DE69615959T2 - Piezoelektrische Anordnung und Verfahren zur Herstellung - Google Patents
Piezoelektrische Anordnung und Verfahren zur HerstellungInfo
- Publication number
- DE69615959T2 DE69615959T2 DE69615959T DE69615959T DE69615959T2 DE 69615959 T2 DE69615959 T2 DE 69615959T2 DE 69615959 T DE69615959 T DE 69615959T DE 69615959 T DE69615959 T DE 69615959T DE 69615959 T2 DE69615959 T2 DE 69615959T2
- Authority
- DE
- Germany
- Prior art keywords
- manufacturing
- piezoelectric device
- piezoelectric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
- H10N30/085—Shaping or machining of piezoelectric or electrostrictive bodies by machining
- H10N30/088—Shaping or machining of piezoelectric or electrostrictive bodies by machining by cutting or dicing
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Dicing (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18246895 | 1995-07-19 | ||
US08/677,548 US5759753A (en) | 1995-07-19 | 1996-07-18 | Piezoelectric device and method of manufacturing the same |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69615959D1 DE69615959D1 (de) | 2001-11-22 |
DE69615959T2 true DE69615959T2 (de) | 2002-04-25 |
Family
ID=47638291
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69615959T Expired - Fee Related DE69615959T2 (de) | 1995-07-19 | 1996-07-19 | Piezoelektrische Anordnung und Verfahren zur Herstellung |
Country Status (3)
Country | Link |
---|---|
US (2) | US5759753A (de) |
EP (1) | EP0755085B1 (de) |
DE (1) | DE69615959T2 (de) |
Families Citing this family (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2751467B1 (fr) * | 1996-07-17 | 1998-10-02 | Commissariat Energie Atomique | Procede d'assemblage de deux structures et dispositif obtenu par le procede. applications aux microlasers |
US6963155B1 (en) | 1997-04-24 | 2005-11-08 | Mitsubishi Denki Kabushiki Kaisha | Film acoustic wave device, manufacturing method and circuit device |
US5882986A (en) * | 1998-03-30 | 1999-03-16 | General Semiconductor, Inc. | Semiconductor chips having a mesa structure provided by sawing |
US6235612B1 (en) * | 1998-06-10 | 2001-05-22 | Texas Instruments Incorporated | Edge bond pads on integrated circuits |
TW427059B (en) * | 1998-08-07 | 2001-03-21 | Tdk Corp | Resonator, piezoelectric resonator and the manufacturing method thereof |
US6236141B1 (en) | 1998-12-14 | 2001-05-22 | Matsushita Electric Industrial Co., Ltd. | Surface acoustic wave element |
JP3473538B2 (ja) * | 1999-05-14 | 2003-12-08 | 株式会社村田製作所 | 圧電部品の周波数調整装置及び周波数調整方法 |
US6984571B1 (en) | 1999-10-01 | 2006-01-10 | Ziptronix, Inc. | Three dimensional device integration method and integrated device |
US6500694B1 (en) * | 2000-03-22 | 2002-12-31 | Ziptronix, Inc. | Three dimensional device integration method and integrated device |
US6902987B1 (en) | 2000-02-16 | 2005-06-07 | Ziptronix, Inc. | Method for low temperature bonding and bonded structure |
US6563133B1 (en) * | 2000-08-09 | 2003-05-13 | Ziptronix, Inc. | Method of epitaxial-like wafer bonding at low temperature and bonded structure |
US6962834B2 (en) * | 2002-03-22 | 2005-11-08 | Stark David H | Wafer-level hermetic micro-device packages |
US7832177B2 (en) * | 2002-03-22 | 2010-11-16 | Electronics Packaging Solutions, Inc. | Insulated glazing units |
US7109092B2 (en) | 2003-05-19 | 2006-09-19 | Ziptronix, Inc. | Method of room temperature covalent bonding |
FR2857502B1 (fr) * | 2003-07-10 | 2006-02-24 | Soitec Silicon On Insulator | Substrats pour systemes contraints |
US7266869B2 (en) * | 2003-07-30 | 2007-09-11 | Kyocera Corporation | Method for manufacturing a piezoelectric oscillator |
KR100571848B1 (ko) * | 2005-01-05 | 2006-04-17 | 삼성전자주식회사 | 실리콘 직접 접합 방법 |
JP4240087B2 (ja) * | 2006-08-09 | 2009-03-18 | 船井電機株式会社 | 形状可変ミラーの製造方法 |
US7851333B2 (en) * | 2007-03-15 | 2010-12-14 | Infineon Technologies Ag | Apparatus comprising a device and method for producing it |
JP5123573B2 (ja) * | 2007-06-13 | 2013-01-23 | ローム株式会社 | 半導体発光素子およびその製造方法 |
WO2009036359A1 (en) | 2007-09-14 | 2009-03-19 | Electronics Packaging Solutions, Inc. | Insulating glass unit having multi-height internal standoffs and visible decoration |
WO2010019484A2 (en) | 2008-08-09 | 2010-02-18 | Eversealed Windows, Inc. | Asymmetrical flexible edge seal for vacuum insulating glass |
