CN1161211C - 用于化学机械抛光的压磨板涂层结构及方法 - Google Patents

用于化学机械抛光的压磨板涂层结构及方法 Download PDF

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Publication number
CN1161211C
CN1161211C CNB971221235A CN97122123A CN1161211C CN 1161211 C CN1161211 C CN 1161211C CN B971221235 A CNB971221235 A CN B971221235A CN 97122123 A CN97122123 A CN 97122123A CN 1161211 C CN1161211 C CN 1161211C
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CN
China
Prior art keywords
coating
nog plate
layer
polishing
oxide
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB971221235A
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English (en)
Chinese (zh)
Other versions
CN1184019A (zh
Inventor
詹姆斯F・瓦内尔
詹姆斯F·瓦内尔
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NXP USA Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of CN1184019A publication Critical patent/CN1184019A/zh
Application granted granted Critical
Publication of CN1161211C publication Critical patent/CN1161211C/zh
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Expired - Fee Related legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/02—Frames; Beds; Carriages
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
    • C23C4/04—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the coating material
    • C23C4/10—Oxides, borides, carbides, nitrides or silicides; Mixtures thereof
    • C23C4/11—Oxides

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Coating By Spraying Or Casting (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
CNB971221235A 1996-12-02 1997-11-14 用于化学机械抛光的压磨板涂层结构及方法 Expired - Fee Related CN1161211C (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/755870 1996-12-02
US08/755,870 1996-12-02
US08/755,870 US5743788A (en) 1996-12-02 1996-12-02 Platen coating structure for chemical mechanical polishing and method

Publications (2)

Publication Number Publication Date
CN1184019A CN1184019A (zh) 1998-06-10
CN1161211C true CN1161211C (zh) 2004-08-11

Family

ID=25041012

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB971221235A Expired - Fee Related CN1161211C (zh) 1996-12-02 1997-11-14 用于化学机械抛光的压磨板涂层结构及方法

Country Status (7)

Country Link
US (1) US5743788A (enExample)
EP (1) EP0850725B1 (enExample)
JP (1) JPH10156709A (enExample)
KR (1) KR100501961B1 (enExample)
CN (1) CN1161211C (enExample)
DE (1) DE69716866T2 (enExample)
TW (1) TW351835B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103659576A (zh) * 2012-09-20 2014-03-26 苏州赫瑞特电子专用设备科技有限公司 一种单面研磨抛光机的研磨抛光盘

