003-06-26 David Finn Verfahren zur Herstellung einer Chipkarte
DE69617753T2 (de) * 1996-07-18 2002-08-08 Nagraid Sa Verfahren zur herstellung von gedruckten schaltungen sowie nach diesem verfahren hergestellte gedruckte schaltung
DE19647845C2 (de) * 1996-11-19 2002-01-10 Pav Card Gmbh Verfahren zum Herstellen einer Chipkarte
FR2756648B1 (fr) * 1996-11-29 1999-01-08 Solaic Sa Carte a memoire du type sans contact
DE19701167A1 (de) 1997-01-15 1998-07-23 Siemens Ag Chipkarte
US6329213B1 (en) 1997-05-01 2001-12-11 Micron Technology, Inc. Methods for forming integrated circuits within substrates
DE19728512A1 (de) * 1997-07-04 1999-01-07 Aeg Identifikationssys Gmbh Transponderanordnung und Verfahren zu deren Herstellung
DE19731969A1 (de) * 1997-07-24 1998-08-27 Siemens Ag Verfahren zum Herstellen eines elektrischen Bauteils
US6339385B1 (en) 1997-08-20 2002-01-15 Micron Technology, Inc. Electronic communication devices, methods of forming electrical communication devices, and communication methods
FR2769109B1 (fr) * 1997-09-26 1999-11-19 Gemplus Sca Dispositif electronique a puce jetable et procede de fabrication
FR2769390B1 (fr) * 1997-10-08 2003-02-14 Gemplus Card Int Procede de fabrication de cartes a puce aptes a assurer un fonctionnement a contact et sans contact, et de cartes a puce sans contact
US20110043430A1 (en) * 1997-10-16 2011-02-24 Oded Bashan Manufacture of a smart card
US6651891B1 (en) * 1997-11-04 2003-11-25 Elke Zakel Method for producing contactless chip cards and corresponding contactless chip card
FR2774617B1 (fr) * 1998-02-06 2000-05-05 St Microelectronics Sa Procede et machine d'usinage d'une cavite dans une carte a puce electronique renfermant une antenne
FR2778475B1 (fr) 1998-05-11 2001-11-23 Schlumberger Systems & Service Carte a memoire du type sans contact, et procede de fabrication d'une telle carte
DE19844089C2 (de) * 1998-06-25 2001-04-05 Pav Card Gmbh Verfahren zur Herstellung von Transponderanordnungen
EP0967570B1 (de) * 1998-06-25 2006-09-06 PAV Card GmbH Verfahren zur Herstellung von Transponderchips
FR2781298B1 (fr) * 1998-07-20 2003-01-31 St Microelectronics Sa Procede de fabrication d'une carte a puce electronique et carte a puce electronique
WO2000030210A1 (en) * 1998-11-12 2000-05-25 Motorola Inc. Smartcard module and method of attaching antenna wires thereto
US6205646B1 (en) * 1998-12-21 2001-03-27 Philips Electronics North America Corp. Method for air-wound coil vacuum pick-up, surface mounting, and adjusting
JP3335938B2 (ja) * 1999-03-01 2002-10-21 新光電気工業株式会社 Icカード用アンテナフレーム及びicカードの製造方法
JP3517374B2 (ja) * 1999-05-21 2004-04-12 新光電気工業株式会社 非接触型icカードの製造方法
US7306158B2 (en) * 2001-07-10 2007-12-11 American Express Travel Related Services Company, Inc. Clear contactless card
US7889052B2 (en) 2001-07-10 2011-02-15 Xatra Fund Mx, Llc Authorizing payment subsequent to RF transactions
US7239226B2 (en) 2001-07-10 2007-07-03 American Express Travel Related Services Company, Inc. System and method for payment using radio frequency identification in contact and contactless transactions
US7837116B2 (en) 1999-09-07 2010-11-23 American Express Travel Related Services Company, Inc. Transaction card
DE19958328A1 (de) 1999-10-08 2001-07-12 Flexchip Ag Verfahren zum Herstellen einer elektrischen Verbindung zwischen Chip-Kontaktelemente-Einheiten und externen Kontaktanschlüssen
