DE69716866T2 - Beschichtungsstruktur einer Scheibe zum chemisch-mechanischen Polieren und Verfahren - Google Patents
Beschichtungsstruktur einer Scheibe zum chemisch-mechanischen Polieren und VerfahrenInfo
- Publication number
- DE69716866T2 DE69716866T2 DE69716866T DE69716866T DE69716866T2 DE 69716866 T2 DE69716866 T2 DE 69716866T2 DE 69716866 T DE69716866 T DE 69716866T DE 69716866 T DE69716866 T DE 69716866T DE 69716866 T2 DE69716866 T2 DE 69716866T2
- Authority
- DE
- Germany
- Prior art keywords
- coating
- plate
- substrate
- cmp
- platen
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000576 coating method Methods 0.000 title claims description 48
- 239000011248 coating agent Substances 0.000 title claims description 44
- 238000005498 polishing Methods 0.000 title claims description 34
- 239000000126 substance Substances 0.000 title claims description 10
- 238000012545 processing Methods 0.000 title description 7
- 238000000034 method Methods 0.000 claims description 33
- 239000000758 substrate Substances 0.000 claims description 22
- 239000000463 material Substances 0.000 claims description 19
- 239000011148 porous material Substances 0.000 claims description 14
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 claims description 9
- 229910000423 chromium oxide Inorganic materials 0.000 claims description 9
- 229910044991 metal oxide Inorganic materials 0.000 claims description 4
- 150000004706 metal oxides Chemical class 0.000 claims description 4
- 229910052574 oxide ceramic Inorganic materials 0.000 claims description 4
- 239000003870 refractory metal Substances 0.000 claims description 4
- 238000005524 ceramic coating Methods 0.000 claims 2
- 238000010285 flame spraying Methods 0.000 claims 2
- 239000011224 oxide ceramic Substances 0.000 claims 2
- 239000000565 sealant Substances 0.000 claims 2
- 239000002002 slurry Substances 0.000 description 17
- 239000004065 semiconductor Substances 0.000 description 12
- 238000005260 corrosion Methods 0.000 description 11
- 230000007797 corrosion Effects 0.000 description 11
- 229910052782 aluminium Inorganic materials 0.000 description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 10
- 239000010410 layer Substances 0.000 description 10
- 229910001220 stainless steel Inorganic materials 0.000 description 9
- 239000010935 stainless steel Substances 0.000 description 9
- 239000007921 spray Substances 0.000 description 8
- 238000012546 transfer Methods 0.000 description 7
- 238000012360 testing method Methods 0.000 description 6
- 238000007517 polishing process Methods 0.000 description 4
- 238000009966 trimming Methods 0.000 description 4
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 3
- 230000003750 conditioning effect Effects 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000012188 paraffin wax Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 241000233805 Phoenix Species 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000007743 anodising Methods 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000002223 garnet Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000012729 immediate-release (IR) formulation Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000011253 protective coating Substances 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000012958 reprocessing Methods 0.000 description 1
- 230000010512 thermal transition Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/02—Frames; Beds; Carriages
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/04—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the coating material
- C23C4/10—Oxides, borides, carbides, nitrides or silicides; Mixtures thereof
- C23C4/11—Oxides
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Plasma & Fusion (AREA)
- Physics & Mathematics (AREA)
- Coating By Spraying Or Casting (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/755,870 US5743788A (en) | 1996-12-02 | 1996-12-02 | Platen coating structure for chemical mechanical polishing and method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE69716866D1 DE69716866D1 (de) | 2002-12-12 |
| DE69716866T2 true DE69716866T2 (de) | 2003-03-27 |
Family
ID=25041012
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE69716866T Expired - Lifetime DE69716866T2 (de) | 1996-12-02 | 1997-11-12 | Beschichtungsstruktur einer Scheibe zum chemisch-mechanischen Polieren und Verfahren |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US5743788A (enExample) |
| EP (1) | EP0850725B1 (enExample) |
| JP (1) | JPH10156709A (enExample) |
| KR (1) | KR100501961B1 (enExample) |
| CN (1) | CN1161211C (enExample) |
| DE (1) | DE69716866T2 (enExample) |
| TW (1) | TW351835B (enExample) |
Families Citing this family (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5964413A (en) * | 1997-11-05 | 1999-10-12 | Mok; Peter | Apparatus for dispensing slurry |
| JPH11333703A (ja) * | 1998-05-28 | 1999-12-07 | Speedfam-Ipec Co Ltd | ポリッシング加工機 |
| JPH11347921A (ja) * | 1998-06-05 | 1999-12-21 | Memc Kk | シリコンウェーハの研磨方法 |
| US6036586A (en) * | 1998-07-29 | 2000-03-14 | Micron Technology, Inc. | Apparatus and method for reducing removal forces for CMP pads |
| US6220942B1 (en) * | 1999-04-02 | 2001-04-24 | Applied Materials, Inc. | CMP platen with patterned surface |
| US20040053566A1 (en) * | 2001-01-12 | 2004-03-18 | Applied Materials, Inc. | CMP platen with patterned surface |
| FR2791917B1 (fr) * | 1999-04-06 | 2001-06-22 | Prec Machines Outils | Procede de realisation d'une machine a rectifier de precision du type comprenant un bati et machine a rectifier de precision correspondante |
| US6468135B1 (en) | 1999-04-30 | 2002-10-22 | International Business Machines Corporation | Method and apparatus for multiphase chemical mechanical polishing |
| US6363599B1 (en) | 1999-08-04 | 2002-04-02 | Komag, Inc. | Method for manufacturing a magnetic disk including a glass substrate |
| AU7851000A (en) * | 1999-10-08 | 2001-04-23 | Speed-Fam-Ipec Corporation | Optimal offset, pad size and pad shape for cmp buffing and polishing |
| US6793561B2 (en) | 1999-10-14 | 2004-09-21 | International Business Machines Corporation | Removable/disposable platen top |
| US6422921B1 (en) | 1999-10-22 | 2002-07-23 | Applied Materials, Inc. | Heat activated detachable polishing pad |
| US6203417B1 (en) * | 1999-11-05 | 2001-03-20 | Speedfam-Ipec Corporation | Chemical mechanical polishing tool components with improved corrosion resistance |
| US6264536B1 (en) * | 2000-02-01 | 2001-07-24 | Lucent Technologies Inc. | Reducing polish platen corrosion during integrated circuit fabrication |
| US6599175B2 (en) | 2001-08-06 | 2003-07-29 | Speedfam-Ipeca Corporation | Apparatus for distributing a fluid through a polishing pad |
| US7040957B2 (en) * | 2002-08-14 | 2006-05-09 | Novellus Systems Inc. | Platen and manifold for polishing workpieces |
| US6951504B2 (en) * | 2003-03-20 | 2005-10-04 | 3M Innovative Properties Company | Abrasive article with agglomerates and method of use |
| KR100810893B1 (ko) | 2003-12-31 | 2008-03-07 | 동부일렉트로닉스 주식회사 | 씨엠피 장비용 평면 코팅 장치 |
| JP5065574B2 (ja) * | 2005-01-12 | 2012-11-07 | 住友電気工業株式会社 | ＧａＮ基板の研磨方法 |
| CN102380818A (zh) * | 2010-09-01 | 2012-03-21 | 无锡华润上华半导体有限公司 | 化学机械研磨方法和研磨设备 |
| GB201110476D0 (en) * | 2011-06-21 | 2011-08-03 | Spp Process Technology Systems Uk Ltd | A method of supporting a workpiece during physical vapour deposition |
| US9719166B2 (en) | 2011-06-21 | 2017-08-01 | Spts Technologies Limited | Method of supporting a workpiece during physical vapour deposition |
| CN103659576A (zh) * | 2012-09-20 | 2014-03-26 | 苏州赫瑞特电子专用设备科技有限公司 | 一种单面研磨抛光机的研磨抛光盘 |
| CN103276214B (zh) * | 2013-05-30 | 2014-11-19 | 上海交通大学 | 利用电镀废水制备防腐蚀涂层的方法 |
| US11397139B2 (en) * | 2017-02-27 | 2022-07-26 | Leco Corporation | Metallographic grinder and components thereof |
| WO2018175758A1 (en) * | 2017-03-24 | 2018-09-27 | Axus Technology, Llc | Atmospheric plasma in wafer processing system optimization |
| KR102699594B1 (ko) * | 2019-05-31 | 2024-08-28 | 어플라이드 머티어리얼스, 인코포레이티드 | 연마 플래튼들 및 연마 플래튼 제조 방법들 |
| CN115488754B (zh) * | 2022-09-30 | 2024-12-24 | 上海芯物科技有限公司 | Cmp自动贴膜装置及方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5855562A (ja) * | 1981-09-28 | 1983-04-01 | Hitachi Ltd | 研磨皿とその製造方法 |