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5964413A (en) * 1997-11-05 1999-10-12 Mok; Peter Apparatus for dispensing slurry
JPH11333703A (ja) * 1998-05-28 1999-12-07 Speedfam-Ipec Co Ltd ポリッシング加工機
JPH11347921A (ja) * 1998-06-05 1999-12-21 Memc Kk シリコンウェーハの研磨方法
US6036586A (en) * 1998-07-29 2000-03-14 Micron Technology, Inc. Apparatus and method for reducing removal forces for CMP pads
US20040053566A1 (en) * 2001-01-12 2004-03-18 Applied Materials, Inc. CMP platen with patterned surface
US6220942B1 (en) * 1999-04-02 2001-04-24 Applied Materials, Inc. CMP platen with patterned surface
FR2791917B1 (fr) * 1999-04-06 2001-06-22 Prec Machines Outils Procede de realisation d'une machine a rectifier de precision du type comprenant un bati et machine a rectifier de precision correspondante
US6468135B1 (en) 1999-04-30 2002-10-22 International Business Machines Corporation Method and apparatus for multiphase chemical mechanical polishing
US6363599B1 (en) 1999-08-04 2002-04-02 Komag, Inc. Method for manufacturing a magnetic disk including a glass substrate
WO2001027350A1 (en) * 1999-10-08 2001-04-19 Speedfam-Ipec Corporation Optimal offset, pad size and pad shape for cmp buffing and polishing
US6793561B2 (en) 1999-10-14 2004-09-21 International Business Machines Corporation Removable/disposable platen top
US6422921B1 (en) 1999-10-22 2002-07-23 Applied Materials, Inc. Heat activated detachable polishing pad
US6203417B1 (en) 1999-11-05 2001-03-20 Speedfam-Ipec Corporation Chemical mechanical polishing tool components with improved corrosion resistance
US6264536B1 (en) * 2000-02-01 2001-07-24 Lucent Technologies Inc. Reducing polish platen corrosion during integrated circuit fabrication
US6599175B2 (en) 2001-08-06 2003-07-29 Speedfam-Ipeca Corporation Apparatus for distributing a fluid through a polishing pad
US7040957B2 (en) * 2002-08-14 2006-05-09 Novellus Systems Inc. Platen and manifold for polishing workpieces
US6951504B2 (en) * 2003-03-20 2005-10-04 3M Innovative Properties Company Abrasive article with agglomerates and method of use
KR100810893B1 (ko) 2003-12-31 2008-03-07 동부일렉트로닉스 주식회사 씨엠피 장비용 평면 코팅 장치
JP5065574B2 (ja) * 2005-01-12 2012-11-07 住友電気工業株式会社 ＧａＮ基板の研磨方法
CN102380818A (zh) * 2010-09-01 2012-03-21 无锡华润上华半导体有限公司 化学机械研磨方法和研磨设备
US9719166B2 (en) 2011-06-21 2017-08-01 Spts Technologies Limited Method of supporting a workpiece during physical vapour deposition
GB201110476D0 (en) * 2011-06-21 2011-08-03 Spp Process Technology Systems Uk Ltd A method of supporting a workpiece during physical vapour deposition
CN103276214B (zh) * 2013-05-30 2014-11-19 上海交通大学 利用电镀废水制备防腐蚀涂层的方法
US11397139B2 (en) * 2017-02-27 2022-07-26 Leco Corporation Metallographic grinder and components thereof
US12198935B2 (en) * 2017-03-24 2025-01-14 Axus Technology, Llc Atmospheric plasma in wafer processing system optimization
KR102699594B1 (ko) * 2019-05-31 2024-08-28 어플라이드 머티어리얼스, 인코포레이티드 연마 플래튼들 및 연마 플래튼 제조 방법들
CN115488754B (zh) * 2022-09-30 2024-12-24 上海芯物科技有限公司 Cmp自动贴膜装置及方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5855562A (ja) * 1981-09-28 1983-04-01 Hitachi Ltd 研磨皿とその製造方法
GB9010833D0 (en) * 1990-05-15 1990-07-04 Electrotech Research Limited Workpiece support
WO1995029039A1 (en) * 1994-04-22 1995-11-02 Kabushiki Kaisha Toshiba Separation type grinding surface plate and grinding apparatus using same
US5558717A (en) * 1994-11-30 1996-09-24 Applied Materials CVD Processing chamber
US5533923A (en) * 1995-04-10 1996-07-09 Applied Materials, Inc. Chemical-mechanical polishing pad providing polishing unformity

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103659576A (zh) * 2012-09-20 2014-03-26 苏州赫瑞特电子专用设备科技有限公司 一种单面研磨抛光机的研磨抛光盘

Also Published As

Publication number Publication date
US5743788A (en) 1998-04-28
DE69716866T2 (de) 2003-03-27
EP0850725B1 (en) 2002-11-06
JPH10156709A (ja) 1998-06-16
DE69716866D1 (de) 2002-12-12
EP0850725A3 (en) 1999-01-13
KR100501961B1 (ko) 2005-10-06
TW351835B (en) 1999-02-01
EP0850725A2 (en) 1998-07-01
KR19980063880A (ko) 1998-10-07
CN1184019A (zh) 1998-06-10

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C06 Publication
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SE01 Entry into force of request for substantive examination
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GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: FREESCALE SEMICONDUCTOR INC.

Free format text: FORMER OWNER: MOTOROLA, INC.

Effective date: 20041203

C41 Transfer of patent application or patent right or utility model
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Effective date of registration: 20041203

Address after: texas

Patentee after: Fisical Semiconductor Inc.

Address before: Illinois

Patentee before: Motorola Inc.

CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20040811

Termination date: 20151114

EXPY Termination of patent right or utility model