DE19948555A1 (de) * 1999-12-03 2001-05-03 Andreas Plettner Verfahren zur Herstellung kontaktloser Chipkarten sowie zur Herstellung von elektrischen Einheiten, bestehend aus Chips mit Kontaktelementen
FR2801122B1 (fr) * 1999-11-16 2004-02-20 Schlumberger Systems & Service Carte a memoire du type sans contact et procedes de fabrication d'une telle carte
US8543423B2 (en) 2002-07-16 2013-09-24 American Express Travel Related Services Company, Inc. Method and apparatus for enrolling with multiple transaction environments
US8429041B2 (en) 2003-05-09 2013-04-23 American Express Travel Related Services Company, Inc. Systems and methods for managing account information lifecycles
US7172112B2 (en) 2000-01-21 2007-02-06 American Express Travel Related Services Company, Inc. Public/private dual card system and method
JP3680676B2 (ja) * 2000-02-03 2005-08-10 松下電器産業株式会社 非接触データキャリア
US7627531B2 (en) 2000-03-07 2009-12-01 American Express Travel Related Services Company, Inc. System for facilitating a transaction
DE10014620A1 (de) * 2000-03-24 2001-09-27 Andreas Plettner Verfahren zur Herstellung eines Trägerbandes mit einer Vielzahl von elektrischen Einheiten, jeweils aufweisend einen Chip und Kontaktelemente
AU2001256602A1 (en) * 2000-05-02 2001-11-12 Supercom Ltd. Upgrading conventional documents to smart documents
EP1176548A3 (en) * 2000-07-28 2003-03-05 Oji Paper Co., Ltd. IC package and method of fabricating the same
US6588660B1 (en) 2000-09-29 2003-07-08 Hewlett-Packard Development Company, L.P. Passive contactless smartcard security system
US6923378B2 (en) 2000-12-22 2005-08-02 Digimarc Id Systems Identification card
GB2371264A (en) * 2001-01-18 2002-07-24 Pioneer Oriental Engineering L Smart card with embedded antenna
JP2002319011A (ja) * 2001-01-31 2002-10-31 Canon Inc 半導体装置、半導体装置の製造方法及び電子写真装置
US7452656B2 (en) 2001-03-26 2008-11-18 Ertek Inc. Electrically conductive patterns, antennas and methods of manufacture
US7564409B2 (en) * 2001-03-26 2009-07-21 Ertek Inc. Antennas and electrical connections of electrical devices
US6582887B2 (en) * 2001-03-26 2003-06-24 Daniel Luch Electrically conductive patterns, antennas and methods of manufacture
US7394425B2 (en) * 2001-03-26 2008-07-01 Daniel Luch Electrically conductive patterns, antennas and methods of manufacture
US7725427B2 (en) 2001-05-25 2010-05-25 Fred Bishop Recurrent billing maintenance with radio frequency payment devices
US7650314B1 (en) 2001-05-25 2010-01-19 American Express Travel Related Services Company, Inc. System and method for securing a recurrent billing transaction
US7303120B2 (en) 2001-07-10 2007-12-04 American Express Travel Related Services Company, Inc. System for biometric security using a FOB
US7668750B2 (en) 2001-07-10 2010-02-23 David S Bonalle Securing RF transactions using a transactions counter
US9024719B1 (en) 2001-07-10 2015-05-05 Xatra Fund Mx, Llc RF transaction system and method for storing user personal data
US7805378B2 (en) 2001-07-10 2010-09-28 American Express Travel Related Servicex Company, Inc. System and method for encoding information in magnetic stripe format for use in radio frequency identification transactions
US8538863B1 (en) 2001-07-10 2013-09-17 American Express Travel Related Services Company, Inc. System and method for facilitating a transaction using a revolving use account associated with a primary account
US8635131B1 (en) 2001-07-10 2014-01-21 American Express Travel Related Services Company, Inc. System and method for managing a transaction protocol
US7746215B1 (en) 2001-07-10 2010-06-29 Fred Bishop RF transactions using a wireless reader grid
US7360689B2 (en) 2001-07-10 2008-04-22 American Express Travel Related Services Company, Inc. Method and system for proffering multiple biometrics for use with a FOB
US7705732B2 (en) 2001-07-10 2010-04-27 Fred Bishop Authenticating an RF transaction using a transaction counter
US8960535B2 (en) 2001-07-10 2015-02-24 Iii Holdings 1, Llc Method and system for resource management and evaluation
US7827106B2 (en) 2001-07-10 2010-11-02 American Express Travel Related Services Company, Inc. System and method for manufacturing a punch-out RFID transaction device
US7249112B2 (en) 2002-07-09 2007-07-24 American Express Travel Related Services Company, Inc. System and method for assigning a funding source for a radio frequency identification device
US7996324B2 (en) 2001-07-10 2011-08-09 American Express Travel Related Services Company, Inc. Systems and methods for managing multiple accounts on a RF transaction device using secondary identification indicia
US8548927B2 (en) 2001-07-10 2013-10-01 Xatra Fund Mx, Llc Biometric registration for facilitating an RF transaction
US8284025B2 (en) 2001-07-10 2012-10-09 Xatra Fund Mx, Llc Method and system for auditory recognition biometrics on a FOB
US9454752B2 (en) 2001-07-10 2016-09-27 Chartoleaux Kg Limited Liability Company Reload protocol at a transaction processing entity
US9031880B2 (en) 2001-07-10 2015-05-12 Iii Holdings 1, Llc Systems and methods for non-traditional payment using biometric data
US7925535B2 (en) 2001-07-10 2011-04-12 American Express Travel Related Services Company, Inc. System and method for securing RF transactions using a radio frequency identification device including a random number generator
US8294552B2 (en) 2001-07-10 2012-10-23 Xatra Fund Mx, Llc Facial scan biometrics on a payment device
US7503480B2 (en) * 2001-07-10 2009-03-17 American Express Travel Related Services Company, Inc. Method and system for tracking user performance
US7119659B2 (en) 2001-07-10 2006-10-10 American Express Travel Related Services Company, Inc. Systems and methods for providing a RF transaction device for use in a private label transaction
US20040236699A1 (en) 2001-07-10 2004-11-25 American Express Travel Related Services Company, Inc. Method and system for hand geometry recognition biometrics on a fob
US7493288B2 (en) 2001-07-10 2009-02-17 Xatra Fund Mx, Llc RF payment via a mobile device
US8001054B1 (en) 2001-07-10 2011-08-16 American Express Travel Related Services Company, Inc. System and method for generating an unpredictable number using a seeded algorithm
US7762457B2 (en) 2001-07-10 2010-07-27 American Express Travel Related Services Company, Inc. System and method for dynamic fob synchronization and personalization
EP1302894A3 (de) * 2001-10-12 2003-10-29 Multitape GmbH Kontaktlose Chipkarte und Herstellungsverfahren
US20030085288A1 (en) * 2001-11-06 2003-05-08 Luu Deniel V.H. Contactless SIM card carrier with detachable antenna and carrier therefore
