JPH10261646A5 - - Google Patents

Info

Publication number
JPH10261646A5
JPH10261646A5 JP1997066789A JP6678997A JPH10261646A5 JP H10261646 A5 JPH10261646 A5 JP H10261646A5 JP 1997066789 A JP1997066789 A JP 1997066789A JP 6678997 A JP6678997 A JP 6678997A JP H10261646 A5 JPH10261646 A5 JP H10261646A5
Authority
JP
Japan
Prior art keywords
insulating film
wiring
spacer
insulating
spacer region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1997066789A
Other languages
English (en)
Japanese (ja)
Other versions
JPH10261646A (ja
JP4010425B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP06678997A priority Critical patent/JP4010425B2/ja
Priority claimed from JP06678997A external-priority patent/JP4010425B2/ja
Publication of JPH10261646A publication Critical patent/JPH10261646A/ja
Publication of JPH10261646A5 publication Critical patent/JPH10261646A5/ja
Application granted granted Critical
Publication of JP4010425B2 publication Critical patent/JP4010425B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP06678997A 1997-03-19 1997-03-19 半導体装置及びその製造方法 Expired - Lifetime JP4010425B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP06678997A JP4010425B2 (ja) 1997-03-19 1997-03-19 半導体装置及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP06678997A JP4010425B2 (ja) 1997-03-19 1997-03-19 半導体装置及びその製造方法

Publications (3)

Publication Number Publication Date
JPH10261646A JPH10261646A (ja) 1998-09-29
JPH10261646A5 true JPH10261646A5 (enExample) 2004-12-02
JP4010425B2 JP4010425B2 (ja) 2007-11-21

Family

ID=13325986

Family Applications (1)

Application Number Title Priority Date Filing Date
JP06678997A Expired - Lifetime JP4010425B2 (ja) 1997-03-19 1997-03-19 半導体装置及びその製造方法

Country Status (1)

Country Link
JP (1) JP4010425B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001044294A (ja) * 1999-08-02 2001-02-16 Mitsubishi Electric Corp 半導体装置およびその製造方法
JP2001332633A (ja) * 2000-05-24 2001-11-30 Sony Corp 半導体メモリ
JP4530552B2 (ja) * 2001-01-29 2010-08-25 富士通セミコンダクター株式会社 半導体装置及びその製造方法

Similar Documents

Publication Publication Date Title
JP3790469B2 (ja) 半導体装置
JP2003152077A5 (enExample)
JPH1126757A5 (enExample)
JP3116360B2 (ja) 自己整合型コンタクトホールの形成方法及び半導体装置
JP2003152165A5 (enExample)
US6084289A (en) Semiconductor processing method of forming a contact opening to a region adjacent a field isolation mass, and a semiconductor structure
JPH11195704A5 (enExample)
JPH05243390A (ja) 半導体装置の導電層接続構造およびその製造方法
US6060765A (en) Semiconductor device and a method of manufacturing the same
JP3442630B2 (ja) 半導体装置
JPH1079491A5 (enExample)
KR960026644A (ko) 반도체 장치의 배선구조 및 그의 제조방법
JPH10261646A5 (enExample)
JP5252350B2 (ja) 半導体デバイスにおいて付加的金属ルーティングを形成するためのシステムおよび方法
JP3463961B2 (ja) 半導体装置
US7696504B2 (en) Phase change memory device
KR101196484B1 (ko) 저장 구조체의 주변에 충진 패턴을 가지는 반도체 장치 및그의 형성방법
JPH0290668A (ja) 半導体装置
JP3618974B2 (ja) 半導体装置の製造方法
KR100591175B1 (ko) 반도체 소자의 금속 배선의 층간 연결 구조의 제조 방법
JPH11265938A5 (enExample)
JPH0917860A (ja) 半導体素子における配線構造とその製造方法
KR100324341B1 (ko) 반도체 장치의 패드 형성방법
JP3189399B2 (ja) 半導体装置の製造方法
JPS63237443A (ja) 半導体装置