DE69716866D1 - Beschichtungsstruktur einer Scheibe zum chemisch-mechanischen Polieren und Verfahren - Google Patents
Beschichtungsstruktur einer Scheibe zum chemisch-mechanischen Polieren und VerfahrenInfo
- Publication number
- DE69716866D1 DE69716866D1 DE69716866T DE69716866T DE69716866D1 DE 69716866 D1 DE69716866 D1 DE 69716866D1 DE 69716866 T DE69716866 T DE 69716866T DE 69716866 T DE69716866 T DE 69716866T DE 69716866 D1 DE69716866 D1 DE 69716866D1
- Authority
- DE
- Germany
- Prior art keywords
- disk
- processing
- mechanical polishing
- chemical mechanical
- coating structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/02—Frames; Beds; Carriages
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/04—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the coating material
- C23C4/10—Oxides, borides, carbides, nitrides or silicides; Mixtures thereof
- C23C4/11—Oxides
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Coating By Spraying Or Casting (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/755,870 US5743788A (en) | 1996-12-02 | 1996-12-02 | Platen coating structure for chemical mechanical polishing and method |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69716866D1 true DE69716866D1 (de) | 2002-12-12 |
DE69716866T2 DE69716866T2 (de) | 2003-03-27 |
Family
ID=25041012
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69716866T Expired - Lifetime DE69716866T2 (de) | 1996-12-02 | 1997-11-12 | Beschichtungsstruktur einer Scheibe zum chemisch-mechanischen Polieren und Verfahren |
Country Status (7)
Country | Link |
---|---|
US (1) | US5743788A (de) |
EP (1) | EP0850725B1 (de) |
JP (1) | JPH10156709A (de) |
KR (1) | KR100501961B1 (de) |
CN (1) | CN1161211C (de) |
DE (1) | DE69716866T2 (de) |
TW (1) | TW351835B (de) |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5964413A (en) * | 1997-11-05 | 1999-10-12 | Mok; Peter | Apparatus for dispensing slurry |
JPH11333703A (ja) * | 1998-05-28 | 1999-12-07 | Speedfam-Ipec Co Ltd | ポリッシング加工機 |
JPH11347921A (ja) * | 1998-06-05 | 1999-12-21 | Memc Kk | シリコンウェーハの研磨方法 |
US6036586A (en) * | 1998-07-29 | 2000-03-14 | Micron Technology, Inc. | Apparatus and method for reducing removal forces for CMP pads |
US6220942B1 (en) * | 1999-04-02 | 2001-04-24 | Applied Materials, Inc. | CMP platen with patterned surface |
US20040053566A1 (en) * | 2001-01-12 | 2004-03-18 | Applied Materials, Inc. | CMP platen with patterned surface |
FR2791917B1 (fr) * | 1999-04-06 | 2001-06-22 | Prec Machines Outils | Procede de realisation d'une machine a rectifier de precision du type comprenant un bati et machine a rectifier de precision correspondante |
US6468135B1 (en) | 1999-04-30 | 2002-10-22 | International Business Machines Corporation | Method and apparatus for multiphase chemical mechanical polishing |
US6363599B1 (en) | 1999-08-04 | 2002-04-02 | Komag, Inc. | Method for manufacturing a magnetic disk including a glass substrate |
AU7851000A (en) * | 1999-10-08 | 2001-04-23 | Speed-Fam-Ipec Corporation | Optimal offset, pad size and pad shape for cmp buffing and polishing |
US6793561B2 (en) | 1999-10-14 | 2004-09-21 | International Business Machines Corporation | Removable/disposable platen top |
US6422921B1 (en) | 1999-10-22 | 2002-07-23 | Applied Materials, Inc. | Heat activated detachable polishing pad |
US6203417B1 (en) * | 1999-11-05 | 2001-03-20 | Speedfam-Ipec Corporation | Chemical mechanical polishing tool components with improved corrosion resistance |
US6264536B1 (en) * | 2000-02-01 | 2001-07-24 | Lucent Technologies Inc. | Reducing polish platen corrosion during integrated circuit fabrication |
US6599175B2 (en) | 2001-08-06 | 2003-07-29 | Speedfam-Ipeca Corporation | Apparatus for distributing a fluid through a polishing pad |
US7040957B2 (en) * | 2002-08-14 | 2006-05-09 | Novellus Systems Inc. | Platen and manifold for polishing workpieces |
US6951504B2 (en) * | 2003-03-20 | 2005-10-04 | 3M Innovative Properties Company | Abrasive article with agglomerates and method of use |
KR100810893B1 (ko) | 2003-12-31 | 2008-03-07 | 동부일렉트로닉스 주식회사 | 씨엠피 장비용 평면 코팅 장치 |
JP5065574B2 (ja) * | 2005-01-12 | 2012-11-07 | 住友電気工業株式会社 | GaN基板の研磨方法 |
CN102380818A (zh) * | 2010-09-01 | 2012-03-21 | 无锡华润上华半导体有限公司 | 化学机械研磨方法和研磨设备 |
GB201110476D0 (en) * | 2011-06-21 | 2011-08-03 | Spp Process Technology Systems Uk Ltd | A method of supporting a workpiece during physical vapour deposition |
US9719166B2 (en) | 2011-06-21 | 2017-08-01 | Spts Technologies Limited | Method of supporting a workpiece during physical vapour deposition |
CN103659576A (zh) * | 2012-09-20 | 2014-03-26 | 苏州赫瑞特电子专用设备科技有限公司 | 一种单面研磨抛光机的研磨抛光盘 |
CN103276214B (zh) * | 2013-05-30 | 2014-11-19 | 上海交通大学 | 利用电镀废水制备防腐蚀涂层的方法 |
US11397139B2 (en) * | 2017-02-27 | 2022-07-26 | Leco Corporation | Metallographic grinder and components thereof |
WO2018175758A1 (en) * | 2017-03-24 | 2018-09-27 | Axus Technology, Llc | Atmospheric plasma in wafer processing system optimization |
CN113874167B (zh) * | 2019-05-31 | 2024-05-07 | 应用材料公司 | 抛光台板及抛光台板制造方法 |
CN115488754A (zh) * | 2022-09-30 | 2022-12-20 | 上海芯物科技有限公司 | Cmp自动贴膜装置及方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5855562A (ja) * | 1981-09-28 | 1983-04-01 | Hitachi Ltd | 研磨皿とその製造方法 |
GB9010833D0 (en) * | 1990-05-15 | 1990-07-04 | Electrotech Research Limited | Workpiece support |
US6083083A (en) * | 1994-04-22 | 2000-07-04 | Kabushiki Kaisha Toshiba | Separation type grinding surface plate and grinding apparatus using same |
US5558717A (en) * | 1994-11-30 | 1996-09-24 | Applied Materials | CVD Processing chamber |
US5533923A (en) * | 1995-04-10 | 1996-07-09 | Applied Materials, Inc. | Chemical-mechanical polishing pad providing polishing unformity |
-
1996
- 1996-12-02 US US08/755,870 patent/US5743788A/en not_active Expired - Lifetime
-
1997
- 1997-10-21 TW TW086115533A patent/TW351835B/zh not_active IP Right Cessation
- 1997-11-12 EP EP97119782A patent/EP0850725B1/de not_active Expired - Lifetime
- 1997-11-12 DE DE69716866T patent/DE69716866T2/de not_active Expired - Lifetime
- 1997-11-14 CN CNB971221235A patent/CN1161211C/zh not_active Expired - Fee Related
- 1997-11-27 JP JP34202697A patent/JPH10156709A/ja active Pending
- 1997-12-02 KR KR1019970066581A patent/KR100501961B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP0850725A3 (de) | 1999-01-13 |
DE69716866T2 (de) | 2003-03-27 |
KR19980063880A (ko) | 1998-10-07 |
CN1184019A (zh) | 1998-06-10 |
US5743788A (en) | 1998-04-28 |
EP0850725B1 (de) | 2002-11-06 |
TW351835B (en) | 1999-02-01 |
EP0850725A2 (de) | 1998-07-01 |
KR100501961B1 (ko) | 2005-10-06 |
CN1161211C (zh) | 2004-08-11 |
JPH10156709A (ja) | 1998-06-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |