JPH09505355A - 電極の持続的自己スパッタリング及び蒸発のために高周波電極自身の蒸気中で放電を発生させる方法及び装置 - Google Patents
電極の持続的自己スパッタリング及び蒸発のために高周波電極自身の蒸気中で放電を発生させる方法及び装置Info
- Publication number
- JPH09505355A JPH09505355A JP7511683A JP51168395A JPH09505355A JP H09505355 A JPH09505355 A JP H09505355A JP 7511683 A JP7511683 A JP 7511683A JP 51168395 A JP51168395 A JP 51168395A JP H09505355 A JPH09505355 A JP H09505355A
- Authority
- JP
- Japan
- Prior art keywords
- hollow
- discharge
- electrode
- high frequency
- sputtering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004544 sputter deposition Methods 0.000 title claims abstract description 49
- 238000001704 evaporation Methods 0.000 title claims abstract description 32
- 230000008020 evaporation Effects 0.000 title claims abstract description 31
- 238000000034 method Methods 0.000 title claims abstract description 28
- 230000002459 sustained effect Effects 0.000 title abstract description 11
- 238000005086 pumping Methods 0.000 claims abstract description 10
- 239000002245 particle Substances 0.000 claims abstract description 4
- 239000000758 substrate Substances 0.000 claims description 11
- 239000000203 mixture Substances 0.000 claims description 4
- 230000005611 electricity Effects 0.000 claims 1
- 239000007789 gas Substances 0.000 description 34
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 10
- 229910052802 copper Inorganic materials 0.000 description 10
- 239000010949 copper Substances 0.000 description 10
- 238000010849 ion bombardment Methods 0.000 description 9
- 239000010936 titanium Substances 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 229910052786 argon Inorganic materials 0.000 description 5
- 239000010408 film Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 150000002500 ions Chemical class 0.000 description 4
- 230000003628 erosive effect Effects 0.000 description 3
- 239000013077 target material Substances 0.000 description 3
- 238000009834 vaporization Methods 0.000 description 3
- 230000008016 vaporization Effects 0.000 description 3
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 229910001431 copper ion Inorganic materials 0.000 description 2
- 239000007772 electrode material Substances 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 239000012495 reaction gas Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/228—Gas flow assisted PVD deposition
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
- H01J37/32596—Hollow cathodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Analytical Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Physical Vapour Deposition (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
- Chemical Vapour Deposition (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Vaporization, Distillation, Condensation, Sublimation, And Cold Traps (AREA)
- Electron Sources, Ion Sources (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1.(a)放電領域中に導入され且つ中空の高周波電極(1)の内部に中空陰極 放電(7)を開始するのに必要な圧力にポンピングされる補助ガスの(5)中で前 記中空の高周波電極(1)によって高周波放電(4)を発生させ、前記中空の高周 波電極(1)の表面のスパッタリング及び蒸着又はスパッタリング若しくは蒸発 を引き起こす工程と、 (b)前記中空の高周波電極(1)への高周波出力(3)を増大させ、前記補助ガ ス(5)の流入を止めて前記放電領域からのガスのポンピングを自己持続的放電 の維持に必要な値に調節した後に前記自己持続的放電を維持する密度まで、高周 波により生じた中空陰極放電(9)中における前記スパッタリング及び蒸発又は スパッタリング若しくは蒸発によって前記中空の高周波電極(1)から放出され る粒子を含む蒸気の密度を高める工程とからなる、高周波電極の持続的自己スパ ッタリング及び蒸発のために高周波電極自身の蒸気中に放電を発生させる方法。 2.前記工程(a)の前記中空の高周波電極(1)が前記補助ガス(5)の入口と して作用することを特徴とする、請求項1に記載の方法。 3.絶縁された真空貫通端子(14)を貫通して前記反応器内(16)に密閉して取 り付けられるとともに端部に中空のターゲット(2)が設けられた少なくとも一 つの中空の高周波電極(1)と、 ガス弁(11)を介して前記ガス容器(10)から前記反応器(16)内の前記中空 のターゲット(2)の中に導入される補助ガス(5)と、 前記反応器(16)をポンピングするために前記反応器(16)と前記真空ポンプ (17)との間に設けられた制御弁(18)と、 前記インピーダンス整合ユニット(13)を介して高周波発生器(12)から前記 高周波電極(1)に供給される高周波出力(3)と、 前記高周波電極(1)と対電極との間で高周波プラズマ(4)を発生させる前記 高周波発生器に接続された対電極(15)と、 前記補助ガス(5)と、前記中空ターゲット(2)の内側部分のスパッタリング 及び蒸発又はスパッタリング若しくは蒸発によって生じた蒸気との混合物中にお いて、前記中空の高周波電極の前記中空ターゲットの内部に前記高周波出力(3 )及び前記ラジオ出力プラズマ(4)によって発生した中空陰極放電(9)とから なることを特徴として 真空ポンプ(17)によってポンピングされる反応器(16)と、インピーダンス 整合ユニット(13)を有する高周波発生器(12)と、ガス容器(10)とからなる 請求項1及び2の方法による電極の持続的自己スパッタリングのために高周波電 極(1)自身の蒸気中に放電を発生させる装置。 4.前記中空陰極放電(4)が、前記中空ターゲット(2)の激しいスパッタリン グ及び蒸発又はスパッタリング若しくは蒸発を引き起こすのに十分な高周波出力 の値で発生し、前記中空陰極放電(9)が前記補助ガス(5)なしで維持され、そ れによって前記ガス弁(11)が 閉じられるとともに前記制御弁(18)によって排気速度が減少することを特徴と する、請求項1乃至3のいずれかに記載の装置。 5.前記中空の高周波電極(1)が管状であり、前記補助ガス(5)が前記中空の 高周波電極(1)を介して前記中空ターゲット(2)の中に導入されることを特徴 とする、請求項1乃至4のいずれかに記載の装置。 6.前記対電極(15)が、前記反応器(16)の壁部又は基板(19)を備えた基板 ホルダーによって与えられることを特徴とする、請求項1乃至5のいずれかに記 載の装置。 7.前記中空ターゲット(2)中の前記中空陰極放電が、磁石又は電磁コイル(2 0)によって生ずる磁場中で発生することを特徴とする、請求項1乃至6のいず れかに記載の装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9303426-2 | 1993-10-18 | ||
SE9303426A SE501888C2 (sv) | 1993-10-18 | 1993-10-18 | En metod och en apparat för generering av en urladdning i egna ångor från en radiofrekvenselektrod för kontinuerlig självförstoftning av elektroden |
PCT/SE1994/000959 WO1995011322A1 (en) | 1993-10-18 | 1994-10-12 | A method and an apparatus for generation of a discharge in own vapors of a radio frequency electrode for sustained self-sputtering and evaporation of the electrode |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH09505355A true JPH09505355A (ja) | 1997-05-27 |
JP3778294B2 JP3778294B2 (ja) | 2006-05-24 |
Family
ID=20391460
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP51168395A Expired - Fee Related JP3778294B2 (ja) | 1993-10-18 | 1994-10-12 | 電極の持続的自己スパッタリング及び蒸発のために高周波電極自身の蒸気中で放電を発生させる方法及び装置 |
Country Status (13)
Country | Link |
---|---|
US (1) | US5716500A (ja) |
EP (1) | EP0726967B1 (ja) |
JP (1) | JP3778294B2 (ja) |
KR (1) | KR100270892B1 (ja) |
AT (1) | ATE224465T1 (ja) |
AU (1) | AU680958B2 (ja) |
BR (1) | BR9407844A (ja) |
CA (1) | CA2174507C (ja) |
DE (1) | DE69431405T2 (ja) |
ES (1) | ES2185670T3 (ja) |
NO (1) | NO313918B1 (ja) |
SE (1) | SE501888C2 (ja) |
WO (1) | WO1995011322A1 (ja) |
Cited By (1)
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CN105722295A (zh) * | 2016-03-11 | 2016-06-29 | 沈阳工业大学 | 一种三阴极等离子喷枪 |
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CN105722295A (zh) * | 2016-03-11 | 2016-06-29 | 沈阳工业大学 | 一种三阴极等离子喷枪 |
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CA2174507A1 (en) | 1995-04-27 |
NO961534D0 (no) | 1996-04-18 |
JP3778294B2 (ja) | 2006-05-24 |
DE69431405T2 (de) | 2003-01-16 |
US5716500A (en) | 1998-02-10 |
SE9303426D0 (sv) | 1993-10-18 |
CA2174507C (en) | 2005-06-21 |
NO313918B1 (no) | 2002-12-23 |
EP0726967B1 (en) | 2002-09-18 |
SE9303426L (sv) | 1995-04-19 |
SE501888C2 (sv) | 1995-06-12 |
AU680958B2 (en) | 1997-08-14 |
ES2185670T3 (es) | 2003-05-01 |
ATE224465T1 (de) | 2002-10-15 |
KR100270892B1 (ko) | 2000-12-01 |
BR9407844A (pt) | 1997-05-13 |
NO961534L (no) | 1996-06-05 |
DE69431405D1 (de) | 2002-10-24 |
EP0726967A1 (en) | 1996-08-21 |
AU8007794A (en) | 1995-05-08 |
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