ATE509326T1 (de) 2001-12-18 2011-05-15 L 1 Secure Credentialing Inc Mehrfachbildsicherheitsmerkmale zur identifikation von dokumenten und verfahren zu ihrer herstellung
US7694887B2 (en) 2001-12-24 2010-04-13 L-1 Secure Credentialing, Inc. Optically variable personalized indicia for identification documents
WO2003055638A1 (en) 2001-12-24 2003-07-10 Digimarc Id Systems, Llc Laser etched security features for identification documents and methods of making same
US7815124B2 (en) 2002-04-09 2010-10-19 L-1 Secure Credentialing, Inc. Image processing techniques for printing identification cards and documents
ATE552120T1 (de) 2001-12-24 2012-04-15 L 1 Secure Credentialing Inc Verdeckte variableninformationen auf id- dokumenten und verfahren zu ihrer herstellung
US7728048B2 (en) 2002-12-20 2010-06-01 L-1 Secure Credentialing, Inc. Increasing thermal conductivity of host polymer used with laser engraving methods and compositions
EP1459246B1 (en) 2001-12-24 2012-05-02 L-1 Secure Credentialing, Inc. Method for full color laser marking of id documents
US6962439B2 (en) * 2002-03-08 2005-11-08 The Bagco, Inc. Leak resistant tamper evident reclosable plastic bag
US7824029B2 (en) 2002-05-10 2010-11-02 L-1 Secure Credentialing, Inc. Identification card printer-assembler for over the counter card issuing
JP4058300B2 (ja) * 2002-06-21 2008-03-05 株式会社日立製作所 携帯情報装置
US6805287B2 (en) 2002-09-12 2004-10-19 American Express Travel Related Services Company, Inc. System and method for converting a stored value card to a credit card
AU2003298731A1 (en) 2002-11-26 2004-06-18 Digimarc Id Systems Systems and methods for managing and detecting fraud in image databases used with identification documents
US7712673B2 (en) 2002-12-18 2010-05-11 L-L Secure Credentialing, Inc. Identification document with three dimensional image of bearer
WO2004095348A2 (en) 2003-04-16 2004-11-04 Digimarc Corporation Three dimensional data storage
JP2005093867A (ja) * 2003-09-19 2005-04-07 Seiko Epson Corp 半導体装置及びその製造方法
DE202004003554U1 (de) * 2004-03-04 2004-06-03 Novacard Informationssysteme Gmbh Chipkarte
DE602004016690D1 (de) * 2004-03-25 2008-10-30 Bauer Eric Verfahren zur herstellung eines elektronischen labels
US7318550B2 (en) 2004-07-01 2008-01-15 American Express Travel Related Services Company, Inc. Biometric safeguard method for use with a smartcard
FR2876507B1 (fr) * 2004-10-12 2006-12-01 K Sa As Etiquette sans contact a antenne en y omnidirectionnelle
AU2005304141B2 (en) * 2004-11-02 2010-08-26 Hid Global Gmbh Laying device, contacting device, advancing system, laying and contacting unit, production system, method for the production and a transponder unit
US20060180674A1 (en) * 2005-02-14 2006-08-17 Aladdin Knowledge Systems Ltd. Security card apparatus
JP2006271596A (ja) * 2005-03-29 2006-10-12 Aruze Corp ゲーム用カード
EP1720120A1 (en) * 2005-05-04 2006-11-08 Axalto S.A. A method for manufacturing a smart card, a thus manufactured smart card, and a method for manufacturing a wired antenna
US8240022B2 (en) * 2006-09-26 2012-08-14 Feinics Amatech Teorowita Methods of connecting an antenna to a transponder chip
US7546671B2 (en) * 2006-09-26 2009-06-16 Micromechanic And Automation Technology Ltd. Method of forming an inlay substrate having an antenna wire
