DE69307974D1 - Akustische Oberflächenwellenanordnung und Verfahren zur Herstellung - Google Patents

Akustische Oberflächenwellenanordnung und Verfahren zur Herstellung

Info

Publication number
DE69307974D1
DE69307974D1 DE69307974T DE69307974T DE69307974D1 DE 69307974 D1 DE69307974 D1 DE 69307974D1 DE 69307974 T DE69307974 T DE 69307974T DE 69307974 T DE69307974 T DE 69307974T DE 69307974 D1 DE69307974 D1 DE 69307974D1
Authority
DE
Germany
Prior art keywords
manufacturing
acoustic wave
surface acoustic
wave device
wave
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69307974T
Other languages
English (en)
Other versions
DE69307974T2 (de
Inventor
Shinichi Sikata
Akihiro Hachigo
Hideaki Nakahata
Kenjiro Higaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Application granted granted Critical
Publication of DE69307974D1 publication Critical patent/DE69307974D1/de
Publication of DE69307974T2 publication Critical patent/DE69307974T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02582—Characteristics of substrate, e.g. cutting angles of diamond substrates
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
DE69307974T 1992-09-11 1993-09-03 Akustische Oberflächenwellenanordnung und Verfahren zur Herstellung Expired - Lifetime DE69307974T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24331992A JP3252865B2 (ja) 1992-09-11 1992-09-11 表面弾性波素子および表面弾性波素子の製造方法

Publications (2)

Publication Number Publication Date
DE69307974D1 true DE69307974D1 (de) 1997-03-20
DE69307974T2 DE69307974T2 (de) 1997-05-22

Family

ID=17102069

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69307974T Expired - Lifetime DE69307974T2 (de) 1992-09-11 1993-09-03 Akustische Oberflächenwellenanordnung und Verfahren zur Herstellung

Country Status (4)

Country Link
US (2) US5343107A (de)
EP (1) EP0587068B1 (de)
JP (1) JP3252865B2 (de)
DE (1) DE69307974T2 (de)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0930702B1 (de) * 1994-03-25 2003-07-09 Sumitomo Electric Industries, Ltd. Orientierbares Material und Oberflächenwellenanordnung
JP3344441B2 (ja) * 1994-03-25 2002-11-11 住友電気工業株式会社 表面弾性波素子
EP0674384B1 (de) * 1994-03-25 1999-08-11 Sumitomo Electric Industries, Ltd Orientierbares Material und Oberflächenwellenanordnung
EP0676485B1 (de) * 1994-04-07 1998-07-08 Sumitomo Electric Industries, Limited Diamantwafer und Verfahren zur Herstellung eines Diamantwafers
JP3318920B2 (ja) * 1994-05-10 2002-08-26 住友電気工業株式会社 表面弾性波素子
EP0878268B1 (de) 1994-05-23 2002-03-27 Sumitomo Electric Industries, Ltd. Verfahren und Vorrichtung zum Herstellen eines mit hartem Material bedeckten Halbleiters durch Polieren
EP0699776B1 (de) * 1994-06-09 1999-03-31 Sumitomo Electric Industries, Limited Wafer und Verfahren zur Herstellung eines Wafers
JP3295921B2 (ja) * 1994-06-20 2002-06-24 住友電気工業株式会社 表面弾性波素子用ダイヤモンド基材及び素子
US5576589A (en) * 1994-10-13 1996-11-19 Kobe Steel Usa, Inc. Diamond surface acoustic wave devices
US5815900A (en) * 1995-03-06 1998-10-06 Matsushita Electric Industrial Co., Ltd. Method of manufacturing a surface acoustic wave module
US5961718A (en) * 1995-10-16 1999-10-05 National Science Council Process for selectively depositing diamond films
US5907768A (en) * 1996-08-16 1999-05-25 Kobe Steel Usa Inc. Methods for fabricating microelectronic structures including semiconductor islands
JP3712035B2 (ja) * 1999-04-28 2005-11-02 株式会社村田製作所 表面波装置の製造方法
DE10000746A1 (de) * 2000-01-11 2001-07-12 Epcos Ag Bauelement mit Ableitung für Pyrospannungen und Herstellverfahren
US7043129B2 (en) * 2000-06-16 2006-05-09 Wayne State University Wide bandgap semiconductor waveguide structures
US6848295B2 (en) * 2002-04-17 2005-02-01 Wayne State University Acoustic wave sensor apparatus, method and system using wide bandgap materials
DE10206480B4 (de) * 2001-02-16 2005-02-10 Leibniz-Institut für Festkörper- und Werkstoffforschung e.V. Akustisches Oberflächenwellenbauelement
JP4543565B2 (ja) * 2001-03-07 2010-09-15 株式会社村田製作所 弾性表面波素子の周波数調整方法
JP2003101360A (ja) * 2001-09-19 2003-04-04 Murata Mfg Co Ltd 弾性表面波素子の電極パターン形成方法
US7148610B2 (en) * 2002-02-01 2006-12-12 Oc Oerlikon Balzers Ag Surface acoustic wave device having improved performance and method of making the device
DE10216559B4 (de) * 2002-04-09 2007-08-09 Leibniz-Institut für Festkörper- und Werkstoffforschung e.V. Akustisches Oberflächenwellenbauelement und Verfahren zu dessen Herstellung
US20040144927A1 (en) * 2003-01-28 2004-07-29 Auner Gregory W. Microsystems arrays for digital radiation imaging and signal processing and method for making microsystem arrays
US6853075B2 (en) * 2003-01-28 2005-02-08 Wayne State University Self-assembled nanobump array stuctures and a method to fabricate such structures
JP4064208B2 (ja) * 2002-10-31 2008-03-19 アルプス電気株式会社 弾性表面波素子及びその製造方法
US7270137B2 (en) * 2003-04-28 2007-09-18 Tokyo Electron Limited Apparatus and method of securing a workpiece during high-pressure processing
WO2005093949A1 (ja) * 2004-03-29 2005-10-06 Murata Manufacturing Co., Ltd. 弾性境界波装置の製造方法及び弾性境界波装置
KR100631838B1 (ko) * 2004-05-17 2006-10-09 삼성전기주식회사 무정전기 표면탄성파 필터
JP2006128075A (ja) * 2004-10-01 2006-05-18 Seiko Epson Corp 高周波加熱装置、半導体製造装置および光源装置
WO2007024038A1 (en) * 2005-08-23 2007-03-01 Konkuk University Industrial Cooperation Corp. Electro active material actuator embedded with interdigitated electrodes
TWI430484B (zh) * 2010-07-28 2014-03-11 Univ Nat Sun Yat Sen 具高c軸取向之氧化鋅壓電薄膜之製作方法
US8138097B1 (en) * 2010-09-20 2012-03-20 Kabushiki Kaisha Toshiba Method for processing semiconductor structure and device based on the same
US8723392B2 (en) 2011-07-15 2014-05-13 International Business Machines Corporation Saw filter having planar barrier layer and method of making
US10594292B2 (en) * 2017-01-30 2020-03-17 Huawei Technologies Co., Ltd. Surface acoustic wave device

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5438874A (en) * 1977-08-30 1979-03-24 Jirou Miyai Ornament made by processing white of egg
JPS6462911A (en) * 1987-09-03 1989-03-09 Sumitomo Electric Industries Surface acoustic wave element
US5162690A (en) * 1989-04-14 1992-11-10 Murata Manufacturing Co., Ltd. Surface acoustic wave device
JPH0340510A (ja) * 1989-07-06 1991-02-21 Murata Mfg Co Ltd 弾性表面波装置
JPH03126697A (ja) * 1989-10-13 1991-05-29 Sumitomo Electric Ind Ltd ダイヤモンド単結晶基板の製造方法
US4952832A (en) * 1989-10-24 1990-08-28 Sumitomo Electric Industries, Ltd. Surface acoustic wave device
US5247189A (en) * 1989-11-15 1993-09-21 Sumitomo Electric Industries, Ltd. Superconducting device composed of oxide superconductor material
JP3109060B2 (ja) * 1991-09-26 2000-11-13 住友電気工業株式会社 表面弾性波素子
US5221870A (en) * 1991-09-30 1993-06-22 Sumitomo Electric Industries, Ltd. Surface acoustic wave device

Also Published As

Publication number Publication date
JPH0697760A (ja) 1994-04-08
EP0587068A1 (de) 1994-03-16
DE69307974T2 (de) 1997-05-22
US5343107A (en) 1994-08-30
EP0587068B1 (de) 1997-02-05
JP3252865B2 (ja) 2002-02-04
US5497726A (en) 1996-03-12

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8328 Change in the person/name/address of the agent

Representative=s name: GROSSE, BOCKHORNI, SCHUMACHER, 81476 MUENCHEN

8327 Change in the person/name/address of the patent owner

Owner name: SEIKO EPSON CORP., TOKIO/TOKYO, JP

8328 Change in the person/name/address of the agent

Representative=s name: BOCKHORNI & KOLLEGEN, 80687 MUENCHEN