US8329267B2 (en) | 2009-01-15 | 2012-12-11 | Eversealed Windows, Inc. | Flexible edge seal for vacuum insulating glazing units |
US8512830B2 (en) | 2009-01-15 | 2013-08-20 | Eversealed Windows, Inc. | Filament-strung stand-off elements for maintaining pane separation in vacuum insulating glazing units |
WO2011153381A2 (en) | 2010-06-02 | 2011-12-08 | Eversealed Windows, Inc. | Multi-pane glass unit having seal with adhesive and hermetic coating layer |
JP5720152B2 (ja) * | 2010-09-06 | 2015-05-20 | 富士通株式会社 | 振動子の作製方法、振動子および発振器 |
US8871355B1 (en) * | 2010-10-08 | 2014-10-28 | Clemson University | Microstructure enhanced sinter bonding of metal injection molded part to a support substrate |
KR101623099B1 (ko) * | 2010-12-24 | 2016-05-20 | 가부시키가이샤 무라타 세이사쿠쇼 | 탄성파 장치 및 그 제조 방법 |
DE102011016566A1 (de) * | 2011-03-07 | 2012-09-13 | Osram Opto Semiconductors Gmbh | Leiterrahmen für optoelektronische Bauelemente und Verfahren zur Herstellung optoelektronischer Bauelemente |
US9328512B2 (en) | 2011-05-05 | 2016-05-03 | Eversealed Windows, Inc. | Method and apparatus for an insulating glazing unit and compliant seal for an insulating glazing unit |
JP6062429B2 (ja) * | 2011-07-15 | 2017-01-18 | コーニンクレッカ フィリップス エヌ ヴェKoninklijke Philips N.V. | 半導体デバイスを支持基板に接合する方法 |
JP5882053B2 (ja) * | 2011-12-28 | 2016-03-09 | 太陽誘電株式会社 | 弾性波デバイスの製造方法 |
WO2014027538A1 (ja) | 2012-08-17 | 2014-02-20 | 日本碍子株式会社 | 複合基板,弾性表面波デバイス及び複合基板の製造方法 |
CN104871431B (zh) | 2012-12-26 | 2018-04-10 | 日本碍子株式会社 | 复合基板及其制造方法,以及弹性波装置 |
US20160229689A1 (en) * | 2015-02-11 | 2016-08-11 | Analog Devices, Inc. | Packaged Microchip with Patterned Interposer |
FR3037443B1 (fr) | 2015-06-12 | 2018-07-13 | Soitec | Heterostructure et methode de fabrication |
FR3042649B1 (fr) * | 2015-10-20 | 2019-06-21 | Soitec | Procede de fabrication d'une structure hybride |
EP3196952B1 (de) * | 2016-01-21 | 2019-06-19 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Piezoelektrischer mems-wandler, der an einer leiterplattentragstruktur ausgebildet ist |
JP2018148071A (ja) | 2017-03-07 | 2018-09-20 | 東芝メモリ株式会社 | 記憶装置 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2266395B1 (de) * | 1974-03-26 | 1980-10-31 | Thomson Csf | |
JPS6382100A (ja) * | 1986-09-26 | 1988-04-12 | Hitachi Ltd | 圧電素子およびその製造方法 |
US5441803A (en) * | 1988-08-30 | 1995-08-15 | Onyx Optics | Composites made from single crystal substances |
US5747857A (en) * | 1991-03-13 | 1998-05-05 | Matsushita Electric Industrial Co., Ltd. | Electronic components having high-frequency elements and methods of manufacture therefor |
WO1992019564A1 (en) * | 1991-05-01 | 1992-11-12 | The Regents Of The University Of California | Amorphous ferroelectric materials |
US5199298A (en) * | 1991-06-21 | 1993-04-06 | Massachusetts Institute Of Technology | Wall shear stress sensor |
EP0594117B1 (de) * | 1992-10-20 | 1998-12-09 | Matsushita Electric Industrial Co., Ltd. | Piezoelektrisches Filter und Verfahren zu seiner Herstellung |
EP0616426B1 (de) * | 1993-03-15 | 1998-09-16 | Matsushita Electric Industrial Co., Ltd. | Akustische Oberflächenwellenanordnung mit laminierter Struktur |
US5521454A (en) * | 1993-09-16 | 1996-05-28 | Matsushita Electric Industrial Co., Ltd. | Surface wave filter element |
US5448126A (en) * | 1993-10-05 | 1995-09-05 | Matsushita Electric Industrial Co., Ltd. | Surface acoustic wave-semiconductor composite device |
EP0651449B1 (de) * | 1993-11-01 | 2002-02-13 | Matsushita Electric Industrial Co., Ltd. | Elektronische Anordnung und Verfahren zur Herstellung |
DE69609559T2 (de) * | 1995-05-08 | 2001-04-19 | Matsushita Electric Ind Co Ltd | Verfahren zur Herstellung eines Verbundsubstrats und eine dieses Substrat benutzende piezoelektrischer Anordnung |
-
1996
- 1996-07-18 US US08/677,548 patent/US5759753A/en not_active Expired - Fee Related
- 1996-07-19 DE DE69615959T patent/DE69615959T2/de not_active Expired - Fee Related
- 1996-07-19 EP EP96111659A patent/EP0755085B1/de not_active Expired - Lifetime
-
1997
- 1997-11-25 US US08/976,452 patent/US5982010A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0755085A1 (de) | 1997-01-22 |
DE69615959D1 (de) | 2001-11-22 |
EP0755085B1 (de) | 2001-10-17 |
US5759753A (en) | 1998-06-02 |
US5982010A (en) | 1999-11-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |