JPH10156709A5 - - Google Patents

Info

Publication number
JPH10156709A5
JPH10156709A5 JP1997342026A JP34202697A JPH10156709A5 JP H10156709 A5 JPH10156709 A5 JP H10156709A5 JP 1997342026 A JP1997342026 A JP 1997342026A JP 34202697 A JP34202697 A JP 34202697A JP H10156709 A5 JPH10156709 A5 JP H10156709A5
Authority
JP
Japan
Prior art keywords
major surface
substrate
refractory metal
oxide
coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1997342026A
Other languages
English (en)
Japanese (ja)
Other versions
JPH10156709A (ja
Filing date
Publication date
Priority claimed from US08/755,870 external-priority patent/US5743788A/en
Application filed filed Critical
Publication of JPH10156709A publication Critical patent/JPH10156709A/ja
Publication of JPH10156709A5 publication Critical patent/JPH10156709A5/ja
Pending legal-status Critical Current

Links

JP34202697A 1996-12-02 1997-11-27 化学機械研磨用プラテン・コーティング構造および方法 Pending JPH10156709A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US755870 1996-12-02
US08/755,870 US5743788A (en) 1996-12-02 1996-12-02 Platen coating structure for chemical mechanical polishing and method

Publications (2)

Publication Number Publication Date
JPH10156709A JPH10156709A (ja) 1998-06-16
JPH10156709A5 true JPH10156709A5 (enExample) 2005-07-14

Family

ID=25041012

Family Applications (1)

Application Number Title Priority Date Filing Date
JP34202697A Pending JPH10156709A (ja) 1996-12-02 1997-11-27 化学機械研磨用プラテン・コーティング構造および方法

Country Status (7)

Country Link
US (1) US5743788A (enExample)
EP (1) EP0850725B1 (enExample)
JP (1) JPH10156709A (enExample)
KR (1) KR100501961B1 (enExample)
CN (1) CN1161211C (enExample)
DE (1) DE69716866T2 (enExample)
TW (1) TW351835B (enExample)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5964413A (en) * 1997-11-05 1999-10-12 Mok; Peter Apparatus for dispensing slurry
JPH11333703A (ja) * 1998-05-28 1999-12-07 Speedfam-Ipec Co Ltd ポリッシング加工機
JPH11347921A (ja) * 1998-06-05 1999-12-21 Memc Kk シリコンウェーハの研磨方法
US6036586A (en) * 1998-07-29 2000-03-14 Micron Technology, Inc. Apparatus and method for reducing removal forces for CMP pads
US6220942B1 (en) * 1999-04-02 2001-04-24 Applied Materials, Inc. CMP platen with patterned surface
US20040053566A1 (en) * 2001-01-12 2004-03-18 Applied Materials, Inc. CMP platen with patterned surface
FR2791917B1 (fr) * 1999-04-06 2001-06-22 Prec Machines Outils Procede de realisation d'une machine a rectifier de precision du type comprenant un bati et machine a rectifier de precision correspondante
US6468135B1 (en) 1999-04-30 2002-10-22 International Business Machines Corporation Method and apparatus for multiphase chemical mechanical polishing
US6363599B1 (en) 1999-08-04 2002-04-02 Komag, Inc. Method for manufacturing a magnetic disk including a glass substrate
AU7851000A (en) * 1999-10-08 2001-04-23 Speed-Fam-Ipec Corporation Optimal offset, pad size and pad shape for cmp buffing and polishing
US6793561B2 (en) 1999-10-14 2004-09-21 International Business Machines Corporation Removable/disposable platen top
US6422921B1 (en) 1999-10-22 2002-07-23 Applied Materials, Inc. Heat activated detachable polishing pad
US6203417B1 (en) * 1999-11-05 2001-03-20 Speedfam-Ipec Corporation Chemical mechanical polishing tool components with improved corrosion resistance
US6264536B1 (en) * 2000-02-01 2001-07-24 Lucent Technologies Inc. Reducing polish platen corrosion during integrated circuit fabrication
US6599175B2 (en) 2001-08-06 2003-07-29 Speedfam-Ipeca Corporation Apparatus for distributing a fluid through a polishing pad
US7040957B2 (en) * 2002-08-14 2006-05-09 Novellus Systems Inc. Platen and manifold for polishing workpieces
US6951504B2 (en) * 2003-03-20 2005-10-04 3M Innovative Properties Company Abrasive article with agglomerates and method of use
KR100810893B1 (ko) 2003-12-31 2008-03-07 동부일렉트로닉스 주식회사 씨엠피 장비용 평면 코팅 장치
JP5065574B2 (ja) * 2005-01-12 2012-11-07 住友電気工業株式会社 ＧａＮ基板の研磨方法
CN102380818A (zh) * 2010-09-01 2012-03-21 无锡华润上华半导体有限公司 化学机械研磨方法和研磨设备
GB201110476D0 (en) * 2011-06-21 2011-08-03 Spp Process Technology Systems Uk Ltd A method of supporting a workpiece during physical vapour deposition
US9719166B2 (en) 2011-06-21 2017-08-01 Spts Technologies Limited Method of supporting a workpiece during physical vapour deposition
CN103659576A (zh) * 2012-09-20 2014-03-26 苏州赫瑞特电子专用设备科技有限公司 一种单面研磨抛光机的研磨抛光盘
CN103276214B (zh) * 2013-05-30 2014-11-19 上海交通大学 利用电镀废水制备防腐蚀涂层的方法
US11397139B2 (en) * 2017-02-27 2022-07-26 Leco Corporation Metallographic grinder and components thereof
WO2018175758A1 (en) * 2017-03-24 2018-09-27 Axus Technology, Llc Atmospheric plasma in wafer processing system optimization
KR102699594B1 (ko) * 2019-05-31 2024-08-28 어플라이드 머티어리얼스, 인코포레이티드 연마 플래튼들 및 연마 플래튼 제조 방법들
CN115488754B (zh) * 2022-09-30 2024-12-24 上海芯物科技有限公司 Cmp自动贴膜装置及方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5855562A (ja) * 1981-09-28 1983-04-01 Hitachi Ltd 研磨皿とその製造方法
GB9010833D0 (en) * 1990-05-15 1990-07-04 Electrotech Research Limited Workpiece support
EP0756917A4 (en) * 1994-04-22 1997-12-17 Toshiba Kk SEPARATE GRINDING SURFACE SUPPORT PLATE AND ASSOCIATED APPARATUS
US5558717A (en) * 1994-11-30 1996-09-24 Applied Materials CVD Processing chamber
US5533923A (en) * 1995-04-10 1996-07-09 Applied Materials, Inc. Chemical-mechanical polishing pad providing polishing unformity

Similar Documents

Publication Publication Date Title
JPH10156709A5 (enExample)
KR100501961B1 (ko) 화학기계연마용플래튼코팅구조및방법
KR100633012B1 (ko) 유리질 결합공구 및 이것을 만드는 방법
US6350184B1 (en) Polishing pad conditioning device with cutting elements
KR100222228B1 (ko) 웨이퍼 및 기판의 재생방법 및 장치
US5842912A (en) Apparatus for conditioning polishing pads utilizing brazed diamond technology
WO2001004227A3 (en) Metal bond abrasive article comprising porous ceramic abrasive composites and method of using same to abrade a workpiece
DE69503408D1 (de) Vorrichtung zum chemisch-mechanischen Polieren mit verbesserter Verteilung der Polierzusammensetzung
CA2369617A1 (en) Abrasive article suitable for abrading glass and glass ceramic workpieces
KR950027995A (ko) 연마천 조절방법 및 표면 처리 장치
JP2000173954A5 (enExample)
EP0913442A3 (en) Polishing method
JPH10504495A (ja) ダイアモンド状コーティング層を有する研磨物品およびその方法
KR100286415B1 (ko) 브레이즈 접합 다이아몬드 기술을 이용한 연마패드 컨디셔닝 방법 및 장치
JP2000103636A5 (enExample)
JP2001025973A (ja) ビトリファイドボンド工具及びその製造方法
CA2266145A1 (en) Ceramic substrate polishing method
TWI256415B (en) Slurry for chemical mechanical polishing
KR970073870A (ko) 드레서가 부착된 편면 연마장치
JP2001088009A (ja) ポリッシングパッドのドレッシング装置
EP0934801A3 (en) Method and apparatus for polishing work
KR20170073854A (ko) 연마 장치의 연마 디스크
JP2660925B2 (ja) 両面研磨装置用キャリア
JP3818445B2 (ja) パッドレス研磨定盤及び方法
KR970023800A (ko) 폴리싱포의 드레싱방법 및 장치