JPH10190204A5 - - Google Patents

Info

Publication number
JPH10190204A5
JPH10190204A5 JP1997353253A JP35325397A JPH10190204A5 JP H10190204 A5 JPH10190204 A5 JP H10190204A5 JP 1997353253 A JP1997353253 A JP 1997353253A JP 35325397 A JP35325397 A JP 35325397A JP H10190204 A5 JPH10190204 A5 JP H10190204A5
Authority
JP
Japan
Prior art keywords
pad
transistor
resistor
circuit board
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1997353253A
Other languages
English (en)
Japanese (ja)
Other versions
JPH10190204A (ja
Filing date
Publication date
Priority claimed from US08/771,569 external-priority patent/US5805428A/en
Application filed filed Critical
Publication of JPH10190204A publication Critical patent/JPH10190204A/ja
Publication of JPH10190204A5 publication Critical patent/JPH10190204A5/ja
Pending legal-status Critical Current

Links

JP9353253A 1996-12-20 1997-12-22 トランジスタ／抵抗器用のプリント回路板 Pending JPH10190204A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/771,569 US5805428A (en) 1996-12-20 1996-12-20 Transistor/resistor printed circuit board layout
US771569 2001-01-30

Publications (2)

Publication Number Publication Date
JPH10190204A JPH10190204A (ja) 1998-07-21
JPH10190204A5 true JPH10190204A5 (enExample) 2005-07-14

Family

ID=25092240

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9353253A Pending JPH10190204A (ja) 1996-12-20 1997-12-22 トランジスタ／抵抗器用のプリント回路板

Country Status (3)

Country Link
US (1) US5805428A (enExample)
EP (1) EP0849982A1 (enExample)
JP (1) JPH10190204A (enExample)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6246107B1 (en) 1999-07-07 2001-06-12 Philips Semiconductors, Inc. Semiconductor device arrangement having configuration via adjacent bond pad coding
US6539449B1 (en) * 2000-03-14 2003-03-25 Intel Corporation Capacitively loaded continuity module
US6985365B2 (en) * 2001-09-28 2006-01-10 Hewlett-Packard Development Company, L.P. Topology for flexible and precise signal timing adjustment
US7305509B2 (en) * 2003-03-07 2007-12-04 Dell Products L.P. Method and apparatus for zero stub serial termination capacitor of resistor mounting option in an information handling system
US7245501B2 (en) * 2003-09-09 2007-07-17 Hewlett-Packard Development Company, L.P. Configurable circuit board and fabrication method
US7645940B2 (en) * 2004-02-06 2010-01-12 Solectron Corporation Substrate with via and pad structures
CN100531516C (zh) * 2005-07-22 2009-08-19 鸿富锦精密工业（深圳）有限公司 印刷电路板
TWI264052B (en) * 2005-08-19 2006-10-11 Silicon Integrated Sys Corp A switch on a package substrate for switching functions of circuit and switching method for switching functions of circuit
CN1942051A (zh) * 2005-09-30 2007-04-04 鸿富锦精密工业（深圳）有限公司 印刷电路板的焊盘
CN100544546C (zh) * 2005-10-27 2009-09-23 鸿富锦精密工业（深圳）有限公司 印刷电路板
US9545009B2 (en) * 2007-05-23 2017-01-10 Spectra Logic, Corporation Passive alterable electrical component
CN101460007B (zh) * 2007-12-12 2011-03-23 扬智科技股份有限公司 电路基板
WO2011017552A1 (en) 2009-08-05 2011-02-10 Kovio, Inc. Print compatible designs and layout schemes for printed electronics
ITRN20110030A1 (it) * 2011-04-19 2012-10-20 Indesit Co Spa Dispositivo elettrico
TWI549577B (zh) * 2012-11-22 2016-09-11 鴻海精密工業股份有限公司 光纖連接器電路基板及光纖連接器
TW201503768A (zh) * 2013-07-05 2015-01-16 Phison Electronics Corp 焊墊結構及應用其之印刷電路板與記憶體儲存裝置
US20150223323A1 (en) * 2014-02-05 2015-08-06 Colin Patrick O'Flynn Footprint for Prototyping High Frequency Printed Circuit Boards
US9763333B2 (en) 2015-03-09 2017-09-12 Cooper Technologies Company Shared resistor pad bypass
US10159151B1 (en) * 2017-06-14 2018-12-18 Unimicron Technology Corp. Chip package circuit board module
CN109309269A (zh) * 2017-07-27 2019-02-05 伊姆西Ip控股有限责任公司 热管理系统
KR20220052395A (ko) 2020-10-20 2022-04-28 삼성전자주식회사 집적 회로 및 이를 포함하는 반도체 장치
US12068554B2 (en) 2022-01-28 2024-08-20 Hewlett Packard Enterprise Development Lp Dual-path high-speed interconnect PCB layout solution

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3716761A (en) * 1972-05-03 1973-02-13 Microsystems Int Ltd Universal interconnection structure for microelectronic devices
US4489365A (en) * 1982-09-17 1984-12-18 Burroughs Corporation Universal leadless chip carrier mounting pad
DE3329477A1 (de) * 1982-11-02 1985-03-07 Telefonbau Und Normalzeit Gmbh, 6000 Frankfurt Miniatur-drahtbruecke zum herstellen von verbindungen auf baugruppen
FR2555011B1 (fr) * 1983-11-15 1986-01-24 Thomson Csf Carte imprimee a empreintes
JPS6351709A (ja) * 1986-08-21 1988-03-04 Matsushita Electric Ind Co Ltd 電子回路基板
US5064378A (en) * 1987-08-24 1991-11-12 Zenith Data Systems Corporation Mounting of DRAMs of different sizes and pinouts within limited footprint
US5266747A (en) * 1991-08-30 1993-11-30 Ford Motor Company Minimum footprint reconfigurable input/output circuit
JPH05102648A (ja) * 1991-10-04 1993-04-23 Hitachi Ltd プリント基板
US5303122A (en) * 1991-10-31 1994-04-12 Ford Motor Company Printed circuit board having a commonized mounting pad which different sized surface mounted devices can be mounted
JPH0745935A (ja) * 1993-07-28 1995-02-14 Sony Corp プリント配線基板
JP3396541B2 (ja) * 1993-08-30 2003-04-14 株式会社東芝 混成集積回路装置を搭載した回路基板
US5557505A (en) * 1994-07-22 1996-09-17 Ast Research, Inc. Dual pattern microprocessor package footprint
US5683788A (en) * 1996-01-29 1997-11-04 Dell Usa, L.P. Apparatus for multi-component PCB mounting

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