| GB9010833D0 (en) * | 1990-05-15 | 1990-07-04 | Electrotech Research Limited | Workpiece support |
| EP0756917A4 (en) * | 1994-04-22 | 1997-12-17 | Toshiba Kk | SEPARATE GRINDING SURFACE SUPPORT PLATE AND ASSOCIATED APPARATUS |
| US5558717A (en) * | 1994-11-30 | 1996-09-24 | Applied Materials | CVD Processing chamber |
| US5533923A (en) * | 1995-04-10 | 1996-07-09 | Applied Materials, Inc. | Chemical-mechanical polishing pad providing polishing unformity |
-
1996
- 1996-12-02 US US08/755,870 patent/US5743788A/en not_active Expired - Lifetime
-
1997
- 1997-10-21 TW TW086115533A patent/TW351835B/zh not_active IP Right Cessation
- 1997-11-12 DE DE69716866T patent/DE69716866T2/de not_active Expired - Lifetime
- 1997-11-12 EP EP97119782A patent/EP0850725B1/en not_active Expired - Lifetime
- 1997-11-14 CN CNB971221235A patent/CN1161211C/zh not_active Expired - Fee Related
- 1997-11-27 JP JP34202697A patent/JPH10156709A/ja active Pending
- 1997-12-02 KR KR1019970066581A patent/KR100501961B1/ko not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| KR19980063880A (ko) | 1998-10-07 |
| EP0850725B1 (en) | 2002-11-06 |
| EP0850725A3 (en) | 1999-01-13 |
| EP0850725A2 (en) | 1998-07-01 |
| TW351835B (en) | 1999-02-01 |
| CN1161211C (zh) | 2004-08-11 |
| CN1184019A (zh) | 1998-06-10 |
| JPH10156709A (ja) | 1998-06-16 |
| KR100501961B1 (ko) | 2005-10-06 |
| US5743788A (en) | 1998-04-28 |
| DE69716866D1 (de) | 2002-12-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE69716866T2 (de) | Beschichtungsstruktur einer Scheibe zum chemisch-mechanischen Polieren und Verfahren | |
| DE69219268T2 (de) | Planarisierung eines Halbleitersubstrates | |
| EP0784517B1 (de) | Verfahren und vorrichtung zum feinstreinigen von oberflächen | |
| DE69307796T2 (de) | Verfahren zum Herstellen von dielektrischen Überzügen aus magnetischem Cermet-Material durch Plasma-Sprühen von zusammengesetzten Partikeln | |
| EP0208315B1 (de) | Verfahren zum beidseitigen abtragenden Bearbeiten von scheibenförmigen Werkstücken, insbesondere Halbleiterscheiben | |
| DE3856135T2 (de) | Verfahren zur Oberflächenbehandlung eines Halbleiterplättchens | |
| DE69904709T2 (de) | Elektrostatische klemmvorrichtung zur halterung eines wafers, die eine niedrige partikelverschmutzung aufweist | |
| KR101908615B1 (ko) | 가스 분배판 표면들을 개장하기 위한 방법 및 장치 | |
| DE60001666T3 (de) | Verfahren zur erzeugung eines mit hartmetall beschichteten bauteils | |
| DE3120477A1 (de) | Vorrichtung zum aufspannen und fixieren von halbleiter-plaettchen | |
| DE4105145A1 (de) | Verfahren und vorrichtung zum planar-schleifen der oberflaeche eines dielektrikums, das auf einem halbleiter-substrat aufgebracht ist | |
| KR20130088891A (ko) | 화학 기계적 연마 패드 컨디셔너 및 형성 방법 | |
| EP0857542B1 (de) | Verfahren zur Herstellung einer einseitig beschichteten und mit einem Finish versehenen Halbleiterscheibe | |
| DE69917826T2 (de) | Keramisches Substrat und dessen Polierverfahren | |
| DE3033944A1 (de) | Laeppvorrichtung fuer duenne plaettchen und aufspannvorrichtung fuer dieselben als teil der laeppvorrichtung | |
| US6203417B1 (en) | Chemical mechanical polishing tool components with improved corrosion resistance | |
| DE102006022089A1 (de) | Verfahren zur Herstellung einer Halbleiterscheibe mit einr profilierten Kante | |
| DE69711818T2 (de) | Verfahren und Vorrichtung zum Polieren einer dünnen Platte | |
| DE3824249A1 (de) | Verfahren zur herstellung hochtemperaturbestaendiger kupferbeschichtungen auf anorganischen dielektrika | |
| DE102014220888B4 (de) | Vorrichtung und Verfahren zum doppelseitigen Polieren von scheibenförmigen Werkstücken | |
| DE60129650T2 (de) | Vorrichtung zum Abrichten eines Polierkissens und Verfahren zum Herstellen des Polierkissens | |
| DE69700374T4 (de) | Polierscheibe-Träger und Polierverfahren | |
| JP3440064B2 (ja) | パッドコンディショナの製造方法 | |
| JPH09180389A (ja) | 磁気ヘッドスライダ製造装置及び磁気ヘッドスライダ製造方法 | |
| DE69532458T2 (de) | Polierverfahren |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8364 | No opposition during term of opposition |