US8286332B2 (en) 2006-09-26 2012-10-16 Hid Global Gmbh Method and apparatus for making a radio frequency inlay
US20080179404A1 (en) * 2006-09-26 2008-07-31 Advanced Microelectronic And Automation Technology Ltd. Methods and apparatuses to produce inlays with transponders
US8608080B2 (en) * 2006-09-26 2013-12-17 Feinics Amatech Teoranta Inlays for security documents
US7971339B2 (en) * 2006-09-26 2011-07-05 Hid Global Gmbh Method and apparatus for making a radio frequency inlay
US7979975B2 (en) * 2007-04-10 2011-07-19 Feinics Amatech Teavanta Methods of connecting an antenna to a transponder chip
US8322624B2 (en) * 2007-04-10 2012-12-04 Feinics Amatech Teoranta Smart card with switchable matching antenna
US7581308B2 (en) 2007-01-01 2009-09-01 Advanced Microelectronic And Automation Technology Ltd. Methods of connecting an antenna to a transponder chip
JP2008246104A (ja) * 2007-03-30 2008-10-16 Angel Shoji Kk Rfidを内蔵したゲームカードおよびその製造方法
HK1109708A2 (en) 2007-04-24 2008-06-13 On Track Innovations Ltd Interface card and apparatus and process for the formation thereof
US7980477B2 (en) * 2007-05-17 2011-07-19 Féinics Amatech Teoranta Dual interface inlays
IL184260A0 (en) * 2007-06-27 2008-03-20 On Track Innovations Ltd Mobile telecommunications device having sim/antenna coil interface
DE602007010634D1 (de) 2007-09-18 2010-12-30 Baile Na Habhann Co Galway Verfahren zur Kontaktierung eines Drahtleiters gelegt auf ein Substrat
US20090123743A1 (en) * 2007-11-14 2009-05-14 Guy Shafran Method of manufacture of wire imbedded inlay
US8028923B2 (en) * 2007-11-14 2011-10-04 Smartrac Ip B.V. Electronic inlay structure and method of manufacture thereof
EP2235667B1 (en) * 2008-01-23 2012-10-10 Smartrac IP B.V. Manufacture of a smart card
US20100090008A1 (en) * 2008-10-13 2010-04-15 Oded Bashan Authentication seal
US8613132B2 (en) 2009-11-09 2013-12-24 Feinics Amatech Teoranta Transferring an antenna to an RFID inlay substrate
WO2011138109A1 (en) 2010-05-04 2011-11-10 Féinics Amatech Teoranta Manufacturing rfid inlays
US8195236B2 (en) 2010-06-16 2012-06-05 On Track Innovations Ltd. Retrofit contactless smart SIM functionality in mobile communicators
US8789762B2 (en) 2010-08-12 2014-07-29 Feinics Amatech Teoranta RFID antenna modules and methods of making
US8991712B2 (en) 2010-08-12 2015-03-31 Féinics Amatech Teoranta Coupling in and to RFID smart cards
CN101976368A (zh) * 2010-09-21 2011-02-16 深圳市卡的智能科技有限公司 Ic卡的制作方法
US8424757B2 (en) 2010-12-06 2013-04-23 On Track Innovations Ltd. Contactless smart SIM functionality retrofit for mobile communication device
DE102011016159B3 (de) * 2011-04-05 2012-10-18 Micronas Gmbh Anordnung aus einem integrierten passiven Bauelement und einem auf einem Metallträger angeordneten Halbleiterkörper
EP2718876A1 (en) 2011-06-04 2014-04-16 Féinics AmaTech Teoranta Preparing a substrate for embedding wire
DE102011114635A1 (de) * 2011-10-04 2013-04-04 Smartrac Ip B.V. Chipkarte und Verfahren zur Herstellung einer Chipkarte
CN103577869A (zh) * 2012-08-01 2014-02-12 东莞市锐祥智能卡科技有限公司 卡片绕线方法
JP6091849B2 (ja) * 2012-11-08 2017-03-08 株式会社トッパンTdkレーベル 非接触通信媒体の製造方法、非接触通信媒体、及びアンテナと回路装置の接続方法
US9748035B2 (en) 2013-09-10 2017-08-29 The Charles Stark Draper Laboratory, Inc. Methods for forming chip-scale electrical components
KR101516005B1 (ko) * 2014-09-19 2015-05-07 주식회사 모비너스 와이어를 이용한 nfc안테나
FR3073307B1 (fr) * 2017-11-08 2021-05-28 Oberthur Technologies Dispositif de securite tel qu'une carte a puce
CN109214494B (zh) * 2018-10-25 2021-07-09 上海东方磁卡信息股份有限公司 非接触智能卡及其制造方法
CN109786305B (zh) * 2019-01-28 2021-02-26 上海东方磁卡信息股份有限公司 非接触卡制造设备及非接触卡制造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3143915A1 (de) * 1981-11-05 1983-05-11 Brown, Boveri & Cie Ag, 6800 Mannheim Identitaetskarte
FR2579799B1 (fr) * 1985-03-28 1990-06-22 Flonic Sa Procede de fabrication de cartes a memoire electronique et cartes obtenues suivant ledit procede
US4857893A (en) * 1986-07-18 1989-08-15 Bi Inc. Single chip transponder device
DE3721822C1 (en) * 1987-07-02 1988-11-10 Philips Patentverwaltung Chip card
DE4019915A1 (de) * 1990-06-22 1992-01-02 Bosch Gmbh Robert Verfahren und einrichtung zur herstellung einer verbindung zwischen einem bonddraht und einer metallischen kontaktflaeche
DE4034225C2 (de) * 1990-10-26 1994-01-27 Reinhard Jurisch Datenträger für Identifikationssysteme
WO1993009551A1 (de) * 1991-11-08 1993-05-13 Herbert Stowasser Transponder sowie verfahren und vorrichtung zur herstellung
FI89752C (fi) * 1992-04-01 1993-11-10 Picopak Oy Foerfarande foer anslutning av en mikrokrets till en induktiv spole i ett smartkort samt anordning vid ett induktivt smartkort

Also Published As

Publication number Publication date
DE4431605A1 (de) 1996-03-07
ATE173553T1 (de) 1998-12-15
FI970924A (fi) 1997-03-04
ES2125650T3 (es) 1999-03-01
WO1996007984A1 (de) 1996-03-14
FI970924A0 (fi) 1997-03-04
CN1105988C (zh) 2003-04-16
US5809633A (en) 1998-09-22
DE4431605C2 (de) 1998-06-04
KR100358785B1 (ko) 2003-04-21
KR970705803A (ko) 1997-10-09
EP0780006A1 (de) 1997-06-25
CN1160447A (zh) 1997-09-24
EP0780006B1 (de) 1998-11-18
JPH10505023A (ja) 1998-05-19
DE59504285D1 (de) 1998-12-24
RU2155379C2 (ru) 2000-08-27

Similar Documents

Publication Publication Date Title
UA54374C2 (uk) Спосіб виготовлення модуля мікросхемної карти для безконтактних мікросхемних карт
US7971339B2 (en) Method and apparatus for making a radio frequency inlay
RU97105182A (ru) Способ изготовления модуля микросхемной карты для бесконтактных микросхемных карт
KR100553412B1 (ko) 트랜스폰더를 제조하기 위해 캐리어 테이프 상에 배치된안테나에 마이크로칩을 접속하는 방법
CA2273949C (en) Card mounted with circuit chip and circuit chip module
RU2161331C2 (ru) Способ изготовления модуля карточки с микросхемой, модуль карточки с микросхемой, изготовленный этим способом, и универсальная карточка с микросхемой, содержащая этот модуль
AU2007349611C1 (en) Method of connecting an antenna to a transponder chip and corresponding inlay substrate
US20070132594A1 (en) Electronic device and fabrication method thereof
US8286332B2 (en) Method and apparatus for making a radio frequency inlay
KR100192728B1 (ko) 무선 주파수 태그 제조 방법
JP5167264B2 (ja) 無線周波数インレイを作製する方法および装置
US6006981A (en) Wirefilm bonding for electronic component interconnection
AU2007358536B2 (en) Method of connecting an antenna to a transponder chip and corresponding inlay substrate
CN111191762B (zh) 一种提高餐盘rfid电子标签性能的方法
JP2003132325A (ja) コイルアンテナ、コイルアンテナの製造方法、及びコイルアンテナを用いた電子タグの製造方法、ならびにコイルアンテナの製造装置
SG174832A1 (en) Method and apparatus for making a radio frequency inlay
KR970030708A (ko) 인-라인이 가능한 탭 공정을 이용한 반도체 칩 패키지 제조 방법 및 장치