JPH0946015A5 - - Google Patents

Info

Publication number
JPH0946015A5
JPH0946015A5 JP1996197199A JP19719996A JPH0946015A5 JP H0946015 A5 JPH0946015 A5 JP H0946015A5 JP 1996197199 A JP1996197199 A JP 1996197199A JP 19719996 A JP19719996 A JP 19719996A JP H0946015 A5 JPH0946015 A5 JP H0946015A5
Authority
JP
Japan
Prior art keywords
contact pads
daughterboard
motherboard
daughter board
signal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1996197199A
Other languages
English (en)
Japanese (ja)
Other versions
JP3935529B2 (ja
JPH0946015A (ja
Filing date
Publication date
Priority claimed from US08/508,731 external-priority patent/US5657208A/en
Application filed filed Critical
Publication of JPH0946015A publication Critical patent/JPH0946015A/ja
Publication of JPH0946015A5 publication Critical patent/JPH0946015A5/ja
Application granted granted Critical
Publication of JP3935529B2 publication Critical patent/JP3935529B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP19719996A 1995-07-28 1996-07-26 プリント回路基板 Expired - Fee Related JP3935529B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US508,731 1995-07-28
US08/508,731 US5657208A (en) 1995-07-28 1995-07-28 Surface mount attachments of daughterboards to motherboards

Publications (3)

Publication Number Publication Date
JPH0946015A JPH0946015A (ja) 1997-02-14
JPH0946015A5 true JPH0946015A5 (enExample) 2004-08-12
JP3935529B2 JP3935529B2 (ja) 2007-06-27

Family

ID=24023847

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19719996A Expired - Fee Related JP3935529B2 (ja) 1995-07-28 1996-07-26 プリント回路基板

Country Status (4)

Country Link
US (1) US5657208A (enExample)
JP (1) JP3935529B2 (enExample)
DE (1) DE19627663C2 (enExample)
GB (1) GB2303971B (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11119862A (ja) * 1997-10-09 1999-04-30 Canon Inc プリント配線板ユニット、および電子機器
DE19750306A1 (de) 1997-11-13 1999-05-20 Bosch Gmbh Robert Elektronisches Steuergerät
US6281446B1 (en) 1998-02-16 2001-08-28 Matsushita Electric Industrial Co., Ltd. Multi-layered circuit board and method of manufacturing the same
US6761816B1 (en) * 1998-06-23 2004-07-13 Clinical Micro Systems, Inc. Printed circuit boards with monolayers and capture ligands
US7087148B1 (en) 1998-06-23 2006-08-08 Clinical Micro Sensors, Inc. Binding acceleration techniques for the detection of analytes
US6137693A (en) * 1998-07-31 2000-10-24 Agilent Technologies Inc. High-frequency electronic package with arbitrarily-shaped interconnects and integral shielding
US6942771B1 (en) * 1999-04-21 2005-09-13 Clinical Micro Sensors, Inc. Microfluidic systems in the electrochemical detection of target analytes
US20040053290A1 (en) * 2000-01-11 2004-03-18 Terbrueggen Robert Henry Devices and methods for biochip multiplexing
US20020177135A1 (en) * 1999-07-27 2002-11-28 Doung Hau H. Devices and methods for biochip multiplexing
TW443083B (en) * 1999-06-23 2001-06-23 Asustek Comp Inc Printed circuit board structure
JP2002246704A (ja) * 2001-02-16 2002-08-30 Philips Japan Ltd 電子装置及び回路装置
US6710255B2 (en) * 2001-03-30 2004-03-23 Intel Corporation Printed circuit board having buried intersignal capacitance and method of making
JP4209130B2 (ja) 2002-04-09 2009-01-14 株式会社ザナヴィ・インフォマティクス 多層モジュール基板
CN102231616B (zh) * 2010-01-29 2014-01-08 中山大洋电机制造有限公司 一种电子驱动电机的电机控制器及其控制方法
JP2013055547A (ja) * 2011-09-05 2013-03-21 Alps Electric Co Ltd 高周波モジュールおよびそれを用いた高周波機器
WO2015151292A1 (ja) * 2014-04-04 2015-10-08 三菱電機株式会社 プリント配線板ユニット
US10393908B2 (en) 2016-12-15 2019-08-27 Rockwell Automation Technologies, Inc. Bobbin construction and coil winding method

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59186387A (ja) * 1983-04-07 1984-10-23 松下電器産業株式会社 プリント基板の接合方法
US4553111A (en) * 1983-08-30 1985-11-12 Burroughs Corporation Printed circuit board maximizing areas for component utilization
JPH0397975U (enExample) * 1990-01-24 1991-10-09
JP3167342B2 (ja) * 1991-03-14 2001-05-21 株式会社東芝 送受共用円偏波アンテナ
US5142239A (en) * 1991-05-20 1992-08-25 Motorola, Inc. High frequency linear amplifier assembly
JPH0590826A (ja) * 1991-09-26 1993-04-09 Toshiba Corp マイクロストリツプアンテナ
JPH05175357A (ja) * 1991-12-25 1993-07-13 Casio Comput Co Ltd 多層基板のストリップ線路構造
US5222014A (en) * 1992-03-02 1993-06-22 Motorola, Inc. Three-dimensional multi-chip pad array carrier
JPH06152206A (ja) * 1992-11-10 1994-05-31 Toshiba Corp 無反射終端
US5355283A (en) * 1993-04-14 1994-10-11 Amkor Electronics, Inc. Ball grid array with via interconnection
JPH0710969U (ja) * 1993-07-23 1995-02-14 日本無線株式会社 プリント基板
JP2565127B2 (ja) * 1993-12-13 1996-12-18 日本電気株式会社 ３ｄＢ９０゜ハイブリッド方向性結合器
JP2908225B2 (ja) * 1993-12-24 1999-06-21 日本電気株式会社 高周波チョーク回路
US5477933A (en) * 1994-10-24 1995-12-26 At&T Corp. Electronic device interconnection techniques
US5572405A (en) * 1995-06-07 1996-11-05 International Business Machines Corporation (Ibm) Thermally enhanced ball grid array package

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