DE69426789D1 - Akustische Oberflächenwellenanordnung und Herstellungsverfahren dafür - Google Patents

Akustische Oberflächenwellenanordnung und Herstellungsverfahren dafür

Info

Publication number
DE69426789D1
DE69426789D1 DE69426789T DE69426789T DE69426789D1 DE 69426789 D1 DE69426789 D1 DE 69426789D1 DE 69426789 T DE69426789 T DE 69426789T DE 69426789 T DE69426789 T DE 69426789T DE 69426789 D1 DE69426789 D1 DE 69426789D1
Authority
DE
Germany
Prior art keywords
manufacturing
acoustic wave
surface acoustic
wave device
method therefor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69426789T
Other languages
English (en)
Other versions
DE69426789T2 (de
Inventor
Akihiro Kanaboshi
Masato Sugimoto
Yutaka Taguchi
Kazuo Eda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Application granted granted Critical
Publication of DE69426789D1 publication Critical patent/DE69426789D1/de
Publication of DE69426789T2 publication Critical patent/DE69426789T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1092—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a cover cap mounted on an element forming part of the surface acoustic wave [SAW] device on the side of the IDT's
DE69426789T 1993-04-28 1994-04-27 Akustische Oberflächenwellenanordnung und Herstellungsverfahren dafür Expired - Fee Related DE69426789T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP10231393 1993-04-28
JP10231293 1993-04-28
JP13313993 1993-06-03
JP21123593 1993-08-26

Publications (2)

Publication Number Publication Date
DE69426789D1 true DE69426789D1 (de) 2001-04-12
DE69426789T2 DE69426789T2 (de) 2001-08-02

Family

ID=27469000

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69426789T Expired - Fee Related DE69426789T2 (de) 1993-04-28 1994-04-27 Akustische Oberflächenwellenanordnung und Herstellungsverfahren dafür

Country Status (3)

Country Link
US (1) US6018211A (de)
EP (1) EP0622897B1 (de)
DE (1) DE69426789T2 (de)

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US6045747A (en) * 1996-03-22 2000-04-04 The Whitaker Corporation Method of producing an LC-circuit
FR2788176B1 (fr) * 1998-12-30 2001-05-25 Thomson Csf Dispositif a ondes acoustiques guidees dans une fine couche de materiau piezo-electrique collee par une colle moleculaire sur un substrat porteur et procede de fabrication
US6500694B1 (en) * 2000-03-22 2002-12-31 Ziptronix, Inc. Three dimensional device integration method and integrated device
US6984571B1 (en) 1999-10-01 2006-01-10 Ziptronix, Inc. Three dimensional device integration method and integrated device
US6902987B1 (en) 2000-02-16 2005-06-07 Ziptronix, Inc. Method for low temperature bonding and bonded structure
US6563133B1 (en) * 2000-08-09 2003-05-13 Ziptronix, Inc. Method of epitaxial-like wafer bonding at low temperature and bonded structure
US6930364B2 (en) * 2001-09-13 2005-08-16 Silicon Light Machines Corporation Microelectronic mechanical system and methods
US6877209B1 (en) 2002-08-28 2005-04-12 Silicon Light Machines, Inc. Method for sealing an active area of a surface acoustic wave device on a wafer
US6846423B1 (en) 2002-08-28 2005-01-25 Silicon Light Machines Corporation Wafer-level seal for non-silicon-based devices
US7034441B2 (en) * 2002-11-13 2006-04-25 Nihon Dempa Kogyo Co., Ltd Surface mount crystal unit and surface mount crystal oscillator
JP2004304622A (ja) * 2003-03-31 2004-10-28 Fujitsu Media Device Kk 弾性表面波デバイス及びその製造方法
US7109092B2 (en) 2003-05-19 2006-09-19 Ziptronix, Inc. Method of room temperature covalent bonding
WO2005099088A1 (en) * 2004-03-26 2005-10-20 Cypress Semiconductor Corp. Integrated circuit having one or more conductive devices formed over a saw and/or mems device
JP2006080314A (ja) * 2004-09-09 2006-03-23 Canon Inc 結合基板の製造方法
US7691723B2 (en) * 2005-01-07 2010-04-06 Honeywell International Inc. Bonding system having stress control
JP4254772B2 (ja) * 2005-01-17 2009-04-15 セイコーエプソン株式会社 弾性表面波装置
US7651879B2 (en) * 2005-12-07 2010-01-26 Honeywell International Inc. Surface acoustic wave pressure sensors
JP4697232B2 (ja) * 2006-01-11 2011-06-08 株式会社村田製作所 弾性表面波装置の製造方法及び弾性表面波装置
US7898365B2 (en) * 2006-09-06 2011-03-01 Raytheon Company Integrated saw device heater
FR2912839B1 (fr) * 2007-02-16 2009-05-15 Soitec Silicon On Insulator Amelioration de la qualite de l'interface de collage par nettoyage froid et collage a chaud
JP5121493B2 (ja) * 2008-02-21 2013-01-16 セイコーインスツル株式会社 圧電振動子の製造方法
US9232315B2 (en) 2011-03-16 2016-01-05 Phonon Corporation Monolithically applied heating elements on saw substrate
WO2013115115A1 (ja) * 2012-02-03 2013-08-08 株式会社村田製作所 弾性表面波素子及びそれを備えた複合モジュール

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JPH0197006A (ja) * 1987-10-09 1989-04-14 Matsushima Kogyo Co Ltd 圧電振動子とその製造方法
JPH01233821A (ja) * 1988-03-15 1989-09-19 Fujitsu Ltd 弾性表面波デバイス
US4933588A (en) * 1988-12-23 1990-06-12 Raytheon Company Higher order transverse mode suppression in surface acoustic wave resonators
US5095240A (en) * 1989-11-13 1992-03-10 X-Cyte, Inc. Inductively coupled saw device and method for making the same
US5192295A (en) * 1990-06-20 1993-03-09 Danforth Biomedical, Inc. Angioplasty dilatation balloon catheter/guidewire system
US5059848A (en) * 1990-08-20 1991-10-22 The United States Of America As Represented By The Secretary Of The Army Low-cost saw packaging technique
US5218373A (en) * 1990-10-01 1993-06-08 Harris Corporation Hermetically sealed waffle-wall configured assembly including sidewall and cover radiating elements and a base-sealed waveguide window
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JP3134391B2 (ja) * 1991-09-19 2001-02-13 株式会社デンソー シリコン基板の接合方法
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JPH05199056A (ja) * 1992-01-17 1993-08-06 Citizen Watch Co Ltd 圧電振動子の製造方法
US5453652A (en) * 1992-12-17 1995-09-26 Matsushita Electric Industrial Co., Ltd. Surface acoustic wave device with interdigital transducers formed on a holding substrate thereof and a method of producing the same
JPH06350376A (ja) * 1993-01-25 1994-12-22 Matsushita Electric Ind Co Ltd 気密封止された圧電デバイスおよび気密封止パッケージ
DE69413280T2 (de) * 1993-03-15 1999-04-22 Matsushita Electric Ind Co Ltd Akustische Oberflächenwellenanordnung mit laminierter Struktur
US5448126A (en) * 1993-10-05 1995-09-05 Matsushita Electric Industrial Co., Ltd. Surface acoustic wave-semiconductor composite device

Also Published As

Publication number Publication date
DE69426789T2 (de) 2001-08-02
EP0622897B1 (de) 2001-03-07
EP0622897A2 (de) 1994-11-02
US6018211A (en) 2000-01-25
EP0622897A3 (en) 1995-12-13

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee